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Profile-Guided HW/SW Mechanism To Efficiently Reduce Branch Mispredictions In Data Center Applications (Best Paper Award)


A new technical paper titled "Whisper: Profile-Guided Branch Misprediction Elimination for Data Center Applications" was published by researchers at University of Michigan, ARM, University of California, Santa Cruz, and Texas A&M University. This work was awarded a best paper award at October's 2022 Institute of Electrical and Electronics Engineers (IEEE)/Association for Computing Machin... » read more

Chip Industry’s Technical Paper Roundup: Nov. 15


New technical papers added to Semiconductor Engineering’s library this week. [table id=63 /] » read more

Excess noise in high-current diamond diodes


Abstract "We report the results of an investigation of low-frequency excess noise in high-current diamond diodes. It was found that the electronic excess noise of the diamond diodes is dominated by the 1/f and generation-recombination noise, which reveals itself as Lorentzian spectral features (f is the frequency). The generation-recombination bulges are characteristic of diamond diodes with l... » read more

Manufacturing Bits: Nov. 24


Tiny MEMS gyroscope CEA-Leti and Politecnico di Milano (POLIMI) have developed the world’s smallest MEMS gyroscope. Based on a nano-resistive sensing technology, the gyroscope enables a navigation-grade performance with a sensor footprint of only 1.3mm2. The tiny gyroscope is targeted for high-volume markets like automotive and others. The technology was reported in a paper, entitled “1... » read more

A New Multi-Stimuli-Based Simulation Method for ESD Design Verification


Abstract: "This paper analyzes TCAD ESD simulation for both HBM zapping using real-world HBM ESD waveforms as stimuli and TLP testing using square wave TLP pulse trains as stimuli. It concludes that TCAD ESD simulation using either HBM waveforms or TLP pulse trains, alone, is insufficient. We introduce a new mixed-mode simulation flow using combined HBM and TLP stimuli to achieve ESD design pr... » read more

Manufacturing Bits: June 29


Speeding up ALD with AI The U.S. Department of Energy’s (DOE) Argonne National Laboratory has developed various ways to make atomic layer deposition (ALD) more efficient by using artificial intelligence (AI). ALD is a deposition technique that deposits materials one layer at a time on chips. For years, ALD has been used for the production of DRAMs, logic devices and other products. In ... » read more

Manufacturing Bits: Dec. 23


Magnetic glue Nanyang Technological University (NTU) Singapore has developed a new magnetic-activated glue technology. Conventional glue or adhesives involve epoxy and related materials. These adhesives are used to bond plastics, ceramics and wood. The adhesives are bonded and cured using moisture, heat or light. The curing temperatures range from room temperature to 80 degrees Celsius. ... » read more

Manufacturing Bits: Sept. 1


AI, quantum computing R&D centers The White House Office of Science and Technology Policy, the National Science Foundation (NSF), and the U.S. Department of Energy (DOE) have announced over $1 billion in awards for the establishment of several new artificial intelligence and quantum information science (QIS) research institutes in the U.S. Under the plan, the U.S. is launching seven new... » read more

Semicon West Day One/Two


For years, the semiconductor and equipment industry has congregated at the annual Semicon West trade show in San Francisco. It’s an event to get an update on the latest equipment, test and packaging technologies. It’s also a good way to meet with people who you haven’t seen in a year, if not longer. It’s a great way to get a pulse on the industry. Needless to say, Semicon is a vir... » read more

Manufacturing Bits: Feb. 25


Diamond finFETs HRL Laboratories has made new and significant progress to develop diamond finFETs. HRL, a joint R&D venture between Boeing and General Motors, has developed a new ohmic regrowth technique for diamond FETs. This in turn could pave the way towards commercial diamond FETs. Applications include spacecraft, satellites and systems with extreme temperatures. Still in R&D, diamo... » read more

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