Chip Industry Week in Review


SK hynix is ramping HBM manufacturing capacity to meet explosive demand for AI data centers. The company will launch 16-stack HBM4 next year, and up to 12-stack HBM4E. HBM5 and HBM5E will be introduced between 2029 and 2031, reports Business Korea. China will not have access to NVIDIA’s most advanced chips, President Trump told 60 Minutes. The Dutch economy minister said Nexperia's chip... » read more

Overcoming The vdW Gap Bottleneck in Semiconductor Scaling (TU Wien)


A new technical paper titled "The van der Waals Gap: a Hidden Showstopper in Semiconductor Device Scaling" was published by researchers at TU Wien. Abstract "Continued miniaturization of transistors is critical for sustaining advances in computing performance, energy efficiency, and integration density. A central nanoscale challenge is controlling gate leakage through ultrathin dielectrics.... » read more

Research Bits: Oct. 7


Doping oxide insulator improves SiGe conductivity Researchers from TU Wien, Johannes Kepler University Linz, and TU Bergakademie Freiberg manufactured a silicon-germanium (SiGe) transistor using an alternative approach that involves doping the insulating oxide layer to produce a long-range effect that extends into the semiconductor. Called modulation acceptor doping (MAD), the technique ena... » read more

Chip Industry Week In Review


U.S. Trade Representative Jamieson Greer warned Southeast Asian semiconductor manufacturers that they must shift production to the U.S. or face new punitive tariffs, reports the South China Morning Post. President Trump previously floated a 100% tariff on imported chips. Malaysia and other regional economies are offering large concessions and promises of U.S. goods purchases in hopes of securin... » read more

Chip Industry Technical Paper Roundup: June 24


New technical papers recently added to Semiconductor Engineering’s library: [table id=442 /] Find more semiconductor research papers here. » read more

Thermoelectricity in Topological Flat-Band Compounds (TU Wien, et al.)


A new technical paper titled "Topological Flat-Band-Driven Metallic Thermoelectricity" was published by researchers at TU Wien, Los Alamos National Lab, Flatiron Institute and others. Abstract "Materials where flattened electronic dispersions arise from destructive phase interference, rather than localized orbitals, have emerged as promising platforms for studying emergent quantum phenome... » read more

Chip Industry Week in Review


Qualcomm announced plans to buy Alphawave Semi for ~$2.4 billion in a deal expected to close in Q1 2026. Qualcomm plans to leverage Alphawave Semi's connectivity products, including chiplets, to develop high-performance, low-power solutions for AI inferencing and customized CPUs in data centers. Qualcomm's traditional targets were mobile phones and edge computing. [Updated 6/9.] Global semic... » read more

Chip Industry Technical Paper Roundup: Apr. 29


New technical papers recently added to Semiconductor Engineering’s library: [table id=424 /] Find more semiconductor research papers here. » read more

Chip Industry Week in Review


To listen to the podcast version, click here. TSMC unveiled an unusually detailed roadmap at this week's North America Technology Symposium, including future architectures for 3D-ICs for high-performance computing and small, extremely low-power chips for AR/VR glasses, and two implementations of system-on-wafer. Fig. 1: TSMC's future packaging and stacking roadmap. Source: TSMC The ... » read more

Hardware Security: Assessment Method For Attacks Using Real-World Cases (TU Wien, TÜV Austria)


A new technical paper titled "The Pains of Hardware Security: An Assessment Model of Real-World Hardware Security Attacks" was published by researchers at TU Wien and TÜV Austria. "We review some of the publicly known HW attacks that have occurred and propose an assessment scheme for the attacks and the defense on hardware," states the paper. Find the technical paper here. April 2025. ... » read more

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