category: Research: MDT

category: IoT, Security & Automotive

Manufacturing Bits: March 2
By Mark LaPedus - 02 Mar, 2021 - Comments: 0

Next-gen AFM At the recent SPIE Advanced Lithography conference, Imec, Infinitesima and others described a new metrology tool technology called a Rapid Probe Microscope (RPM). Infinitesima has shipped its first RPM 3D system, enabling three-dimensional (3D) metrology applications for leading-edge chips. The system was jointly developed with Imec. In the IEDM paper, Imec and Infinitesima... » read more

Manufacturing Bits: Feb. 23
By Mark LaPedus - 23 Feb, 2021 - Comments: 0

Space crystals Northrop Grumman recently launch its Cygnus spacecraft into space, sending thousands of pounds of critical supplies and experiments to the International Space Station (ISS). The launch, which took place from NASA’s Wallops Flight Facility in Virginia, will deliver a diversity of experiments to the ISS National Laboratory. In one experiment, Redwire’s sixth in-space man... » read more

Manufacturing Bits: Feb. 16
By Mark LaPedus - 16 Feb, 2021 - Comments: 0

Hybrid bonding consortium for packaging A*STAR’s Institute of Microelectronics (IME) and several companies have formed a new consortium to propel the development of hybrid bonding technology for chip-packaging applications. The group, called the Chip-to-Wafer (C2W) Hybrid Bonding Consortium, includes A*STAR’s IME organization, Applied Materials, ASM Pacific, Capcon, HD MicroSystems, ONT... » read more

Manufacturing Bits: Feb. 8
By Mark LaPedus - 08 Feb, 2021 - Comments: 0

Metalens for AR/VR The Harvard John A. Paulson School of Engineering and Applied Sciences has developed a new lens technology for use in next-generation virtual and augmented reality systems. Researchers have developed a so-called metalens technology. The two-millimeter achromatic metalens is capable of focusing the RGB (red, green, blue) colors at once without any aberrations. Today, s... » read more

Manufacturing Bits: Feb. 2
By Mark LaPedus - 02 Feb, 2021 - Comments: 0

Capacitor-less DRAM At the recent 2020 International Electron Devices Meeting (IEDM), Imec presented a paper on a novel capacitor-less DRAM cell architecture. DRAM is used for main memory in systems, and today’s most advanced devices are based on roughly 18nm to 15nm processes. The physical limit for DRAM is somewhere around 10nm. DRAM itself is based on a one-transistor, one-capacito... » read more

Manufacturing Bits: Jan. 26
By Mark LaPedus - 26 Jan, 2021 - Comments: 1

EU FIB project The European Union (EU) has launched a new project to develop next-generation structures and materials using focused ion beam (FIB) systems. The EU project, dubbed Focused Ion Technology for Nanomaterials or FIT4NANO, is spearheaded by the Helmholtz-Zentrum Dresden-Rossendorf (HZDR) organization. The project aims to bring European researchers and companies together to develop... » read more

Manufacturing Bits: Jan. 19
By Mark LaPedus - 19 Jan, 2021 - Comments: 0

X-ray imaging with AI The U.S. Department of Energy’s Argonne National Laboratory has demonstrated the use of artificial intelligence (AI) to accelerate the process of reconstructing images from coherent X-ray scattering data. Argonne’s technology, called PtychoNN, combines an X-ray imaging technique called ptychography with a neural network. This in turn enables researchers to decode X... » read more

Manufacturing Bits: Jan. 11
By Mark LaPedus - 11 Jan, 2021 - Comments: 0

3D printing with liquids Martin Luther University Halle-Wittenberg (MLU) has developed a way to combine both materials and liquids in 3D printing applications. Researchers from MLU have developed liquid‐filled capsules using 3D printing technology. This in turn enables new medical agents to be incorporated into pharmaceutical products. It also allows liquids to be integrated into material... » read more

Manufacturing Bits: Jan. 5
By Mark LaPedus - 05 Jan, 2021 - Comments: 0

Gallium oxide chips The National Renewable Energy Laboratory (NREL), the Colorado School of Mines, and Saint-Gobain Crystals have teamed up to develop manufacturing technologies and devices based on an emerging material called gallium oxide. This work is part of a three-year program, dubbed the Oxide Electronic Devices for Extreme Operating Environments project, which is funded by the U.S. ... » read more

Manufacturing Bits: Dec. 29
By Mark LaPedus - 29 Dec, 2020 - Comments: 1

Chiplet-based exascale computers At the recent IEEE International Electron Devices Meeting (IEDM), CEA-Leti presented a paper on a 3D chiplet technology that enables exascale-level computing systems. The United States and other nations are working on exascale supercomputers. Today’s supercomputers are measured in floating point operations per second. The world’s fastest supercomputers c... » read more

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