category: News

category: IoT, Security & Automotive

Blog Review: March 15
By Jesse Allen - 15 Mar, 2023 - Comments: 0

Siemens EDA's Dan Yu finds that high-quality, well-connected mass data are crucial to the success of applying machine learning to verification and recommends teams pivot to a data-centric workflow. Synopsys' Shankar Krishnamoorthy suggests that deploying AI-driven chip design and verification can free teams from iterative work, letting them focus instead on product differentiation and PPA en... » read more

Week In Review: Manufacturing, Test
By Gregory Haley - 10 Mar, 2023 - Comments: 0

Global semiconductor sales decreased 5.2% month-to-month in January, according to a new report by the Semiconductor Industry Association (SIA). For the year, worldwide chip sales are down 18.5%, with the largest drop in sales by China at 31.6%, followed by the Asia Pacific region at 19.5%, and the Americas at 12.4%. Despite the contraction, companies are increasing investments in manufacturi... » read more

Week In Review: Auto, Security, Pervasive Computing
By Linda Christensen - 10 Mar, 2023 - Comments: 0

Rambus will begin selling Arm's CryptoCell embedded security platform and CryptoIsland root-of-trust cores, setting the stage for a much broader push by Rambus into security for a wide range of connected devices, and ultimately into security as a service. Under the terms of the deal, Rambus' customers will be able to license Arm IP directly from Rambus. For Arm's existing customers, there will ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 10 Mar, 2023 - Comments: 0

Arm is expected to list solely on a U.S. stock exchange when it goes public again later this year, forgoing the London Stock Exchange for now, the BBC reports. Global investment banks expect the offering to value the company between $30 billion and $70 billion, according to Bloomberg. Disaggregating chips into specialized processors, memories, and architectures is becoming necessary for cont... » read more

Blog Review: March 8
By Jesse Allen - 08 Mar, 2023 - Comments: 0

Synopsys' Rahul Thukral and Bhavana Chaurasia find that embedded MRAM is undergoing an uplift in utilization for low-power, advanced-node SoCs thanks to its high capacity, high density, and ability to scale to lower geometries. Siemens EDA's Chris Spear dives into the UVM Factory with a look at the  SystemVerilog Object-Oriented Programming concepts behind the factory. Cadence's Veena Pa... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 03 Mar, 2023 - Comments: 0

Semiconductor Research Corporation (SRC) released an interim roadmap for Microelectronic and Advanced Packaging Technologies (MPAT) that targets 10- to 15-year goals for 3D integration and multi-chiplet packaging. The roadmap is open for comments. Participants in the MPAT include AMD, IBM, Intel, Texas Instruments, Purdue University, SUNY Binghamton and the Georgia Institute of Technology. It i... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 03 Mar, 2023 - Comments: 0

Security The Biden administration released a National Cybersecurity Strategy report this week, calling on the tech community to shoulder much more responsibility, placing "responsibility on those within our digital ecosystem that are best positioned to reduce risk and shift the consequences of poor cybersecurity away from the most vulnerable in order to make our digital ecosystem more trustwor... » read more

Week In Review: Design, Low Power
By Jesse Allen - 03 Mar, 2023 - Comments: 0

Apple plans to spend an additional €1 billion (~$1.1B) over the next six years to expand its Munich, Germany-based Silicon Design Centre, including the construction of a new research facility. "The expansion of our European Silicon Design Centre will enable an even closer collaboration between our more than 2,000 engineers in Bavaria working on breakthrough innovations, including custom sil... » read more

Blog Review: March 1
By Jesse Allen - 01 Mar, 2023 - Comments: 0

Siemens EDA's Chris Spear explains the UVM Factory and how it can facilitate collaboration by enabling injection of new features without affecting your team. Cadence's Paul McLellan looks at efforts to ensure chiplets from different companies work together, particularly when the creating companies didn't pre-plan for those specific chiplets to work together, as well as the problems of failur... » read more

U.S. Opens Funding Applications Under CHIPS Act
By Linda Christensen - 28 Feb, 2023 - Comments: 0

The 2022 Chips and Science Act provided $39 billion in federal funding to revitalize the U.S. semiconductor industry. Now, the U.S. Department of Commerce, the oversight branch for the CHIPS Act, has taken the first step in opening up applications for this funding. This initial funding opportunity focuses on applications specifically for projects to “construct, expand, or modernize commerc... » read more

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