category: Research

category: IoT, Security & Automotive

Manufacturing Bits: Nov. 24
By Mark LaPedus - 24 Nov, 2021 - Comments: 0

Tiny MEMS gyroscope CEA-Leti and Politecnico di Milano (POLIMI) have developed the world’s smallest MEMS gyroscope. Based on a nano-resistive sensing technology, the gyroscope enables a navigation-grade performance with a sensor footprint of only 1.3mm2. The tiny gyroscope is targeted for high-volume markets like automotive and others. The technology was reported in a paper, entitled “1... » read more

Power/Performance Bits: Nov. 24
By Jesse Allen - 24 Nov, 2021 - Comments: 0

Flexible, low power phase-change memory Engineers at Stanford University created a flexible phase-change memory. The non-volatile phase-change memory device is made up of germanium, antimony, and tellurium (GST) between two metal electrodes. 1s and 0s represent measurements of electrical resistance in the GST material. “A typical phase-change memory device can store two states of resis... » read more

Manufacturing Bits: Nov. 16
By Mark LaPedus - 16 Nov, 2021 - Comments: 0

New hybrid EUV photoresist The U.S. Department of Energy (DOE) has announced the winners for a recent entrepreneurial technology competition, including the development of a new EUV hybrid resist and an antibody therapeutics platform. The event, called the National Lab Accelerator Pitch Event, involved a competition among 11 researchers within the DOE’s national labs. Researchers pitched ... » read more

Power/Performance Bits: Nov. 16
By Jesse Allen - 16 Nov, 2021 - Comments: 0

Light-emitting memory Researchers from Kyushu University and National Taiwan Normal University propose a 'light-emitting memory' based on a perovskite that can simultaneously store and visually transmit data. The team used the idea in conjunction with resistive RAM (RRAM), in which states of high and low resistance represent ones and zeros. "The electrical measurements needed to check the r... » read more

Manufacturing Bits: Nov. 8
By Mark LaPedus - 08 Nov, 2021 - Comments: 0

Plasma R&D with quantum computing Rigetti Computing, a developer of quantum computers, has been selected to lead a quantum simulation project for the development of fusion energy. The project was awarded by the Department of Energy (DoE). Under the plan, Rigetti will collaborate with Lawrence Livermore National Laboratory and the University of Southern California on a three-year, $3.1 m... » read more

Power/Performance Bits: Nov. 8
By Jesse Allen - 08 Nov, 2021 - Comments: 0

Molecular memristor Researchers from National University of Singapore, Indian Association for the Cultivation of Science, University of Limerick, Texas A&M University, and Hewlett Packard Enterprise discovered a molecular memristor for brain-inspired computing. The molecule uses natural asymmetry in its metal-organic bonds to switch between different states, which allows it to perform u... » read more

Manufacturing Bits: Nov. 2
By Mark LaPedus - 02 Nov, 2021 - Comments: 0

IRDS lithography roadmap The Journal of Micro/Nanopatterning, Materials, and Metrology (JM3) has published a paper that outlines the lithography roadmap and the various challenges for the next 15 years. The paper, called the "International Roadmap for Devices and Systems lithography roadmap," projects that extreme ultraviolet (EUV) lithography and a next-generation version will remain the m... » read more

Power/Performance Bits: Nov. 2
By Jesse Allen - 02 Nov, 2021 - Comments: 0

GaN CMOS ICs Researchers from the Hong Kong University of Science and Technology (HKUST) are working to increase the functionality available to wide bandgap gallium nitride (GaN) electronics. GaN is frequently used in power electronics, such as power converters and supplies. However, GaN CMOS technology has been hampered by the difficulties in implementing p-channel transistors and integrat... » read more

Manufacturing Bits: Oct. 26
By Mark LaPedus - 26 Oct, 2021 - Comments: 0

GaN finFETs, scaling GaN At the upcoming IEEE International Electron Devices Meeting (IEDM) in San Francisco, a slew of entities will present papers on the latest technologies in R&D. The event, to be held Dec. 11–15, involve papers on advanced packaging, CMOS image sensors, interconnects, transistors, power devices and other technologies. At IEDM, Intel will present a paper on a GaN-... » read more

Power/Performance Bits: Oct. 26
By Jesse Allen - 26 Oct, 2021 - Comments: 0

Printing circuits on irregular shapes Researchers at Pennsylvania State University propose a way to print biodegradable circuits on irregular, complex shapes. “We are trying to enable direct fabrication of circuits on freeform, 3-D geometries,” said Huanyu “Larry” Cheng, professor in Penn State's Department of Engineering Science and Mechanics (ESM). “Printing on complicated objec... » read more

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