category: Round Tables

category: IoT, Security & Automotive

System-Level Verification Tackles New Role
By Brian Bailey - 15 Jun, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss advances in system-level verification with Larry Melling, product management director for the system verification group of [getentity id="22032" e_name="Cadence"]; Larry Lapides, vice president of sales for [getentity id="22036" e_name="Imperas”] and Jean-Marie Brunet, director of marketing for the emulation division of [getentity id="22017" e_nam... » read more

System-Level Verification Tackles New Role
By Brian Bailey - 09 Jun, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss advances in system-level verification with Larry Melling, product management director for the system verification group of [getentity id="22032" e_name="Cadence"]; Larry Lapides, VP of sales for [getentity id="22036" e_name="Imperas”] and Jean-Marie Brunet, director of marketing for the emulation division of [getentity id="22017" e_name="Mentor Gr... » read more

Formal Confusion
By Brian Bailey - 07 Jun, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss the right and wrong ways to apply formal verification technology with Normando Montecillo, associate technical director at [getentity id="22649" comment="Broadcom"]; Ashish Darbari, principal engineer at [getentity id="22709" e_name="Imagination Technologies"]; Roger Sabbagh, principal engineer at Huawei; and Stuart Hoad, lead engineer at PMC Sierra... » read more

Formal Confusion
By Brian Bailey - 26 May, 2016 - Comments: 0

Formal verification has come a long way in the past five years. Tool developers changed direction and started to create self-contained apps which have led to a rapid proliferation of the technology. But formal is a diverse set of tools that can solve a variety of problems in the verification space and this has created a different kind of confusion within the industry. To find out how the indust... » read more

2.5D Becomes A Reality
By Ed Sperling - 11 May, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss 2.5D and advanced packaging with Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; Rob Aitken, an [getentity id="22186" comment="ARM"] fellow; John Shin, vice president at [getentity id="22903" e_name="Marvell"]; Bill Isaacson, director of ASIC marketing at [getentity id="22242" e_name="eSilicon"]; Frank Ferro, senior di... » read more

System-Level Verification Tackles New Role
By Brian Bailey - 28 Apr, 2016 - Comments: 0

Wally Rhines, chairman and CEO of Mentor Graphics, gave the keynote at DVCon this year. He said that if you pull together a bunch of pre-verified IP blocks, it does not change the verification problem at the system level. That sounds like a problem. There are assumptions made that the IP blocks work to a reasonable degree, and that when performing system-level verification the focus is not a... » read more

2.5D Becomes A Reality
By Ed Sperling - 27 Apr, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss 2.5D and advanced packaging with Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; Rob Aitken, an [getentity id="22186" comment="ARM"] fellow; John Shin, vice president at [getentity id="22903" e_name="Marvell"]; Bill Isaacson, director of ASIC marketing at [getentity id="22242" e_name="eSilicon"]; Frank Ferro, senior di... » read more

Are Simulation’s Days Numbered?
By Brian Bailey - 26 Apr, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss the limitations of simulation in more complex designs with [getperson id="11049" comment="Michael McNamara"], CEO of [getentity id="22716" comment="Adapt-IP”]; Pete Hardee, product management director at [getentity id="22032" e_name="Cadence"]; David Kelf, vice president of marketing for for [getentity id="22395" e_name="OneSpin Solutions"]; Lauro... » read more

2.5D Becomes A Reality
By Ed Sperling - 14 Apr, 2016 - Comments: 2

Semiconductor Engineering sat down to discuss 2.5D and advanced packaging with Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; Rob Aitken, an [getentity id="22186" comment="ARM"] fellow; John Shin, vice president at [getentity id="22903" e_name="Marvell"]; Bill Isaacson, director of ASIC marketing at [getentity id="22242" e_name="eSilicon"]; Frank Ferro, senior di... » read more

Where Is Next-Gen Lithography?
By Mark LaPedus - 11 Apr, 2016 - Comments: 1

Semiconductor Engineering sat down to discuss lithography and photomask technologies with Greg McIntyre, director of the Advanced Patterning Department at Imec; Harry Levinson, senior fellow and senior director of technology research at GlobalFoundries; Uday Mitra, vice president and head of strategy and marketing for the Etch Business Unit and Patterning Module at Applied Materials; Naoya Haya... » read more

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