Manufacturing Bits: Aug. 15


Self-collapse lithography The University of California at Los Angeles (UCLA) has developed a technology called self-collapse lithography. The technology, reported in the journal Nano Letters, resembles the combination of nanoimprint, selective removal and a chemical lift-off process. More specifically, though, the technology provides insights into patterning using a chemical lift-off lith... » read more

Manufacturing Bits: Aug. 8


Ferroelectric films Ferroelectric RAM (FRAM) is creating a buzz again. For years, FRAMs have been shipping for embedded applications, although the technology has taken a backseat to MRAM, phase-change and ReRAM. Using a ferroelectric capacitor to store data, FRAM is a nonvolatile memory with unlimited endurance. FRAM is faster than EEPROM and flash. FRAM performs an over-write function in ... » read more

Manufacturing Bits: Aug. 1


Magnetic chips HRL Laboratories—an R&D venture between Boeing and General Motors—has been awarded a contract to develop a new class of magnetic integrated components. HRL has received the award from the Defense Advanced Research Project Agency (DARPA) under the Magnetic, Miniaturized, and Monolithically Integrated Components (M3IC) program. The goal is to develop new magnetic materials... » read more

Manufacturing Bits: July 25


Metrology for the intelligence community The semiconductor industry continues to move full speed ahead with traditional chip scaling. There are several challenges in the arena. One of the big but lessor known challenges is metrology. Metrology, the science of characterizing and measuring films and structures, is becoming more complex, challenging and expensive at each node. Looking to solv... » read more

Manufacturing Bits: July 18


Brain microscopes Rice University is developing a tiny and flat microscope for a special application--it will be able to decode and trigger neurons on the surface of the brain. The microscope technology, dubbed FlatScope, is part of a $65 million program announced by the U.S.-based Defense Advanced Research Projects Agency (DARPA). The DARPA project, dubbed Neural Engineering System Design ... » read more

Manufacturing Bits: July 11


China’s storage ring for EUV A group of researchers are banding together to propel the development of a storage ring technology that may one day be used as a power source for extreme ultraviolet (EUV) lithography. The collaboration includes five institutions. Researchers have organized an informal collaboration or study group with plans to develop a storage ring for EUV based on a techno... » read more

Manufacturing Bits: July 3


MacEtch and chips Singapore’s Agency for Science, Technology and Research (A*STAR) has advanced a technology called metal-assisted chemical etching or MacEtch for use in the fabrication of silicon nanowires and related structures. Silicon nanowires are used in several applications, such as electronics, solar, storage, optical, catalysis, drug delivery and sensors. In semiconductors, the ... » read more

Manufacturing Bits: June 27


World’s brightest laser The University of Nebraska-Lincoln has set the unofficial record for the world’s brightest laser. Researchers have focused a laser at a brightness of 1 billion times greater than the surface of the sun. This feat was accomplished using the so-called Diocles Laser at the University of Nebraska-Lincoln. The laser has a combination of peak power and a repetition ra... » read more

Manufacturing Bits: June 20


Solar cell metrology Using atomic force microscopy (AFM), the National Institute of Standards and Technology (NIST) has developed a pair of novel techniques to measure the chemical compositions and defects in solar cells. The new techniques will give researchers insights into a thin-film solar cell material called cadmium telluride. The technology will also suggest ways to boost the efficie... » read more

Manufacturing Bits: June 13


FeFET biz heats up The ferroelectric FET (FeFET) market is heating up. One company, Ferroelectric Memory Co. (FMC), has been developing FeFETs, a new memory type for use in standalone and embedded applications. Now, Imec is also developing FeFETs in both planar and vertical varieties. [caption id="attachment_147967" align="alignleft" width="239"] Imec's FeFET (Source: Imec)[/caption] ... » read more

← Older posts