Manufacturing Bits: Dec. 14


3D-SOCs At this week’s IEEE International Electron Devices Meeting (IEDM), a plethora of companies, R&D organizations and universities presented papers on the latest and greatest technologies. One of the themes at IEDM is advanced packaging, a technology enables an IC vendor to boost the performance of a chip. Advanced forms of packaging also enables new 3D-like chip architectures. Fo... » read more

Manufacturing Bits: Dec. 6


China’s rare earth power play Rare earth elements (REEs) are back in the news. China, the world’s largest supplier of rare earths, plans to combine three domestic vendors to create a large state-owned company with a nearly 70% share of the REE market, according to reports from Nikkei and others. In 2020, China in total accounted for 85% of global production of refined REEs, accordi... » read more

Manufacturing Bits: Nov. 30


Quantum chemistry QunaSys has launched a technology that enables researchers to perform chemical calculations using quantum computers in the cloud. The company has announced the launch of the cloud version of Qamuy, which is supported by Amazon Web Services Japan. Qamuy is a software technology that allows researchers to perform chemical calculations using quantum computers. Developers c... » read more

Manufacturing Bits: Nov. 24


Tiny MEMS gyroscope CEA-Leti and Politecnico di Milano (POLIMI) have developed the world’s smallest MEMS gyroscope. Based on a nano-resistive sensing technology, the gyroscope enables a navigation-grade performance with a sensor footprint of only 1.3mm2. The tiny gyroscope is targeted for high-volume markets like automotive and others. The technology was reported in a paper, entitled “1... » read more

Manufacturing Bits: Nov. 16


New hybrid EUV photoresist The U.S. Department of Energy (DOE) has announced the winners for a recent entrepreneurial technology competition, including the development of a new EUV hybrid resist and an antibody therapeutics platform. The event, called the National Lab Accelerator Pitch Event, involved a competition among 11 researchers within the DOE’s national labs. Researchers pitched ... » read more

Manufacturing Bits: Nov. 8


Plasma R&D with quantum computing Rigetti Computing, a developer of quantum computers, has been selected to lead a quantum simulation project for the development of fusion energy. The project was awarded by the Department of Energy (DoE). Under the plan, Rigetti will collaborate with Lawrence Livermore National Laboratory and the University of Southern California on a three-year, $3.1 m... » read more

Manufacturing Bits: Nov. 2


IRDS lithography roadmap The Journal of Micro/Nanopatterning, Materials, and Metrology (JM3) has published a paper that outlines the lithography roadmap and the various challenges for the next 15 years. The paper, called the "International Roadmap for Devices and Systems lithography roadmap," projects that extreme ultraviolet (EUV) lithography and a next-generation version will remain the m... » read more

Manufacturing Bits: Oct. 26


GaN finFETs, scaling GaN At the upcoming IEEE International Electron Devices Meeting (IEDM) in San Francisco, a slew of entities will present papers on the latest technologies in R&D. The event, to be held Dec. 11–15, involve papers on advanced packaging, CMOS image sensors, interconnects, transistors, power devices and other technologies. At IEDM, Intel will present a paper on a GaN-... » read more

Manufacturing Bits: Oct. 19


Solar mini-reactors The University of Amsterdam has developed a standalone solar-powered mini-reactor. The technology could one day serve as an autonomous off-grid photochemistry system for remote locations. The prototype solar reactor measures 0.25 square meters. The system is equipped with a solar cell, which provides the power for the pumps and control system. This solar cell is placed ... » read more

Manufacturing Bits: Oct. 11


IC security using AFMs The National Institute of Standards and Technology (NIST) has developed a probe assisted doping technique (PAD), a technology that could help prevent counterfeit chips and electronic devices from entering the market. PAD involves creating a unique ID tag on every chip using an atomic force microscope (AFM). Basically, an AFM system incorporates a cantilever with a tin... » read more

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