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Manufacturing Bits: Feb. 15


Strong plastics The Massachusetts Institute of Technology has developed a new material that is stronger than steel but is light as plastic. The new material, which can be made in large quantities, involves a two-dimensional polymer that self-assembles into sheets. The material’s Young modulus—or a measure of how much force it takes to deform a material—is between four and six times gr... » read more

Manufacturing Bits: Feb. 7


Design tools for solid-state batteries Oak Ridge National Laboratory has devised a new tool designed to accelerate the development of energy-dense solid-state batteries. The tool, called the Solid-State Battery Performance Analyzer and Calculator (SolidPAC), enables researchers to assess the impact of battery designs and choice of cell components for solid-state batteries. It can be used to... » read more

Manufacturing Bits: Feb. 1


Fab equipment cybersecurity In a major step to help provide security in the semiconductor manufacturing supply chain, SEMI has published the first cybersecurity specifications and standards for fab equipment. For some time, the semiconductor industry has been developing new cybersecurity standards for fab equipment in an effort to protect systems from potential cyberattacks, viruses, and IP... » read more

Manufacturing Bits: Jan. 25


Stretchable thermometers The Harvard John A. Paulson School of Engineering and Applied Sciences (SEAS) has developed a stretchable and self-powered thermometer that can be integrated into various systems, such as stretchable electronics and soft robots. Depending on the materials used, the stretchable thermometer can measure temperatures of more than 200 degrees Celsius to -100 degrees Cel... » read more

Manufacturing Bits: Jan. 18


Proton/antiproton measurements CERN, the European Organization for Nuclear Research, has made a breakthrough in particle physics by conducting the world’s most precise measurements and comparisons between protons and antiprotons. The breakthrough can help scientists gain a better understand of particle physics as well as the origins and the composition of the universe. It can also bring n... » read more

Manufacturing Bits: Jan. 10


Finding new materials with inverse design The Singapore-MIT Alliance for Research and Technology (SMART) has found a new way to perform general inverse design, a technique that can accelerate the discovery of new materials. The concept of inverse design is simple. Let’s say you want to develop products with select materials. In a computer, you input the desired materials and the propertie... » read more

Manufacturing Bits: Jan. 3


Gallium oxide chips Looking to commercialize a promising ultra wide-bandgap technology in the market, Novel Crystal Technology (NCT) has developed a Schottky barrier diode based on a material called gallium oxide. NCT devised an ampere-class 1,200-V diode based on gallium oxide. A diode is a device that passes electricity in one direction and blocks it in the opposite direction. Still in R&... » read more

Manufacturing Bits: Dec. 28


Measuring microdroplets The National Institute of Standards and Technology (NIST) has found a new way for microscopes to measure the volumes of microdroplets. Using this technique, NIST has measured the volume of individual droplets smaller than 100 trillionths of a liter with an uncertainty of less than 1%. That represents a tenfold improvement compared to previous measurements, according ... » read more

Manufacturing Bits: Dec. 21


Tiny electronic fountain pens Karlsruhe Institute of Technology (KIT) and Taiyuan University of Technology have developed what resembles a tiny electronic fountain pen, a technology that can pattern and deposit small structures on surfaces. The system from KIT and Taiyuan University is actually a high-precision tabletop microplotter, which is used to print or deposit materials for printed e... » read more

Manufacturing Bits: Dec. 14


3D-SOCs At this week’s IEEE International Electron Devices Meeting (IEDM), a plethora of companies, R&D organizations and universities presented papers on the latest and greatest technologies. One of the themes at IEDM is advanced packaging, a technology enables an IC vendor to boost the performance of a chip. Advanced forms of packaging also enables new 3D-like chip architectures. Fo... » read more

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