category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Manufacturing Bits: Sept. 18
By Mark LaPedus - 18 Sep, 2018 - Comments: 0

Flexible nanowires The University of Glasgow has developed a new contact-printing system that prints and embeds silicon nanowires into flexible surfaces. The technology enables new forms of flexible electronics. It can be used to develop low-power circuits in flexible substrates, such as plastic, paper and fabrics. Researchers from the University of Glasgow have developed a new contact-p... » read more

Survey: EUV Optimism Grows
By Mark LaPedus - 17 Sep, 2018 - Comments: 2

The confidence level remains high for extreme ultraviolet (EUV) lithography, although the timing of the insertion remains a moving target, according to a new survey released by the eBeam Initiative. At the same time, the outlook for the overall photomask industry is bullish, according to the survey. On the downside, however, there appears to be no progress in terms of improving mask turnaro... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 Sep, 2018 - Comments: 0

Fab/mask manufacturing An alliance of companies have formed the Center for Deep Learning in Electronics Manufacturing (CDLe). NuFlare, Mycronic and D2S have established the San Jose, Calif.-based center to advance the state-of-the-art in deep learning for its industry-specific applications. Imec.xpand, an early-stage and growth fund that is initiated by Imec, has closed its first fund at 11... » read more

Manufacturing Bits: Sept. 11
By Mark LaPedus - 11 Sep, 2018 - Comments: 0

Microscopy resolution record Cornell University says that it has achieved a world’s record for the highest resolution microscope. Using a scanning transmission electron microscope (STEM) and a new detector, Cornell has demonstrated features of atoms in a two-dimensional semiconductor sheet as small as 0.39 angstroms. In comparison, atoms are about 2 to 4 angstroms in diameter. An angstrom... » read more

Sorting Out Packaging Options
By Ed Sperling - 10 Sep, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with David Butler, executive vice president and general manager of SPTS Technologies; Ingu Yin Chang, senior vice president president at ASE Group; Hubert Karl Lakner, executive director of the Fraunhofer Institute for Photonic Microsystems; Robert Lo, division director for electronics and optoelectronics research at Industrial Te... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 07 Sep, 2018 - Comments: 0

Packaging Brewer Science has introduced the latest additions to its family of temporary bonding materials. The company also rolled out its new line of thin spin-on packaging materials. The company’s temporary bonding materials are called BrewerBOND. The new products, called the BrewerBOND T1100 and BrewerBOND C1300 series, are combine to create a dual-layer system for temporary bonding a... » read more

Manufacturing Bits: Sept. 4
By Mark LaPedus - 04 Sep, 2018 - Comments: 0

Flat diamond chips Kanazawa University and the National Institute of Advanced Industrial Science and Technology (AIST) have developed a process that solves a big issue for diamond semiconductors in power applications. Researchers have developed a water vapor annealing technique that creates atomically flat diamond surfaces. This brings diamond semiconductors one step closer to becoming more... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 31 Aug, 2018 - Comments: 0

Chipmakers GlobalFoundries said that it is putting its 7nm finFET program on hold indefinitely and has dropped plans to pursue technology nodes beyond 7nm. To be sure, it was a tough decision by GF to put 7nm on hold. But generally, analysts believe that GF made the right decision. “There’s only a handful of semiconductor companies that will require high-volume 7nm technology right when... » read more

Manufacturing Bits: Aug. 28
By Mark LaPedus - 28 Aug, 2018 - Comments: 0

Neutron scattering The Department of Energy’s Oak Ridge National Laboratory has reached what the agency says is the world’s highest power level for a neutron source. Oak Ridge has several facilities, including the so-called Spallation Neutron Source (SNS). The SNS is used in a metrology field called neutron scattering. Used in physics, chemistry, biology, and materials science, neutron ... » read more

GF Puts 7nm On Hold
By Mark LaPedus - 27 Aug, 2018 - Comments: 6

GlobalFoundries is putting its 7nm finFET program on hold indefinitely and has dropped plans to pursue technology nodes beyond 7nm. The moves, which mark a major shift in direction for the foundry, involve a headcount reduction of about 5% of its worldwide workforce. At the same time, the company is also moving its ASIC business into a new subsidiary. As a result of GlobalFoundries’ ann... » read more

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