category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

The Week In Review: Manufacturing
By Mark LaPedus - 29 Dec, 2017 - Comments: 0

Chipmakers Christopher Rolland, an analyst at Susquehanna International, expects to see more merger and acquisition activity in the IC industry heading into 2018. “M&A activity slowed in 2017, but the year is going out with a bang!” Rolland said in a recent research note. Towards the end of 2017, for example, Broadcom made a bid for Qualcomm, while Marvell announced intent to buy Cavium. ... » read more

Reflections On 2017: Manufacturing And Markets
By Brian Bailey - 28 Dec, 2017 - Comments: 0

People love to make predictions, and most of the time they have it easy, but at Semiconductor Engineering, we ask them to look back on the predictions they make each year and to assess how close to the mark they were. To see what they missed and what surprised them. Not everyone accepts our offer to grade themselves, but many have this year. This is the first of two parts that looks at the pred... » read more

How Good Is 95% Accuracy?
By Katherine Derbyshire - 28 Dec, 2017 - Comments: 0

Conventional, deterministic computers don’t make mistakes. They execute a predictable series of computations in response to any given input. The input might be mistaken. The logic behind the operations that are performed might be flawed. But the computer will always do exactly what it has been told to do. When unexpected results occur, they can be attributed to the programmer, the system manu... » read more

Foundry Challenges in 2018
By Mark LaPedus - 27 Dec, 2017 - Comments: 6

The silicon foundry business is expected to see steady growth in 2018, but that growth will come with several challenges. On the leading edge, GlobalFoundries, Intel, Samsung and TSMC are migrating from the 16nm/14nm to the 10nm/7nm logic nodes. Intel already has encountered some difficulties, as the chip giant recently pushed out the volume ramp of its new 10nm process from the second half ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Dec, 2017 - Comments: 0

Chipmakers, LCD suppliers United Microelectronics Corp. (UMC) has announced the availability of the company’s 40nm process platform that incorporates Silicon Storage Technology’s (SST) embedded SuperFlash non-volatile memory. The 40nm SST process features a >20% reduction in eFlash cell size and 20-30% macro area over UMC’s 55nm SST technology. Toshiba Electronic Devices & Storage has s... » read more

What the Experts Think
By Sandra Liu - 20 Dec, 2017 - Comments: 0

Coventor recently sponsored an expert panel discussion at IEDM 2017 to discuss how we might advance the semiconductor industry into the next generation of technology. The panel discussed alternative methods to solve fundamental problems of technology scaling, using advances in semiconductor architectures, patterning, metrology, advanced process control, variation reduction, co-optimization and ... » read more

Manufacturing Bits: Dec. 19
By Mark LaPedus - 19 Dec, 2017 - Comments: 0

Superconducting magnet record The National High Magnetic Field Laboratory (MagLab) has broken another world record for magnets. With a superconducting magnet, MagLab reached a magnetic field of 32 teslas. This is a third stronger than the previous record and more than 3,000 times stronger than a refrigerator magnet, according to MagLab. Tesla, or T, is the measurement of magnetic field ... » read more

Silicon’s Long Game
By Ed Sperling - 18 Dec, 2017 - Comments: 0

The era of all-silicon substrates and copper wires may be coming to an end. Progress in the future increasingly depends on more exotic combinations of materials that are developed for specific applications. But after years of predicting the death of silicon, it appears those predictions may be premature. That's not always obvious, given the growing number of chemical combinations being creat... » read more

What’s Next With Computing?
By Mark LaPedus - 18 Dec, 2017 - Comments: 1

At the recent IEDM conference, Jeff Welser, vice president and lab director at IBM Research Almaden, sat down to discuss artificial intelligence, machine learning, quantum computing and supercomputing with Semiconductor Engineering. Here are excerpts of that conversation. SE: Where is high-end computing going? Welser: We are seeing lots of different systems start to come up. First of all,... » read more

Get Ready For 5G
By Mike Rosa - 18 Dec, 2017 - Comments: 0

The 5G wireless rollout, expected to occur over the next few years, will have a major impact on both the number and types of ICs in end-user devices, and on the base stations and repeaters needed to transmit the higher frequency signals. The 5G standard is expected to deliver 10 Gbps of bandwidth— up to 10X the data rates achievable using the advanced forms of 4G— and sub-5ms latencies. ... » read more

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