category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Making Manufacturing Sustainable For Chips
By Katherine Derbyshire - 28 Sep, 2016 - Comments: 5

There is widespread agreement that fabs and manufacturers in general should operate in a sustainable way, but what exactly does that mean? And what concrete steps can fabs take toward that goal? Once we get past the simplistic “more sustainable is better,” things tend to get pretty fuzzy. Consider the definition of sustainability itself. Corporate responsibility reports and similar docum... » read more

Manufacturing Bits: Sept. 27
By Mark LaPedus - 27 Sep, 2016 - Comments: 0

X-ray movies Leveraging the concepts behind the paradox of Schroedinger’s cat, the Department of Energy’s SLAC National Accelerator Laboratory (SLAC) has made an X-ray movie of the internal workings of a molecule. Specifically, SLAC has taken time-resolved femtosecond x-ray diffraction patterns from a molecular iodine sample. Then, researchers created a movie of intramolecular motion wi... » read more

Think Globally, Act Globally
By Katherine Derbyshire - 26 Sep, 2016 - Comments: 1

For the last several months, I’ve been working on a series of articles about sustainable manufacturing in the semiconductor industry. How can we, as an industry, reduce our environmental footprint? It’s a big topic, and it’s been challenging to find concrete examples of ways fabs can reduce power consumption, water consumption, and greenhouse gas emissions. I’ll address these topics in ... » read more

Smartphone Security: For Your Eyes Only
By Adrienne Downey - 26 Sep, 2016 - Comments: 0

Fans of the Olympics here in the United States were treated to a great Samsung commercial throughout the broadcast. The commercial stars the genius, multi-award-winning actor Christoph Waltz, showing how Americans can multitask with the amazing new Galaxy Note7. Yes, THAT Galaxy Note7. The 90-second long commercial is a delight to watch, but it must have cost Samsung some serious bucks to produ... » read more

Packaging Wars Begin
By Mark LaPedus - 26 Sep, 2016 - Comments: 1

The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] technologies, high-density fan-out packages and others. At one time, the outsourced semiconductor assembly and test ([getkc id="83" comment="OSAT"]) vendors dominated and handled the chip-packaging requirement... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 23 Sep, 2016 - Comments: 0

Fab tools and T&M Applied Materials and the Institute of Microelectronics (IME), a research institute under the Agency for Science, Technology and Research (A*STAR), have announced a five-year extension of their R&D collaboration at the Centre of Excellence in Advanced Packaging in Singapore. The organizations will expand the scope of their R&D collaboration to focus on advancing fan-out wafer... » read more

450mm And Other Emergency Measures
By Ed Sperling - 22 Sep, 2016 - Comments: 0

Talk about boosting wafer sizes from 300mm to 450mm has been creeping back into presentations and discussions at conferences over the past couple months. Earlier this year, discussions focused on panel-level packaging. These are basically similar approaches to the same problem, which is that wafers need to be larger to reap efficiencies out of device scaling. Whether either of these approach... » read more

5 Takeaways From BACUS
By Mark LaPedus - 22 Sep, 2016 - Comments: 0

As usual, the recent SPIE Photomask Technology Conference, sometimes called BACUS, was a busy event. The event, which took place in San Jose, Calif., featured presentations on the usual subjects in the photomask sector. There were presentations on mask writers, inspection, metrology, repair and cleaning. And, of course, the papers included masks based on extreme ultraviolet (EUV) lithography... » read more

Grappling With Manufacturing Data
By Ed Sperling - 22 Sep, 2016 - Comments: 2

As complexity goes up with each new process node, so does the amount of data that is generated, from initial GDSII to photomasks, manufacturing, yield and post-silicon validation. But what happens to that data, and what gets shared, remain a point of contention among companies across the semiconductor ecosystem. The problem is that to speed up the entire design through manufacturing process,... » read more

Will III-V Power Devices Happen?
By Ben Lee - 22 Sep, 2016 - Comments: 0

In a previous blog post, I provided a review of the overall power device market and trends driving changes in device evolution that entail materials innovation. For the industry to make such a shift, the advantages over mature, low-cost silicon technologies must be compelling and something the industry absolutely has to implement. Now I’d like to focus on new materials offering competitive be... » read more

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