What’s Required To Secure Chips

By Ed Sperling - 06 Apr, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about how to verify that a semiconductor design will be secure, with Mike Borza, Synopsys scientist; John Hallman, product manager for trust and security at Siemens EDA; Pete Hardee, group director for product management at Cadence; Paul Karazuba, vice president of marketing at Expedera; and Dave Kelf, CEO of Breker Verification. ... » read more

Do Necessary Tools Exist For RISC-V Verification?

By Brian Bailey - 30 Mar, 2023 - Comments: 0

Semiconductor Engineering sat down to discuss the verification of RISC-V processors with Pete Hardee, group director for product management at Cadence; Mike Eftimakis, vice president for strategy and ecosystem at Codasip; Simon Davidmann, founder and CEO of Imperas Software; Sven Beyer, program manager for processor verification at Siemens EDA; Kiran Vittal, senior director of alliances partner... » read more

AI Becoming More Prominent In Chip Design

By Ed Sperling - 27 Mar, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about the role of AI in managing data and improving designs, and its growing role in pathfinding and preventing silent data corruption, with Michael Jackson, corporate vice president for R&D at Cadence; Joel Sumner, vice president of semiconductor and electronics engineering at National Instruments; Grace Yu, product and engineering manager at Meta... » read more

What Makes RISC-V Verification Unique?

By Brian Bailey - 09 Mar, 2023 - Comments: 0

AI: Engineering Tool Or Threat To Jobs?

By Ed Sperling - 02 Mar, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about using AI for designing and testing complex chips with Michael Jackson, corporate vice president for R&D at Cadence; Joel Sumner, vice president of semiconductor and electronics engineering at National Instruments; Grace Yu, product and engineering manager at Meta; David Pan, professor in the Department of Electrical and Computer Engineering a... » read more

Safety, Security, And Reliability Of AI In Autos

By Ed Sperling - 22 Feb, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about security, aging, and safety in automotive AI systems, with Geoff Tate, CEO of Flex Logix; Veerbhan Kheterpal, CEO of Quadric; Steve Teig, CEO of Perceive; and Kurt Busch, CEO of Syntiant. What follows are excerpts of that conversation, which was held in front of a live audience at DesignCon. Part one of this discussion is he... » read more

AI’s Impact In Automobiles Remains Uncertain

By Ed Sperling - 15 Feb, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about software updates in cars, where AI makes sense, and why there's a growing sense of optimism, with Geoff Tate, CEO of Flex Logix; Veerbhan Kheterpal, CEO of Quadric; Steve Teig, CEO of Perceive; and Kurt Busch, CEO of Syntiant. What follows are excerpts of that conversation, which were held in front of a live audience at Desi... » read more

Big Changes Ahead For Chip Technology And Industry Dynamics

By Ed Sperling - 08 Feb, 2023 - Comments: 0

Semiconductor Engineering sat down to discuss the impact of customization and advanced packaging, and concerns about reliability and geopolitical rivalries with Martin van den Brink, president and CTO of ASML; Luc Van den Hove, CEO of imec; David Fried, vice president of computational products at Lam Research; and Ankur Gupta, vice president and general manager of the test group and lifecycle s... » read more

Where And Why AI Makes Sense In Cars

By Ed Sperling - 02 Feb, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about where AI makes sense in automotive and what are the main challenges, with Geoff Tate, CEO of Flex Logix; Veerbhan Kheterpal, CEO of Quadric; Steve Teig, CEO of Perceive; and Kurt Busch, CEO of Syntiant. What follows are excerpts of that conversation, which were held in front of a live audience at DesignCon. Part two of this... » read more

Collaboration Widens Among Big Chip Companies

By Ed Sperling - 23 Jan, 2023 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the growing need for collaboration among equipment and tools vendors, the impact of systems companies and increases in complexity, and how to handle a push for more customization while controlling costs, with Martin van den Brink, president and CTO of ASML; Luc Van den Hove, CEO of imec; David Fried, vice president of computati... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

category: Round Tables

category: IoT, Security & Automotive