Decarbonizing Commercial Vehicles with Infineon Semiconductors

By Infineon - 03 Jul, 2024 - Comments: 0

Commercial, construction and agricultural vehicles (CAVs) are the backbone of industries that drive our global economy. Motivated by recent developments, the CAV industry is now undergoing a radical change: the journey toward electrification--from CAVS to eCAVs. The electrification of CAVs is a huge and promising challenge in which the semiconductors play a crucial role. Find more informatio... » read more

Holistic Verification and Validation of Automotive IP for Functional Safety SoCs

By Synopsys - 03 Jul, 2024 - Comments: 0

Automotive functional safety systems have strict requirements to help avoid damages to life and property in case of a failure. As technology becomes more complex, there are increasing safety-related risks from systematic failures and random hardware failures that must be considered during product development. Standards like ISO 26262 provide guidance to mitigate such safety-related risks, by de... » read more

Security Focus Widens To HW, SW, Ecosystems

By Ann Mutschler - 02 Jul, 2024 - Comments: 0

Hardware security strategies are pushing much further left in the chip design flow as the number of vulnerabilities in complex designs and connected devices continues to grow, taking into account potential vulnerabilities in both hardware and software, as well as the integrity of an extended global supply chain. These approaches leverage the speed of fixing problems in software, and the effe... » read more

Digital Twin And The Implications For Semiconductor Suppliers

By Jacob Wiltgen - 02 Jul, 2024 - Comments: 0

Automotive is a prime example of one industry where advanced semiconductors are forcing change across all aspects of vehicle development. Accelerated investment is fueling this industry wide evolution, driven by new business models, environmental regulations, and the evolution toward fully autonomous, software-defined vehicles. The demand for fully and semi-autonomous systems has a particula... » read more

Cyber Threats To The SECS/GEM Protocol In Smart Manufacturing

By YenTing Lee - 02 Jul, 2024 - Comments: 0

Semiconductors are an indispensable part of modern electronic products and are also a fundamental basis for the development of the AI industry. This industry is crucial for global economic growth and national security. As the semiconductor industry transitions to Industry 4.0, the connection between production equipment and factory networks has expanded the attack surface, providing adversaries... » read more

Power Stage Selection Considerations For High-Current Voltage Regulators

By Tammie Bard - 02 Jul, 2024 - Comments: 0

There are several key things to consider when selecting a power stage for high-current voltage regulators: What area does the power stage need to fit in? What is the continuous output current? What is the maximum peak current? This should not exceed the peak current rating of the power stage. What is the power loss for sustained output current? This can be calculated... » read more

Navigating Chiplet-Based Automotive Electronics Design With Advanced Tools And Flows

By Reela Samuel - 02 Jul, 2024 - Comments: 0

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which are themselves parts of a whole silicon system, offer unparalleled potential for improving system performance, reducing manufacturing costs, and accelerating time-to-market in the automotive secto... » read more

Thermal Challenges Multiply In Automotive, Embedded Devices

By Karen Heyman - 02 Jul, 2024 - Comments: 0

Embedding chips into stacked-die assemblies is creating thermal dissipation challenges that can reduce the reliability and lifespan of these devices, a growing problem as chipmakers begin cramming chiplets into advanced packages with thinner substrates between them. In the past, nearly all of these complex designs were used in tightly controlled environments, such as a large data center, whe... » read more

Securing Data In Heterogeneous Designs

By Adam Kovac - 02 Jul, 2024 - Comments: 0

Data security is becoming a bigger concern as chips are disaggregated into chiplets and various third-party IP blocks. There is no single solution that works for all designs, and no single tool or methodology that addresses everything in any design. Data is being transmitted across time zones, political borders, and even across multiple designs. Laws and the need to comply with standards may... » read more

Big Future In A Small Space: Wireless SoCs Enable Wearable Medical And Wellness Devices To Realize Their Potential

By David Renno - 02 Jul, 2024 - Comments: 0

By David Renno, David Armour, Melissa Hu, and Sezgi Koukourakis The technology of personal medical monitoring is changing incredibly fast. As little as ten years ago, the normal way that a patient would keep track of general health indicators, such as heart rate and blood pressure, or specific indicators such as blood glucose, was through an invasive medical procedure such as a blood test. S... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

category: IoT and Security

category: IoT, Security & Automotive