Manufacturing Bits: June 15


Next-gen RF signal processors Sandia National Laboratories has taken steps to realize the development of acoustic wave amplifiers, a technology that could one day pave the way towards long-awaited tiny RF signal processors. Researchers have developed piezoelectric acoustic devices using surface acoustic wave (SAW) technology and demonstrated the ability to manufacture these devices. Still i... » read more

Week In Review: Manufacturing, Test


Chipmakers SiFive has received a takeover offer from Intel, according to a report from Bloomberg. The asking price is more than $2 billion. ------------------------------------------------------------------ IBM has filed suit against GlobalFoundries (GF), alleging fraud and breach of contract committed by GF. IBM’s suit, filed in the Supreme Court of the state of New York, seeks relief... » read more

Revenue Soars For Semiconductor Equipment Power Subsystems


Sales of process power and reactive gas subsystems for semiconductor manufacturing equipment are on track to achieve a compound annual growth rate (CAGR) of 23% between 2016 and 2021 – far outpacing the critical subsystems industry average of 16.4% due to multiple positive factors. Process power and reactive gas subsystems account for approximately 13% of all expenditures on critical subsy... » read more

Manufacturing Bits: June 7


High-voltage superjunction SiC devices The University of Warwick and Cambridge Microelectronics have presented a paper on the latest effort to develop of a new type silicon carbide (SiC) power device called a SiC superjunction Schottky diode. Researchers have simulated and optimized the development of 4H-SiC superjunction Schottky diodes at a voltage class of 1700 volts, aiming for breakdow... » read more

Week In Review: Manufacturing, Test


Government policy The Malaysian government has extended its lockdown due to the pandemic until June 14, a move that may impact the global electronics supply chain, according to TrendForce. Malaysia recently implemented MCO 3.0 (Movement Control Order), the nation’s pandemic control measure. Malaysia is home to many fab equipment, packaging and testing facilities, as well as passive compon... » read more

Manufacturing Bits: June 1


Frozen finFETs The Defense Advanced Research Projects Agency (DARPA) has launched the Low Temperature Logic Technology (LTLT) program, an effort to develop finFETs that operate at temperatures close to liquid nitrogen (~77K or minus 321 degrees Fahrenheit). The goal of LTLT is to develop low-temperature finFET transistors at the 14nm node and below by making modifications to the manufacturi... » read more

How Will The Adoption Of Curvilinear Masks Affect Turnaround Time?


Turnaround time (TAT) for photomask makers has historically increased at smaller and smaller process nodes, as reported in the eBeam Initiative Mask Makers surveys, so it’s important to look at the impact of curvilinear masks on TAT. In this sixth installment of our blog series on curvilinear masks, Aki Fujimura of D2S explores this question with luminaries in the industry during a video pane... » read more

Week In Review: Manufacturing, Test


Government policy The U.S. government hopes to build more fabs and expand its R&D efforts in the United States. To help enable those efforts, U.S. Senate Majority Leader Charles Schumer has introduced the new bipartisan U.S. Innovation and Competition Act. This combines Schumer’s Endless Frontier Act and other bipartisan competitiveness bills. It includes $52 billion in emergency supplem... » read more

Principles, Applications, And The Future Of Piezoelectric MEMS


Piezoelectricity is a property of certain materials to become electrically polarized under strain and stress. This phenomenon has been studied extensively since it was first discovered in the mid-18th century. Piezoelectric materials can generate an electric charge in response to an applied mechanical stress and can also generate mechanical stress upon an applied electrical charge. These mater... » read more

Manufacturing Bits: May 25


Higher voltage GaN Imec and Aixtron have demonstrated the ability to extend gallium-nitride (GaN) to new voltage levels in the power semiconductor market, enabling the technology to compete in much broader segments. Imec and Aixtron have demonstrated epitaxial growth of GaN buffer layers qualified for 1,200-volt applications on specialized 200mm substrates with a hard breakdown exceeding 1,... » read more

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