Week In Review: Design, Low Power


Qualcomm, NXP, Infineon, Nordic, and Bosch are jointly investing in a new RISC-V company, to be formed in Germany, that will speed up RISC-V’s adoption in commercial products. The company will be “a single source to enable compatible RISC-V based products, provide reference architectures, and help establish solutions widely used in the industry,” according to a press release. The co... » read more

Blog Review: Aug. 2


Siemens' Katie Tormala points to the need for die attach thermal testing to ensure efficient removal of heat dissipation from power electronics components to prevent premature failure or thermal runaway. Synopsys's Dermott Lynch notes that over 30% of semiconductor failures are attributed to electrostatic discharge, with damage ranging from leakages and shorts to junction and metallization b... » read more

Week In Review: Auto, Security, Pervasive Computing


BMW, General Motors, Honda, Hyundai, Kia, Mercedes-Benz, and Stellantis will create an electric vehicle charging network, installing more than 30,000 high-powered DC charge points accessible to any cars that use Combined Charging System (CCS) or North American Charging Standard (NACS) connectors. Opening summer 2024, the network will leverage Plug & Charge technology and allow easy digital ... » read more

Week In Review: Manufacturing, Test


The Chinese government is considering easing proposed rules that require foreign office equipment makers operating in the country to transfer key product technology to China, per Nikkei Asia. In April 2022, Chinese authorities began revamping their national standards to include a new requirement that key components, such as semiconductors and laser-related items, be designed, developed, and pro... » read more

Week In Review: Design, Low Power


Arm is helping to address the ongoing talent shortage through its newly announced Semiconductor Education Alliance, with a long list of partners, including Arduino, Cadence, Cornell University, Semiconductor Research Corp., STMicroelectronics,Synopsys, Taiwan Semiconductor Research Institute, the All-India Council for Technical Education, and the University of Southampton. The Alliance... » read more

Blog Review: July 26


Siemens' Chris Spear shows how to make a group of specialized classes in SystemVerilog. Synopsys' Guy Cortez and Randy Fish consider what a silicon lifecycle management strategy looks like for SoCs deployed in HPC and data center environments. Cadence's Veena Parthan provides a primer on writing Python scripts for Fidelity, including API descriptions and different sets of packages to acce... » read more

Week In Review: Auto, Security, Pervasive Computing


The Biden-Harris Administration announced the U.S. Cyber Trust Mark, a cybersecurity certification and labeling program to help consumers choose smart devices less vulnerable to cyberattacks. The Federal Communications Commission (FCC) is applying to register the Cyber Trust Mark with the U.S. Patent and Trademark Office and it would appear on qualifying smart products, including refrigerators,... » read more

Week In Review: Semiconductor Manufacturing, Test


TSMC is delaying construction on its $40 billion fab in Arizona due to a shortage of U.S. semiconductor workers and higher-than-expected expenses, Bloomberg reported. The Semiconductor Industry Association (SIA) urged the U.S. government to refrain from further restrictions on semiconductor technology to China “until it engages more extensively with industry and experts to assess the impac... » read more

Week In Review: Design, Low Power


Cadence will acquire Rambus' SerDes and memory interface PHY IP business. Rambus will retain its digital IP business, including memory and interface controllers and security IP. “With this transaction, we will increase our focus on market-leading digital IP and chips and expand our roadmap of novel memory solutions to support the continued evolution of the data center and AI,” said Sean Fan... » read more

Blog Review: July 19


Siemens' Keith Felton argues that co-design-driven semiconductor package planning and prototyping is critical for design success and points to how interchange formats enable designers to make trade-off decisions for both the package and the board and communicate those recommendations back to the other design team in formats that are native to their tools. Cadence's Xin Mu explains precoding ... » read more

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