category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

How Extensively Will Curvilinear ILT Be Used For EUV Photomasks?
By Jan Willis - 29 Apr, 2021 - Comments: 0

Curvilinear shapes on photomasks lead to improved process windows, as the first installment of this blog series discussed. Our blog series continues with a video panel discussion of the benefits that curvilinear shapes have for EUV photomasks (masks) and whether curvilinear shapes will be used beyond today’s usage for hotspots. Our panellists approached the question of curvilinear ILT for ... » read more

Manufacturing Bits: April 27
By Mark LaPedus - 27 Apr, 2021 - Comments: 0

Next-gen neuromorphic computing The European Union (EU) has launched a new project to develop next-generation devices for neuromorphic computing systems. The project, called MeM-Scales, plans to develop a novel class of algorithms, devices, and circuits that reproduce multi-timescale processing of biological neural systems. The results will be used to build neuromorphic computing systems th... » read more

Improving Your Understanding Of Advanced Inertial MEMS Design
By Chris Welham - 27 Apr, 2021 - Comments: 0

Micro-electrical-mechanical systems (MEMS) based inertial sensors are used measure acceleration and rotation rate. These sensors are integrated into units to measure motion, direction, acceleration or position, and can be found in a wide range of applications including smart phones, consumer electronics, medical devices, transportation systems, oil/gas exploration, military, aeronautical and sp... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 23 Apr, 2021 - Comments: 0

Chipmakers and OEMs Several foundry vendors are building new fabs. The memory vendors, such as Samsung and SK Hynix, are also building new capacity. In another example, Taiwan DRAM supplier Nanya Technology plans to construct a new 300mm fab in the Taishan Nanlin Technology Park in New Taipei City. The plant will produce DRAMs with Nanya’s in-house developed 10nm-class process technologies a... » read more

Manufacturing Bits: April 20
By Mark LaPedus - 20 Apr, 2021 - Comments: 0

SiC power semi R&D Earth Day, which supports environmental protection, takes place this week on April 22. Technology plays a big role in the environment. Governments, companies, R&D organizations and universities are developing a multitude of environmental-related technologies. In just one example, Swansea University has been awarded £4.8 million from the government of the Unite... » read more

Foundry Wars Begin
By Mark LaPedus - 19 Apr, 2021 - Comments: 3

Leading-edge foundry vendors are gearing up for a new, high-stakes spending and technology race, setting the stage for a possible shakeup across the semiconductor manufacturing landscape. In March, Intel re-entered the foundry business, positioning itself against Samsung and TSMC at the leading edge, and against a multitude of foundries working at older nodes. Intel announced plans to build ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 16 Apr, 2021 - Comments: 0

Chipmakers TSMC has posted strong results and raised its capital spending budget to $30 billion, up from its prior guidance of $25 billion to $28 billion in 2021. “Its outlook indicates broad-based semiconductor demand continues to strengthen amid supply chain tightness,” said Weston Twigg, an analyst at KeyBanc, in a research note. “TSMC posted another quarter of strong demand for leadi... » read more

The Quest For Curvilinear Photomasks
By Mark LaPedus - 15 Apr, 2021 - Comments: 1

The semiconductor industry is making noticeable progress on the development of advanced curvilinear photomasks, a technology that has broad implications for chip designs at the most advanced nodes and the ability to manufacture those chips faster and cheaper. The question now is when will this technology move beyond its niche-oriented status and ramp up into high-volume manufacturing. For ye... » read more

Latest IC Forecast: Big Demand, Shortages
By Mark LaPedus - 15 Apr, 2021 - Comments: 1

Over the last year, the semiconductor industry has seen its share of highs, lows and uncertainties. In early 2020, the business looked bright, but the IC market dropped amid the Covid-19 pandemic outbreak. Throughout 2020 different countries implemented a number of measures to mitigate the outbreak, such as stay-at-home orders and business closures. Economic turmoil and job losses soon follo... » read more

Will An Adhesion Promoter Prevent Delamination?
By Sophie Olson - 15 Apr, 2021 - Comments: 0

Power semiconductor packages are used in high temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid electric vehicles (HEV) in the automotive market, demands on (and for) power packages have been growing. Packages for automotive applications must pass extensive testing for safety, therefore, packaging reliability is essential. As more semiconductor pack... » read more

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