Chip Industry Technical Paper Roundup: Jan 2


New technical papers added to Semiconductor Engineering’s library this week. [table id=180 /] More ReadingTechnical Paper Library home » read more

Nanoscale Reconfigurable Si Transistors (TU Wien, CNRS, UNC)


A new technical paper titled "Nanoscale Reconfigurable Si Transistors: From Wires to Sheets and Unto Multi-Wire Channels" was published by researchers at TU Wien, CNRS, and University of North Carolina at Chapel Hill. Abstract: "In this work, bottom-up Al–Si–Al nanowire (NW) heterostructures are presented, which act as a prototype vehicle toward top-down fabricated nanosheet (NS) and ... » read more

A Framework To Detect Capacitance-Based Analog Hardware Trojans And Mitigate The Effects


A technical paper titled “DeMiST: Detection and Mitigation of Stealthy Analog Hardware Trojans” was published by researchers at Tennessee Tech University and Technische Universitat Wien. Abstract: "The global semiconductor supply chain involves design and fabrication at various locations, which leads to multiple security vulnerabilities, e.g., Hardware Trojan (HT) insertion. Although most... » read more

Week In Review: Semiconductor Manufacturing, Test


TECHCET is forecasting semiconductor precursor revenues, both for high-ƙ metal dielectrics and low-ƙ dielectrics, will increase in the second half of 2023, rebounding from the current zero percent growth rate. Wafer start volumes are expected to rebound in 2024 with expansions in 2nm and 3nm logic devices. SEMI also predicts the global slump in semiconductor sales will end this quarter, gi... » read more

Research Bits: April 25


Superconductor breakthrough — palladium Palladium may be a better superconductor than even nickelates (superconductors based on nickel), according to research by TU Wien working with Japanese universities. The research shows that palladates may be a ‘Goldilocks material’ in which it can continue its superconducting state at a higher temperature. "Palladium is directly one line below n... » read more

Week In Review: Design, Low Power


Synopsys rolled out an AI-driven design suite called Synopsys.ai at the Synopsys User Group conference this week, which it says reduces time to better results at multiple points in the design flow. The company noted the new technology uses reinforcement learning, which compensates for relatively small data sets by allowing engineers to interact with that data more easily at any point, and to ch... » read more

Research Bits: March 28


Modeling how the nose smells The first 3D molecular-level picture of how an odor molecule binds to and activates an odorant receptor (OR) on olfactory cells in the nose may help us understanding and eventually be used to build a map of all the receptors. Scientists at UC San Francisco (UCSF) used cryo-electron microscopy (cryo-EM), which UCSF developed, to take a moving picture of the wiggly r... » read more

Chip Industry’s Technical Paper Roundup: Mar. 14


New technical papers recently added to Semiconductor Engineering’s library: [table id=86 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

FPGAs: Automated Framework For Architecture-Space Exploration of Approximate Accelerators


A technical paper titled "autoXFPGAs: An End-to-End Automated Exploration Framework for Approximate Accelerators in FPGA-Based Systems" was published (preprint) by researchers at TU Wien, Brno University of Technology, and NYUAD. Abstract "Generation and exploration of approximate circuits and accelerators has been a prominent research domain exploring energy-efficiency and/or performance... » read more

Looking Forward To SPIE, And Beyond


On the eve of this year’s SPIE Advanced Lithography + Patterning conference, I took a look at the IEEE Devices and Systems Roadmap’s lithography section. It’s especially notable for the emergence of EUV lithography, which has quickly become critical for advanced logic. High-NA tools to support still smaller dimensions are on the horizon. In the near-term, though, the key challenge is not ... » read more

← Older posts