category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Fan-Out Wars Begin
By Mark LaPedus - 05 Feb, 2018 - Comments: 3

Several packaging houses are developing the next wave of high-density fan-out packages for premium smartphones, but perhaps a bigger battle is brewing in the lower density fan-out arena. Amkor, ASE, STATS ChipPAC and others sell traditional low-density fan-out packages, although some new and competitive technologies are beginning to appear in the market. Low-density fan-out, or sometimes cal... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 02 Feb, 2018 - Comments: 0

Fab tools SEMI has announced an urgent call to action to overcome the pressing semiconductor industry challenge of recruiting new talent. In a letter to the CEOs of more than 2,000 global SEMI member companies, Ajit Manocha, SEMI’s president and CEO, called on the executives to act together to attract workers and develop the workforce vital to industry growth. In addition, it is a turbu... » read more

Dawn Of The Data-Centric Era
By Lara Chamness - 31 Jan, 2018 - Comments: 0

A recurring theme of the recent Industry Strategy Symposium (ISS) in Half Moon Bay, California, was how the explosion of new applications such as autonomous vehicles, digital healthcare, quantum computing, and crytocurrency mining are driving the need for more industry-wide collaboration to enable companies to compete in the “Data Centric” era. The resulting digital economy is creating unpr... » read more

Manufacturing Bits: Jan. 30
By Mark LaPedus - 30 Jan, 2018 - Comments: 0

SRC’s new R&D centers The Semiconductor Research Corp. has launched a network of research centers within its recently-announced Joint University Microelectronics Program (JUMP). SRC officially launched the 5-year, $200 million program on Jan. 1. With various research centers, the mission of JUMP is to lay the groundwork that extends the viability of Moore’s Law through 2040. The idea is... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 26 Jan, 2018 - Comments: 0

Chipmakers The IC industry continues to consolidate. For example, Qualcomm has a proposed plan to buy NXP. And then, Broadcom wants to buy Qualcomm. Who is next? In a research note, RBC Capital Markets analyst Mitch Steves said: “According to Bloomberg, Microsemi is exploring a sale and we think logical acquirers could include Skyworks. We continue to view Microsemi as a notable strategic as... » read more

Memory Market: Will History Repeat Itself?
By Joanne Itow - 24 Jan, 2018 - Comments: 0

While updating the Semico Fab Database and capital investment projections for 2018, China's investment in memory capacity sparked a lot of discussion at our weekly Semico roundtable. Will China's investment in memory production capacity be successful, or will it just ruin the party for all memory players? Here are some of the highlights of our discussion. Additional data and insights are includ... » read more

Metal Markets In Flux
By Mark LaPedus - 24 Jan, 2018 - Comments: 0

Markets for critical metals are becoming turbulent, creating shortages and widespread supply chain concerns. Critical metals are the raw elements and materials used in the production of aerospace/defense systems, automobiles, batteries, computers and electronic products. Many critical metals also are scarce, and there is high risk associated with their supply. In a recent report, the Europea... » read more

Manufacturing Bits: Jan. 23
By Mark LaPedus - 23 Jan, 2018 - Comments: 1

Looking inside memristors E-beam inspection is gaining steam. Using this type of technology, the National Institute of Standards and Technology (NIST) has been able to see the inner workings of the memristor. The memristor is a type of ReRAM, which works by changing the resistance of materials. In a memristor, an electric current is applied to a material, changing the resistance of that mat... » read more

Nodes Vs. Nodelets
By Mark LaPedus - 22 Jan, 2018 - Comments: 0

Foundries are flooding the market with new nodes and different process options at existing nodes, spreading confusion and creating a variety of challenges for chipmakers. There are full-node processes, such as 10nm and 7nm, with 5nm and 3nm in R&D. But there also is an increasing number of half-nodes or "node-lets" being introduced, including 12nm, 11nm, 8nm, 6nm and 4nm. Node-lets ar... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 19 Jan, 2018 - Comments: 0

Market research The SEMI Industry Strategy Symposium (ISS) opened with the theme “Smart, Intuitive & Connected: Semiconductor Devices Transforming the World.” Click here for some of the highlights at ISS. Here are more highlights from ISS. Korea is on a spending spree for fab tools. In total, Samsung and SK Hynix are forecast to invest over $20 billion in fab tools worldwide in 2018... » read more

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