Chip Industry Technical Paper Roundup: Jan. 23


New technical papers added to Semiconductor Engineering’s library this week. [table id=189 /] More ReadingTechnical Paper Library home » read more

Suitability of FeFET-Based CAM Cells For Storage-Class Memory, Under Junction Temperature Variations


A technical paper titled “Ferroelectric Field Effect Transistors–Based Content-Addressable Storage-Class Memory: A Study on the Impact of Device Variation and High-Temperature Compatibility” was published by researchers at Fraunhofer Institute for Photonic Microsystems (IPMS) and Indian Institute of Technology Madras (IIT Madras). Abstract: "Hafnium oxide (HfO2)-based ferroelectric fiel... » read more

Chip Industry’s Technical Paper Roundup: Nov. 15


New technical papers added to Semiconductor Engineering’s library this week. [table id=63 /] » read more

Multi-Bit In-Memory Computing System for HDC using FeFETs, Achieving SW-Equivalent-Accuracies


A new technical paper titled "Achieving software-equivalent accuracy for hyperdimensional computing with ferroelectric-based in-memory computing" by researchers at University of Notre Dame, Fraunhofer Institute for Photonic Microsystems, University of California Irvine, and Technische Universität Dresden. "We present a multi-bit IMC system for HDC using ferroelectric field-effect transistor... » read more

Sorting Out Packaging Options


Semiconductor Engineering sat down to discuss advanced packaging with David Butler, executive vice president and general manager of SPTS Technologies; Ingu Yin Chang, senior vice president president at ASE Group; Hubert Karl Lakner, executive director of the Fraunhofer Institute for Photonic Microsystems; Robert Lo, division director for electronics and optoelectronics research at Industrial Te... » read more