Low temperature Cu-Cu bonding for advanced packaging; EUV resists; near-lossless 2D semiconductor phase modulators; loss errors across quantum HW; doping-dependent charge trapping in WS2 FETs; fibre-like loss for photonic integration from violet to near-infrared; securing edge AI inference; cyber threat detection enabled by QC.
New technical papers recently added to Semiconductor Engineering’s library:
| Technical Paper | Research Organizations |
|---|---|
| Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation technology for advanced electronic packaging | National Yang Ming Chiao Tung University |
| Process and materials compatibility considerations for introducing novel EUV resists in a fab | KU Leuven and imec |
| Hybrid tungsten oxyselenide/graphene electrodes for near-lossless 2D semiconductor phase modulators | Nanyang Technological University et al. |
| Leveraging Qubit Loss Detection in Fault-Tolerant Quantum Algorithms | MIT, Harvard and QuEra Computing |
| Impact of doping and channel inhomogeneities on the stability of industrially fabricated WS2 FETs | KU Leuven, imec and TU Wien |
| Towards fibre-like loss for photonic integration from violet to near-infrared | Caltech, UCSB, Leiden University and University of Southampton |
| PermuteV: A Performant Side-channel-Resistant RISC-V Core Securing Edge AI Inference | Northeastern University |
| Cyber Threat Detection Enabled by Quantum Computing | Johns Hopkins University |
Find more semiconductor research papers here.
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