Distribution of Currents In Via Arrays

It has become increasingly difficult in recent years to provide adequate PDNs on a PCB. The sheer number of different voltages, combined with increased current demands, makes distributing current around the board a substantial layout challenge. This paper demonstrates that by using appropriate and accurate simulations, combined with the improved intuition that such simulations bring, it is a ch... » read more

Steady and Unsteady Full-Engine Simulations

Discover the power of fully coupled steady and unsteady full-engine simulations. Say goodbye to traditional component-by-component methods. This innovative approach seamlessly integrates all engine components into a single, cohesive simulation framework, offering unparalleled accuracy and efficiency for aero-engine simulations. Key Takeaways: Steady and Time-Accurate: Achieve superio... » read more

Memory System Benchmarking, Simulation, And Application Profiling Via A Memory Stress Framework

A technical paper titled “A Mess of Memory System Benchmarking, Simulation and Application Profiling” was published by researchers at Barcelona Supercomputing Center, Unversitat Politecnica de Catalunya, and Micron Technology (Italy). Abstract: "The Memory stress (Mess) framework provides a unified view of the memory system benchmarking, simulation and application profiling. The Mess benc... » read more

Innovating Electric Mobility: Simulation Solutions For Electric Machines

Automakers desire solutions that can easily scale to new applications of next generation vehicles. Electrified propulsion technology is one main area where EV engineers are pushing the boundaries. Electric machine design and integration choices have system-level impacts that directly influence an automaker’s time to market and even overall market adoption. With Ansys multiphysics simulatio... » read more

Communication Is Key To Finding And Fixing Bugs In ICs

Experts at the Table: Finding and eliminating bugs at the source can be painstaking work, but it also can prevent even greater problems from developing later on. To examine the best ways to tackle this problem, Semiconductor Engineering sat down with Ashish Darbari, CEO at Axiomise; Ziyad Hanna, corporate vice president R&D at Cadence; Jim Henson, ASIC verification software product manager ... » read more

Can Models Created With AI Be Trusted?

EDA models that are created using AI need to pass more stringent quality and cost benefit analysis compared to many AI applications in the broader industry. Money is hanging on the line if AI gets it wrong, and all the associated costs must be factored into the equation. Models are some of the most expensive things a development team can create, and it is important to understand the value th... » read more

Engineers Or Their Tools: Which Is Responsible For Finding Bugs?

Experts at the table: Finding and eliminating bugs at the source can be painstaking work, but it can prevent bigger problems later in the design flow, when they are more difficult and expensive to fix.  Semiconductor Engineering sat down to discuss these issues with Ashish Darbari, CEO at Axiomise; Ziyad Hanna, corporate vice president R&D at Cadence; Jim Henson, ASIC verification software... » read more

Digital Twins Target IC Tool And Fab Efficiency

Digital twins have emerged as the hot "new" semiconductor manufacturing technology, enabling fabs to create a virtual representation of a physical system on which to experiment and optimize what's going on inside the real fab. While digital twin technology has been in use for some time in other industries, its use has been limited in semiconductor manufacturing. What's changing is the breadt... » read more

Verifying Hardware Security With RTL Simulation

When consumers think about security for their electronic gadgets, financial applications probably spring first to mind. Identity theft and unauthorized access to bank and investment accounts are a constant threat. But there’s more to worry about every day. Stories of webcams and smart speakers being hacked are all over the web. Users rightfully demand that device manufacturers provide a high ... » read more

How Multiphysics Simulation Enables 3D-IC Implementation At The Speed Of Light

Electronic designers need greater integration densities and faster data transfer rates to meet the increased performance requirements of technologies like 5G/6G, autonomous driving, and artificial intelligence. The semiconductor industry is shifting toward 3D-IC design to keep up with the ever-growing demand for high-performance and power-efficient devices that has outpaced the capabilities o... » read more

← Older posts