category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Inside AI And Deep Learning
By Mark LaPedus - 21 Jan, 2016 - Comments: 0

Semiconductor Engineering sat down to talk with Dave Schubmehl, research director for content analytics, discovery and cognitive systems at International Data Corp. (IDC), a market research firm. Schubmehl’s research covers information access, artificial intelligence, cognitive computing, deep learning, machine learning and other topics. He also addressed neuromorphic technology. What follows... » read more

Obama Delivers Unique State-of-the-Union Speech
By SEMI - 21 Jan, 2016 - Comments: 0

By Jamie Girard On Jan. 12, President Obama delivered his eighth and final State of the Union Address to the nation. The speech is closely watch by many to signal the intent of the commander-in-chief for the coming year, but this time President Obama broke from tradition in focusing grander themes rather that specific programs. While it was decidedly a different approach to the normal laundr... » read more

Tech Talk: Double-Triple Patterning
By Brian Bailey - 21 Jan, 2016 - Comments: 0

Mentor Graphics' David Abercrombie shows the differences and challenges in double patterning versus triple patterning. [youtube vid= e0wZmjBbEf0] » read more

The Future of Package Design Verification: Assembly Design Kits
By Mentor, a Siemens Business - 20 Jan, 2016 - Comments: 0

Chip design companies and package assembly houses have no unified signoff verification process to ensure that an IC package meets manufacturability and performance requirements. Packages need a process that confirms the disparate products they contain can be manufactured within a single package. Mentor Graphics collaborated with Qualcomm and STATS ChipPAC to develop a prototype assembly design ... » read more

Will 5nm Happen?
By Mark LaPedus - 20 Jan, 2016 - Comments: 7

Chipmakers are ramping up their 16/14nm finFET processes, with 10nm finFETs expected to ship sometime in late 2016 or early 2017. So what’s next? The foundries can see a path to extend the finFET transistor to 7nm, but the next node, 5nm, is far from certain and may never happen. Indeed, there are several technical and economic challenges at 5nm. And even if 5nm happens, only a few compani... » read more

Manufacturing Bits: Jan. 19
By Mark LaPedus - 19 Jan, 2016 - Comments: 0

Bubble-pen lithography The University of Texas at Austin has developed a new nano-patterning technology--bubble-pen lithography. Researchers have devised a bubble-pen that enables optically-controlled microbubbles. The bubbles are used to pattern structures onto a surface at tiny dimensions. Bubble-pen lithography could be used in microelectronics, nanophotonics, and nanomedicine. In si... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 15 Jan, 2016 - Comments: 0

Savioke is creating autonomous robot helpers for the services industry, including hotels. The company has raised $15 million in Series A financing from lead investor Intel Capital, along with EDBI, the corporate investment arm of the Singapore Economic Development Board, and Northern Light Venture Capital. Savioke will use the funding to expand sales, marketing and product developments for its ... » read more

Manufacturing Bits: Jan. 12
By Mark LaPedus - 12 Jan, 2016 - Comments: 0

World’s smallest magnet The University of Tokyo has developed what researchers claim is the world's smallest nano-magnet. The nano-size ferrite magnet consists of iron oxide. With the material, researches devised a 7.5nm structure with magnetic properties. [caption id="attachment_24751" align="alignleft" width="300"] Charting the world's smallest magnet (Source: Shin-ichi Ohkoshi)[/ca... » read more

Equipment Sales Were Mixed Bag In 2015
By Ed Sperling - 11 Jan, 2016 - Comments: 0

Semiconductor equipment billings were up in Q3 of 2015, the most recent statistics available from SEMI, compared with Q3 of 2014. The strongest growth was reported in China, which grew 63%, and Taiwan, which was up 22%. Billings in North America were down 23%, while in Korea they were down 22%. Europe was down 36%. Japan was up 2%, which is consistent with the growth seen in recent EDA C... » read more

Executive Insight: Sehat Sutardja
By Ed Sperling - 11 Jan, 2016 - Comments: 1

Sehat Sutardja, chairman and CEO of Marvell, sat down with Semiconductor Engineering to talk about new approaches for design and memory and why costs and time to market are forcing changes in Moore's Law. What follows are excerpts of that conversation. SE: What was behind your move into modular packaging? Sutardja: The cost of building chips is getting out of hand. As we make things more ... » read more

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