category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

5G Is Coming
By Bami Bastani - 18 Jan, 2018 - Comments: 0

When I returned from the holidays, I thought I had entered a time warp. Did I sleep through January and wake up near the end of February? I expected to see the usual deluge of news about the gadgets and gear that will be featured at the upcoming Consumer Electronics Show (CES 2018). Instead, I’ve seen story after story about next-generation 5G mobile networks—typically the stuff of Mobile W... » read more

Moving Toward The Smart Factory In Microelectronics Manufacturing
By Applied Materials - 18 Jan, 2018 - Comments: 0

The era of smart manufacturing, Industry 4.0 and the smart factory promises significant opportunities to reduce cost, boost productivity and improve quality in microelectronics manufacturing. But it also presents the industry with new, unique challenges. Smart manufacturing (SM) is a term “generally applied to a movement in manufacturing practices towards integration up and down the supply... » read more

Manufacturing Bits: Jan. 16
By Mark LaPedus - 16 Jan, 2018 - Comments: 0

Coherent X-ray imaging Russia’s National University of Science and Technology MISIS has developed a non-destructive way to observe the inner structures of photonic crystals. The technology, called ptychographic coherent X-ray imaging, obtains the electron density of colloidal crystals. Ptychography is a lensless, X-ray coherent imaging technique. Others are also working on the techno... » read more

The Next 5 Years Of Chip Technology
By Ed Sperling - 15 Jan, 2018 - Comments: 1

Semiconductor Engineering sat down to discuss the future of scaling, the impact of variation, and the introduction of new materials and technologies, with Rick Gottscho, CTO of [getentity id="22820" comment="Lam Research"]; Mark Dougherty, vice president of advanced module engineering at [getentity id="22819" comment="GlobalFoundries"]; David Shortt, technical fellow at [getentity id="22876" co... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 Jan, 2018 - Comments: 0

Chipmakers Intel and Micron have ended their long-running NAND joint development partnership. The companies will continue to develop NAND, but they will work independently on future generations of 3D NAND. The companies have agreed to complete the development of their third-generation of 3D NAND technology, which will be delivered towards the end of 2018. That is expected to be a 96-layer ... » read more

Manufacturing Bits: Jan. 9
By Mark LaPedus - 09 Jan, 2018 - Comments: 0

Two-photon lithography Lawrence Livermore National Laboratory (LLNL) has extended the capabilities of a high-resolution 3D printing technique called two-photon lithography (TPL). TPL enables the development of 3D-printed objects. LLNL’s technology could enable 3D-printed embedded structures inside the body, such as stents, joint replacements or bone scaffolds. It could also one day be ... » read more

The Future Of AI Is In Materials
By Sundeep Bajikar - 09 Jan, 2018 - Comments: 0

I had the pleasure of hosting an eye-opening presentation and Q&A with Dr. Jeff Welser of IBM at a recent Applied Materials technical event in San Francisco. Dr. Welser is Vice President and Director of IBM Research's Almaden lab in San Jose. He made the case that the future of hardware is AI. At Applied Materials we believe that advanced materials engineering holds the keys to unlocking... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 05 Jan, 2018 - Comments: 0

Chipmakers Semiconductor IP startup eVaderis has demonstrated a design platform through an ultra-low-power microcontroller (MCU) in Beyond Semiconductor’s BA2X product line. The software, system and memory IP developed by eVaderis make Beyond Semiconductor’s new MCU ideally suited for battery-powered applications in IoT and wearable electronics. By incorporating the latest STT-MRAM tec... » read more

Manufacturing Bits: Jan. 2
By Mark LaPedus - 02 Jan, 2018 - Comments: 0

World’s coldest chip Using a network of nuclear refrigerators, the University of Basel and others claim to have set the record for the world’s coldest chip. Researchers have cooled a chip to a temperature lower than 3 millikelvin. A millikelvin is one thousandth of a kelvin. Absolute zero is 0 kelvin or minus 273.15 °C. In the experiment, researchers used a chip that includes a Coulomb... » read more

A New Memory Contender?
By Mark LaPedus - 02 Jan, 2018 - Comments: 1

Momentum is building for a new class of ferroelectric memories that could alter the next-generation memory landscape. Generally, ferroelectrics are associated with a memory type called ferroelectric RAMs (FRAMs). Rolled out by several vendors in the late 1990s, FRAMs are low-power, nonvolatile devices, but they are also limited to niche applications and unable to scale beyond 130nm. While... » read more

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