category: Research: LPHP

category: IoT, Security & Automotive

Research Bits: Jan. 3
By Jesse Allen - 03 Jan, 2023 - Comments: 0

Printing electronics on curved surfaces Researchers from North Carolina State University have demonstrated a new technique for directly printing electronic circuits onto curved and corrugated surfaces. They have used the technique to create prototype “smart” contact lenses, pressure-sensitive latex gloves, and transparent electrodes. “There are many existing techniques for creating pr... » read more

Chip Industry’s Technical Paper Roundup: Dec. 20
By Linda Christensen - 20 Dec, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=71 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us po... » read more

Research Bits: Dec. 13
By Jesse Allen - 13 Dec, 2022 - Comments: 0

Electronic-photonic interface for data centers Engineers at Caltech and the University of Southampton integrated an electronic and photonic chip for high-speed communication in data centers. "There are more than 2,700 data centers in the U.S. and more than 8,000 worldwide, with towers of servers stacked on top of each other to manage the load of thousands of terabytes of data going in and o... » read more

Chip Industry’s Technical Paper Roundup: Dec. 13
By Linda Christensen - 13 Dec, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week.[table id=70 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us po... » read more

Chip Industry’s Technical Paper Roundup: Dec. 5
By Linda Christensen - 05 Dec, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=67 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for u... » read more

Research Bits: Dec. 5
By Jesse Allen - 05 Dec, 2022 - Comments: 0

Protonic programmable resistors for AI Researchers from the Massachusetts Institute of Technology (MIT) developed an analog deep learning processor based on protonic programmable resistors arranged in an array. In the processor, increasing and decreasing the electrical conductance of protonic resistors enables analog machine learning. The conductance is controlled by the movement of protons... » read more

Chip Industry’s Technical Paper Roundup: Nov. 29
By Linda Christensen - 29 Nov, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=66 /]   Related Reading: Chip Industry’s Technical Paper Roundup: Nov. 21 New papers: lithography modeling; solving Rowhammer; energy-efficient batch normalization HW; 3-to-1 reconfigurable analog signal modulation circuit; lateral double magnetic tunnel junction; reduce branch mispredic... » read more

Research Bits: Nov. 21
By Jesse Allen - 21 Nov, 2022 - Comments: 0

Graphene heater for phase-change switches Researchers from the University of Washington, Stanford University, Charles Stark Draper Laboratory, University of Maryland, and Massachusetts Institute of Technology designed an energy-efficient, silicon-based non-volatile switch that manipulates light through the use of a phase-change material and graphene heater. Aiming to reduce the power consum... » read more

Chip Industry’s Technical Paper Roundup: Nov. 21
By Linda Christensen - 21 Nov, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=65 /] » read more

Research Bits: Nov. 15
By Jesse Allen - 15 Nov, 2022 - Comments: 0

Low temperature 3D bonding Scientists from Osaka University developed a new method for the direct three-dimensional bonding of copper electrodes using silver layers. The method works at low temperatures and does not require external pressure. "Our process can be performed under gentle conditions, at relatively low temperatures and without added pressure, but the bonds were able to withstand... » read more

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