Chip Industry’s Technical Paper Roundup: Nov. 21


New technical papers added to Semiconductor Engineering’s library this week. [table id=65 /] » read more

Research Bits: Nov. 15


Low temperature 3D bonding Scientists from Osaka University developed a new method for the direct three-dimensional bonding of copper electrodes using silver layers. The method works at low temperatures and does not require external pressure. "Our process can be performed under gentle conditions, at relatively low temperatures and without added pressure, but the bonds were able to withstand... » read more

Chip Industry’s Technical Paper Roundup: Nov. 15


New technical papers added to Semiconductor Engineering’s library this week. [table id=63 /] » read more

Research Bits: Nov. 7


ADC side-channel attacks Researchers at MIT propose two ways to protect analog-to-digital converters (ADCs) from power and electromagnetic side-channel attacks. The researchers first investigated the side-channel attacks that could be used against ADCs. Power attacks usually involve an attacker soldering a resistor onto the device’s circuit board to measure its power usage. An electromagn... » read more

Research Bits: Nov. 1


Atomic-level rare earth manipulation Scientists from Ohio University, Argonne National Laboratory, and the University of Illinois at Chicago have rotated a single, charged rare earth molecule on a metal surface without changing the charge. The team used scanning tunneling microscopy (STM) system to rotate a positively charged Europium base molecule with negatively charged counterions as a p... » read more

Chip Industry’s Technical Paper Roundup: Nov. 1


New technical papers added to Semiconductor Engineering’s library this week. [table id=61 /] » read more

Research Bits: Oct. 25


Polarization for photonic processor Researchers from the University of Oxford and University of Exeter developed a photonic processor that uses multiple polarization channels, increasing information density. "We all know that the advantage of photonics over electronics is that light is faster and more functional over large bandwidths. So, our aim was to fully harness such advantages of phot... » read more

Chip Industry’s Technical Paper Roundup: Oct 25


New technical papers added to Semiconductor Engineering’s library this week. [table id=59 /] » read more

Chip Industry’s Technical Paper Roundup: Oct 18


New technical papers added to Semiconductor Engineering’s library this week. [table id=57 /] » read more

Research Bits: Oct. 18


Modular AI chip Engineers at the Massachusetts Institute of Technology (MIT), Harvard University, Stanford University, Lawrence Berkeley National Laboratory, Korea Institute of Science and Technology, and Tsinghua University created a modular approach to building stackable, reconfigurable AI chips. The design comprises alternating layers of sensing and processing elements, along with LEDs t... » read more

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