category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Manufacturing Bits: Feb. 8
By Mark LaPedus - 08 Feb, 2021 - Comments: 0

Metalens for AR/VR The Harvard John A. Paulson School of Engineering and Applied Sciences has developed a new lens technology for use in next-generation virtual and augmented reality systems. Researchers have developed a so-called metalens technology. The two-millimeter achromatic metalens is capable of focusing the RGB (red, green, blue) colors at once without any aberrations. Today, s... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 05 Feb, 2021 - Comments: 0

OEMs and chipmakers In recent times, automotive companies have been impacted by chip shortages, forcing vendors to temporarily shutter their plants. OEMs are experiencing manufacturing disruptions due to semiconductor shortages as some semiconductor foundries allocate production, according to IDC. "Semiconductor content growth in vehicles continues to outpace vehicle unit sales growth, with gr... » read more

Manufacturing Bits: Feb. 2
By Mark LaPedus - 02 Feb, 2021 - Comments: 0

Capacitor-less DRAM At the recent 2020 International Electron Devices Meeting (IEDM), Imec presented a paper on a novel capacitor-less DRAM cell architecture. DRAM is used for main memory in systems, and today’s most advanced devices are based on roughly 18nm to 15nm processes. The physical limit for DRAM is somewhere around 10nm. DRAM itself is based on a one-transistor, one-capacito... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 29 Jan, 2021 - Comments: 0

Packaging and test Intel has invested an additional $475 million in its chip assembly and test manufacturing facility in the Saigon Hi-Tech Park (SHTP) in Vietnam. This takes Intel’s total investment in the Vietnam facility to $1.5 billion. The site assembles and tests Intel’s 5G products and processors. TSMC recently announced a huge increase in capital spending for 2021. A large perce... » read more

The Good, Bad And Unknowns Of Flexible Devices
By Ed Sperling - 27 Jan, 2021 - Comments: 0

Flexible hybrid electronics are beginning to proliferate in consumer, medical, and industrial applications due to their comparatively low weight, thin profile, and the ability to literally bend the rules of design. Open any smart phone today and you're likely to find one or more of these flexible boards. Unlike standard printed circuit boards, FHE devices are printed using a combination of r... » read more

Manufacturing Bits: Jan. 26
By Mark LaPedus - 26 Jan, 2021 - Comments: 1

EU FIB project The European Union (EU) has launched a new project to develop next-generation structures and materials using focused ion beam (FIB) systems. The EU project, dubbed Focused Ion Technology for Nanomaterials or FIT4NANO, is spearheaded by the Helmholtz-Zentrum Dresden-Rossendorf (HZDR) organization. The project aims to bring European researchers and companies together to develop... » read more

New Transistor Structures At 3nm/2nm
By Mark LaPedus - 25 Jan, 2021 - Comments: 12

Several foundries continue to develop new processes based on next-generation gate-all-around transistors, including more advanced high-mobility versions, but bringing these technologies into production is going to be difficult and expensive. Intel, Samsung, TSMC and others are laying the groundwork for the transition from today’s finFET transistors to new gate-all-around field-effect trans... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 Jan, 2021 - Comments: 0

Chipmakers Intel posted its quarterly results. But the big question is whether the chip giant will outsource more of its production to the foundries. As reported, Intel has fallen behind TSMC and Samsung in process technology. And Intel may need to outsource some of its chip production to stay ahead. All of this rests on Pat Gelsinger, the new CEO at Intel. Gelsinger will be taking over for... » read more

Fearless Chip Forecasts For 2021
By Mark LaPedus - 21 Jan, 2021 - Comments: 0

It’s been a roller coaster ride in the semiconductor industry. In early 2020, the semiconductor business looked bright, but then the Covid-19 pandemic struck, causing a sudden downturn. By mid-2020, though, the market bounced back, as the stay-at-home economy drove demand for computers, tablets and TVs. The chip market ended on a high note in 2020, but the question is, what’s in store fo... » read more

A Look Inside ADAS Modules
By Prasad Dhond - 21 Jan, 2021 - Comments: 0

You glance down at your phone while rolling in slow-moving traffic. Against your better judgment, you proceed to read your latest email, oblivious to the fact that the car in front of you has braked. In the nick of time, your car starts beeping and flashing. You look up and slam the brakes. Whew! That was close. If this has happened to you, don't forget to thank the radar and camera modules in ... » read more

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