category: Research

category: IoT, Security & Automotive

Manufacturing Bits: June 23
By Mark LaPedus - 23 Jun, 2020 - Comments: 0

Fan-out gas sensors At the recent IEEE Electronic Components and Technology Conference (ECTC), the University of California at Los Angeles (UCLA) and the Indian Institute of Science presented a paper on the development of a wearable MEMS gas sensor device based on a flexible wafer-level fan-out packaging technology. Researchers have demonstrated a gas sensor device or a personal environment... » read more

Power/Performance Bits: June 23
By Jesse Allen - 23 Jun, 2020 - Comments: 0

Capturing waste heat Researchers at Wuhan University and University of California Los Angeles developed a hydrogel that can both cool down electronics and convert the waste heat into electricity. The thermogalvanic hydrogel consists of a polyacrylamide framework infused with water and specific ions. When they heated the hydrogel, two of the ions (ferricyanide and ferrocyanide) transferred e... » read more

Manufacturing Bits: June 16
By Mark LaPedus - 16 Jun, 2020 - Comments: 0

GaN power modules Gallium-nitride (GaN) devices are emerging in several markets, such as power semiconductors and RF. GaN, a binary III-V compound, is a wide-bandgap technology, meaning it is faster and more efficient than silicon-based devices. GaN has 10 times the breakdown field strength with double the electron mobility than silicon. Generally, some GaN vendors don’t use a traditio... » read more

Power/Performance Bits: June 16
By Jesse Allen - 16 Jun, 2020 - Comments: 0

One-directional optical Researchers from University of Pennsylvania, Peking University and Massachusetts Institute of Technology developed a design for optical devices that radiate light in only one direction, which could reduce energy consumption in optical fiber networks and data centers. Light tends to flow in a single direction optical fibers, but while most of the light passing through... » read more

Manufacturing Bits: June 8
By Mark LaPedus - 08 Jun, 2020 - Comments: 0

Maskless EUV lithography At this week’s 2020 EUVL Workshop, KJ Innovation will present more details about its efforts to develop a maskless extreme ultraviolet (EUV) lithography technology. Still in R&D, KJ Innovation’s maskless EUV technology involves a high-numerical aperture (high-NA) system with 2 million individual write beams. The 0.55 NA technology is targeted for direct-write l... » read more

Power/Performance Bits: June 8
By Jesse Allen - 08 Jun, 2020 - Comments: 0

High temp capacitor Researchers at Pennsylvania State University doped a dielectric capacitor to increase storage capacity while also increasing electric charge efficiency, enabling the capacitor to withstand greater voltage with very little energy loss at temperatures higher than 300 degrees Fahrenheit. “What we have done is to use interface effects in nano-dopants to increase both the stor... » read more

Manufacturing Bits: June 2
By Mark LaPedus - 02 Jun, 2020 - Comments: 0

EUV lithography in outer space The U.S. space program made history on May 31, 2020, when NASA astronauts Robert Behnken and Douglas Hurley aboard SpaceX’s Crew Dragon spacecraft arrived at the International Space Station (ISS). This is the first time a commercial spacecraft has delivered astronauts to the ISS. The ISS serves as a research lab for companies, government agencies and universiti... » read more

Power/Performance Bits: June 2
By Jesse Allen - 02 Jun, 2020 - Comments: 0

Neuromorphic memristor Researchers at the University of Massachusetts Amherst used protein nanowires to create neuromorphic memristors capable of running at extremely low voltage. A challenge to neuromorphic computing is mimicking the low voltage at which the brain operates: it sends signals between neurons at around 80 millivolts. Jun Yao, an electrical and computer engineering researcher at ... » read more

Manufacturing Bits: May 26
By Mark LaPedus - 26 May, 2020 - Comments: 0

7-level nanosheets The 2020 Symposia on VLSI Technology & Circuits for the first time will be held as a virtual conference. The event, to be held from June 15-18, is organized around the theme “The Next 40 Years of VLSI for Ubiquitous Intelligence.” Among the papers at the event include advanced nanosheet transistors, 3D stacked memory devices and even an artificial iris. At the ... » read more

Power/Performance Bits: May 26
By Jesse Allen - 26 May, 2020 - Comments: 0

Warmer quantum computing Researchers at the University of New South Wales Sydney, Université de Sherbrooke, Aalto University, and Keio University developed a proof-of-concept quantum processor unit cell on a silicon chip that works at 1.5 Kelvin – 15 times warmer than current chip-based technology that uses superconducting qubits. "This is still very cold, but is a temperature that can b... » read more

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