Chip Industry’s Technical Paper Roundup: Nov. 15

Costs for chiplet architecture; nanosheets; TFETs; red-emitting microLEDs; SAQP; optical crossbar architecture; energy estimates in accelerators, supercomputers; simulating energy and security interactions in fabs; multi-Independent gate-controlled finFET; ferroelectric-based in-memory computing.


New technical papers added to Semiconductor Engineering’s library this week.

Technical Paper Research Organizations
Trends in Energy Estimates for Computing in AI/Machine Learning Accelerators, Supercomputers, and Compute-Intensive Applications SLAC/Stanford University and MIT
Cost-Aware Exploration for Chiplet-Based Architecture with Advanced Packaging Technologies University of California, Santa Barbara
Simulating Energy and Security Interactions in Semiconductor Manufacturing: Insights from the Intel Minifab Model Idaho National Laboratory, University of Texas at Austin, University of Texas at San Antonio and George Mason University
Composition Dependent Electrical Transport in Si1−xGex Nanosheets with Monolithic Single-Elementary Al Contacts TU Wien (Vienna University of Technology), Johannes Kepler University, CEA-LETI, and Swiss Federal Laboratories for Materials Science and Technology
Effect of high-pressure D2 and H2 annealing on LFN properties in FD-SOI pTFET Chungnam National University and Korea Polytechnic College
N-polar InGaN/GaN nanowires: overcoming the efficiency cliff of red-emitting micro-LEDs University of Michigan
Characteristics of a Novel FinFET with Multi-Enhanced Operation Gates (MEOG FinFET) Changzhou University
Scalable Coherent Optical Crossbar Architecture using PCM for AI Acceleration University of Washington
Bayesian dropout approximation in deep learning neural networks: analysis of self-aligned quadruple patterning IBM TJ Watson Research Center and Rensselaer Polytechnic Institute
Achieving software-equivalent accuracy for hyperdimensional computing with ferroelectric-based in-memory computing University of Notre Dame, Fraunhofer Institute for Photonic Microsystems, University of California Irvine, and Technische Universität Dresden

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