Manufacturing Bits: Dec. 7


Cybersecurity for manufacturing The University of Texas at San Antonio (UTSA) has launched a center to address cybersecurity issues in the U.S. manufacturing sector. The center, called the Cybersecurity Manufacturing Innovation Institute (CyManII), is a $111 million public-private partnership. As part of the effort, UTSA will enter into a five-year corporative agreement with the U.S. Depart... » read more

Power/Performance Bits: Dec. 7


Logic-in-memory with MoS2 Engineers at École Polytechnique Fédérale de Lausanne (EPFL) built a logic-in-memory device using molybdenum disulfide (MoS2) as the channel material. MoS2 is a three-atom-thick 2D material and excellent semiconductor. The new chip is based on floating-gate field-effect transistors (FGFETs) that can hold electric charges for long periods. MoS2 is particularly se... » read more

Manufacturing Bits: Dec. 1


New phase-change materials The National Institute of Standards and Technology (NIST) has developed an open source machine learning algorithm for use in discovering and developing new materials. NIST’s technology, called CAMEO, has already been used by researchers to discover a new phase-change memory material. CAMEO, which stands for Closed-Loop Autonomous System for Materials Exploration... » read more

Power/Performance Bits: Dec. 1


Self-erasing chip Researchers from the University of Michigan developed self-erasing chips that could be used to prevent counterfeiting or detect tampering. The technology is based on a new material that temporarily stores energy, changing the color of the light it emits. It self-erases in a matter of days, or it can be erased on demand. "It's very hard to detect whether a device has been t... » read more

Manufacturing Bits: Nov. 25


Lidar-on-a-chip At the upcoming IEEE International Electron Devices Meeting (IEDM), Samsung will present a paper on the industry’s first single-chip lidar beam scanner. (Go to this link and then look for paper 7.2, “Single-Chip Beam Scanner with Integrated Light Source for Real-Time Light Detection and Ranging,” J. Lee et al, Samsung.) Lidar, or light imaging, detection, and ranging, ... » read more

Power/Performance Bits: Nov. 23


Graphene energy Researchers from the University of Arkansas, University of Pennsylvania, and Universidad Carlos III de Madrid built a circuit capable of capturing graphene's thermal motion and converting it into an electrical current. "An energy-harvesting circuit based on graphene could be incorporated into a chip to provide clean, limitless, low-voltage power for small devices or sensors,... » read more

Manufacturing Bits: Nov. 17


Intel’s gate-all-around FETs At the upcoming IEEE International Electron Devices Meeting (IEDM), Intel is expected to present papers on its efforts to develop gate-all-around transistors. One paper from Intel describes a more conventional gate-all-around transistor technology called a nanosheet FET. Another paper involves a next-generation NMOS-on-PMOS nanoribbon transistor technology. (F... » read more

Power/Performance Bits: Nov. 17


NVMe controller for research Researchers at the Korea Advanced Institute of Science and Technology (KAIST) developed a non-volatile memory express (NVMe) controller for storage devices and made it freely available to universities and research institutions in a bid to reduce research costs. Poor accessibility of NVMe controller IP is hampering academic and industrial research, the team argue... » read more

Manufacturing Bits: Nov. 9


Open-source EUV resist metrology Paul Scherrer Institute (PSI) has developed an open-source software technology for scanning electron microscopy (SEM) applications. The technology is targeted for EUV resist metrology. The technology, called SMILE (SEM-Measured Image Lines Estimator), is an open source software technology, which characterizes line and space patterns in a SEM. SMILE is used t... » read more

Power/Performance Bits: Nov. 9


Integrated transistor cooling Researchers at Ecole Polytechnique Fédérale de Lausanne (EPFL) created a single chip that combines a transistor and microfluidic cooling system for more efficient transistor heat management. The team focused on a co-design approach for the electrical and mechanical aspects of the chip, bringing the electronics and cooling design together and aiming to extract... » read more

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