tag: TU Wien

Chip Industry Week In Review
By The SE Staff - 19 Jul, 2024 - Comments: 0

The University of Texas at Austin’s Texas Institute for Electronics (TIE) was awarded $840 million to establish a Department of Defense microelectronics manufacturing center. This center will focus on developing advanced semiconductor microsystems to enhance U.S. defense systems. The project is part of DARPA's NGMM Program. The U.S. Dept. of Commerce announced preliminary terms with Global... » read more

Chip Industry Week In Review
By The SE Staff - 07 Jun, 2024 - Comments: 0

Rapidus and IBM are jointly developing mass production capabilities for chiplet-based advanced packages. The collaboration builds on an existing agreement to develop 2nm process technology. Vanguard and NXP will jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a $7.8 billion, 12-inch wafer plant. This is part of a global supply chain shift “Out... » read more

Chip Industry Week In Review
By The SE Staff - 29 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan.  China introduced strict procurement guidelines aimed at blocking the use of AMD and Intel processors in government computers. Meanwhile, China urged the Netherlands to ease restrictions on deep ultraviolet (DUV) litho equipment, according to Nikkei Asia. DUV is an older technology, based on 193nm ArF lasers, but in conjunction with multi-p... » read more

Chip Industry Technical Paper Roundup: Jan 2
By Linda Christensen - 02 Jan, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=180 /] More ReadingTechnical Paper Library home » read more

Nanoscale Reconfigurable Si Transistors (TU Wien, CNRS, UNC)
By Technical Paper Link - 20 Dec, 2023 - Comments: 0

A new technical paper titled "Nanoscale Reconfigurable Si Transistors: From Wires to Sheets and Unto Multi-Wire Channels" was published by researchers at TU Wien, CNRS, and University of North Carolina at Chapel Hill. Abstract: "In this work, bottom-up Al–Si–Al nanowire (NW) heterostructures are presented, which act as a prototype vehicle toward top-down fabricated nanosheet (NS) and ... » read more

A Framework To Detect Capacitance-Based Analog Hardware Trojans And Mitigate The Effects
By Technical Paper Link - 11 Oct, 2023 - Comments: 0

A technical paper titled “DeMiST: Detection and Mitigation of Stealthy Analog Hardware Trojans” was published by researchers at Tennessee Tech University and Technische Universitat Wien. Abstract: "The global semiconductor supply chain involves design and fabrication at various locations, which leads to multiple security vulnerabilities, e.g., Hardware Trojan (HT) insertion. Although most... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 19 May, 2023 - Comments: 0

TECHCET is forecasting semiconductor precursor revenues, both for high-ƙ metal dielectrics and low-ƙ dielectrics, will increase in the second half of 2023, rebounding from the current zero percent growth rate. Wafer start volumes are expected to rebound in 2024 with expansions in 2nm and 3nm logic devices. SEMI also predicts the global slump in semiconductor sales will end this quarter, gi... » read more

Research Bits: April 25
By Susan Rambo - 25 Apr, 2023 - Comments: 0

Superconductor breakthrough — palladium Palladium may be a better superconductor than even nickelates (superconductors based on nickel), according to research by TU Wien working with Japanese universities. The research shows that palladates may be a ‘Goldilocks material’ in which it can continue its superconducting state at a higher temperature. "Palladium is directly one line below n... » read more

Week In Review: Design, Low Power
By Susan Rambo - 31 Mar, 2023 - Comments: 0

Synopsys rolled out an AI-driven design suite called Synopsys.ai at the Synopsys User Group conference this week, which it says reduces time to better results at multiple points in the design flow. The company noted the new technology uses reinforcement learning, which compensates for relatively small data sets by allowing engineers to interact with that data more easily at any point, and to ch... » read more

Research Bits: March 28
By Susan Rambo - 28 Mar, 2023 - Comments: 0

Modeling how the nose smells The first 3D molecular-level picture of how an odor molecule binds to and activates an odorant receptor (OR) on olfactory cells in the nose may help us understanding and eventually be used to build a map of all the receptors. Scientists at UC San Francisco (UCSF) used cryo-electron microscopy (cryo-EM), which UCSF developed, to take a moving picture of the wiggly r... » read more

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