System Bits: Feb. 19


Eco-friendly material for wireless IoT sensors Researchers at Canada’s Simon Fraser University and in Switzerland collaborated on developing a wood-derived cellulose material that could be used in a 3D printer, instead of the customary plastic and polymeric materials for electronics. With 3D printing, the material can offer flexibility to add or embed functions onto 3D shapes or fabrics, the... » read more

Power/Performance Bits: Nov 28


Deep learning to detect nuclear reactor cracks Inspecting nuclear power plant components for cracks is critical to preventing leaks, as well as to control in maintenance costs. But the current vision-based crack detection approaches are not very effective. Moreover, they are prone to human error, which in the case of nuclear power can be disastrous. To address this problem, Purdue Universit... » read more

Power/Performance Bits: Jan. 10


Antiferromagnetic magnetoelectric RAM Researchers at Helmholtz-Zentrum Dresden-Rossendorf (HZDR), Swiss Nanoscience Institute, and the University of Basel developed a concept for a new, low power memory chip. In particular, the group focused on finding an alternative to MRAM using magnetoelectric antiferromagnets, which are activated by an electrical voltage rather than by a current. "... » read more