Technical Paper Round-Up: April 19


New technical papers include selective etching, ISO 26262 test bench, hardware accelerators, RISC-V, lidar, EUV mask inspection, fault attacks, edge computing, gallium oxide, and machine learning for VLSI CAD-on-chip power grid design. Cutting-edge research is now a global effort. It extends from the U.S. Air Force, to schools such as MIT, and universities in Italy, Spain, Portugal, India, K... » read more

Research Bits: April 19


Processor power prediction Researchers from Duke University, Arm Research, and Texas A&M University developed an AI method for predicting the power consumption of a processor, returning results more than a trillion times per second while consuming very little power itself. “This is an intensively studied problem that has traditionally relied on extra circuitry to address,” said Zhiy... » read more

Research Bits: April 13


Washable battery Researchers from the University of British Columbia developed a washable, flexible, and stretchable battery. “Wearable electronics are a big market and stretchable batteries are essential to their development,” said Dr. Ngoc Tan Nguyen, a postdoctoral fellow at UBC’s faculty of applied science. “However, up until now, stretchable batteries have not been washable. Th... » read more

Academic Research Paper Round-Up: April 13


The volume of research into advanced semiconductors is rising and widening. The latest batch includes hybrid power-gating architecture, RRAM devices models, improved FMEA, quantum machine learning, enhanced nonlinear optics, harvesting energy after sundown, direct chemisorption-assisted nanotransfer printing, and more. Topping the list of researchers this week are ETH Zurich, Stanford Unive... » read more

Research Bits: April 5


Creating qubits in bulk Researchers from Intel and QuTech, an institute of the Delft University of Technology and the Netherlands Organisation for Applied Scientific Research (TNO), built a qubit using standard semiconductor manufacturing facilities. The qubit is based on the spin of single electrons that are captured in a silicon nanoscale device, which resembles conventional transistors. ... » read more

Technical Paper Round-Up: April 5


Neuromorphic chips, transistor defect detection, quantum, pellicles, BEV mobile charging, copper wire bonding, LrWPAN, batteries and superconductivity top the past week's technical papers. They also point to a rising level of government investment, and collaborations between schools that historically haven't worked closely together, including one that involves schools on different continents. ... » read more

Research Bits: March 29


Brain-like AI chip Researchers from Purdue University, Santa Clara University, Portland State University, Pennsylvania State University, Argonne National Laboratory, University of Illinois Chicago, Brookhaven National Laboratory, and University of Georgia built a reprogrammable chip that could be used as the basis for brain-like AI hardware. “The brains of living beings can continuously l... » read more

Technical Paper Round-Up: March 29


Improving batteries, ultra low-power photonic edge computing, SLAM, Tellurium for 2D semiconductors, and reservoir computing top the past week's technical papers. The focus on energy is critical as the edge buildout continues and more devices are connected to a battery, while research into new architectures and materials that will continue scaling and improve performance per watt continue at th... » read more

Research Bits: March 22


Securing wireless communications without encryption Researchers from Princeton University, University of Michigan–Shanghai Jiao Tong University Joint Institute, and Xi’an Jiaotong University developed a millimeter-wave wireless chip that allows secure wireless transmissions and makes it challenging to eavesdrop on high-frequency wireless transmissions, even with multiple colluding bad acto... » read more

Technical Paper Round-Up: March 22


New memories, materials, and transistor types, and processes for making those devices, highlighted the past week's technical papers. That includes everything from vertical MoS2 to programmable black phosphorus image sensors and photonic lift-off processes for flexible thin-film materials. Papers continue to flow from all parts of the supply chain, with some new studies out of Pakistan, Seoul... » read more

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