New mixed-mode simulation flow using combined HBM and TLP stimuli to achieve ESD design prediction, which was validated in 28nm bulk CMOS and 45nm SOI CMOS.
Abstract:
“This paper analyzes TCAD ESD simulation for both HBM zapping using real-world HBM ESD waveforms as stimuli and TLP testing using square wave TLP pulse trains as stimuli. It concludes that TCAD ESD simulation using either HBM waveforms or TLP pulse trains, alone, is insufficient. We introduce a new mixed-mode simulation flow using combined HBM and TLP stimuli to achieve ESD design prediction, which was validated in 28nm bulk CMOS and 45nm SOI CMOS.”
Find the technical paper link here.
M. Di, Z. Pan, C. Li and A. Wang, “A New Multi-Stimuli-Based Simulation Method for ESD Design Verification,” 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2021, pp. 1-3, doi: 10.1109/EDTM50988.2021.9420890.
Date Added to IEEE Xplore: 12 May 2021
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