tag: simulation

Continuous Physics Reasoning:
Definition, Minimum Criteria, and the Role of Foundation Models for Physics
By Vinci - 24 Jun, 2026 - Comments: 0

Abstract Physical products are increasingly constrained by thermal, mechanical, electrical, and manufacturing realities, yet much of industry still relies on intermittent, expert-mediated physics evaluation. As systems become more complex and tightly coupled, this limits not only product development, but also manufacturing readiness, operational efficiency, and lifecycle performance. This p... » read more

Fault Injection Framework Targets RISC-V Security Weak Spots
By - 14 Jun, 2026 - Comments: 0

Researchers from Politecnico di Torino and CEA-List published a technical paper titled “InjectV: Modeling Fault Injection Attacks in RISC-V Simulation Environment.” Abstract "Fault Injection Attacks (FIAs) are a significant threat to hardware security, capable of compromising systems by inducing malicious faults in computation or storage. Evaluating resilience against such attacks is chal... » read more

Deterministic, Solver-Accurate Thermal and Warpage Analysis at Manufacturing Resolution for Advanced 2.5D HBM Packages
By Vinci - 27 May, 2026 - Comments: 0

Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging. Modern packages integrate high-power ASICs with multiple High Bandwidth Memory (HBM) stacks on a silicon interposer, creating tightly coupled thermal and mechanical interactions. Die-to-die thermal crosstalk elevates HBM junction temperatures, while coefficient of thermal e... » read more

Multiphysics Fusion Technology for Multi-Die Designs Explained
By Synopsys - 27 May, 2026 - Comments: 0

Multiphysics issues are no longer a late-stage problem. Multi-die designs introduce tightly coupled electrical, thermal, electromagnetic, and electromechanical challenges that impact performance and reliability. This eBook shows why multiphysics analysis must move earlier in the design flow, and how a unified approach enables continuous validation from exploration through signoff. What You�... » read more

Process Variation In The Era Of Scaling: Improving Uniformity With Dummy Fill
By HJ Kim - 21 May, 2026 - Comments: 0

As semiconductor patterning continues to scale, even small layout nonuniformities can lead to noticeably different process outcomes. Real chip layouts contain a mix of dense regions, large open regions, and isolated features. As a result, the etch process encounters different “local environments” across the wafer. Even with the same process settings (or recipe), some areas may etch mo... » read more

The Emergence Of Electronics Digital Twins For Software-Defined Vehicles
By Marc Serughetti - 07 May, 2026 - Comments: 0

Digital twins have long played a critical role in engineering and manufacturing. As virtual representations of physical products, systems, and processes, they help organizations innovate faster, improve quality, and reduce costs. Early digital twin technologies were primarily rooted in the physical world, modeling mechanical systems such as engines, buildings, and factory operations to simulate... » read more

From Simulation Checkpoints To Continuous Physics
By Satish Radhakrishnan - 04 May, 2026 - Comments: 0

Semiconductor engineering teams have long relied on an iterative simulation workflow: define the scenario, prepare the model, run the analysis, review the results, adjust the design, and repeat until a decision can be made. That workflow remains essential. Simulation is still one of the primary ways teams evaluate physical behavior before hardware is built. But as chips, packages, and system... » read more

When Semiconductor Materials Misbehave
By Gregory Haley - 27 Apr, 2026 - Comments: 0

Key Takeaways Material behavior in production depends on the process context that no development environment can fully replicate. In advanced packaging, the interactions that cross domain boundaries are increasingly where failures originate. The most accurate materials data is also the most commercially sensitive, leaving simulation models calibrated against generic inputs rather tha... » read more

Replay‑based Validation as a Scalable Methodology for Chiplet‑based Systems (Intel, Synopsys)
By Technical Paper Link - 18 Mar, 2026 - Comments: 0

A new technical paper, "ODIN-Based CPU-GPU Architecture with Replay-Driven Simulation and Emulation," was published by researchers at Intel, Nvidia and Synopsys. Abstract "Integration of CPU and GPU technologies is a key enabler for modern AI and graphics workloads, combining control-oriented processing with massive parallel compute capability. As systems evolve toward chiplet-based archite... » read more

Detecting Chemical Variability At Advanced Nodes
By Gregory Haley - 10 Mar, 2026 - Comments: 2

Key Takeaways Yield loss is increasingly driven by molecular variability in thin films, interfaces, and contamination rather than visible defects. Reliability issues often appear first as parametric drift or margin erosion under workload and thermal stress. Detection requires correlating molecular metrology, embedded electrical telemetry, and AI-driven wafer inspection. As s... » read more

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