Scaling AI Chip Design With NoC Soft Tiling


Tiling is about repeating modular units within the same chip to enhance scalability and efficiency; chiplets involve combining different silicon pieces to achieve a more diverse and powerful system within a single package. Network-on-chip (NoC) soft tiling is complimentary but distinct from chiplets described above as it repeats modular units inside a NoC design. Soft tiling within a NoC off... » read more

Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 1


This is the first of a three-part series on HBM4 and gives an overview of the HBM standard. Part 2 will provide insights on HBM implementation challenges, and part 3 will introduce the concept of a custom HBM implementation. Relentless growth in data consumption Recent advances in deep learning have had a transformative effect on artificial intelligence (AI) and the ever-increasing volume of ... » read more

How To Speed Up LVS Verification


Layout versus schematic (LVS) comparison is a crucial step in integrated circuit (IC) design verification, ensuring that the physical layout of the circuit matches its schematic representation. The primary goal of LVS is to verify the correctness and functionality of the design. Traditionally, LVS comparison is performed during signoff verification, where dedicated tools compare layout and sche... » read more

Successful Design Of Power Management Chips


With an industry as large as semiconductors, there are often surprises lurking in some of the more specialized product categories. Everyone knows that huge chips such as CPUs and GPUs command high prices and that memory chips are ubiquitous. However, the domain of power management integrated circuits (PMICs) is less well known to many observers. PMICs are impressive in terms of their technol... » read more

Top-Down Vs. Bottom-Up Chiplet Design


Chiplets are gaining widespread attention across the semiconductor industry, but for this approach to really take off commercially it will require more standards, better modeling technologies and methodologies, and a hefty amount of investment and experimentation. The case for chiplets is well understood. They can speed up time to market with consistent results, at whatever process node work... » read more

The Latest Wireless Industry Use Cases


The wireless industry evolves constantly; GSMA estimates that mobile technologies and services generated 5% of the global GDP in 2022, which equates to $5.2 trillion of economic value. In parallel, more than 5.4 billion people subscribed to a mobile service, with 4.4 billion connected to the mobile internet. These numbers are impressive, but there is much more to come. 5G networks promise exp... » read more

Slow Progress On Generative EDA


Progress is being made in generative EDA, but the lack of training data remains the biggest problem. Some areas are finding ways around this. Generative AI, driven by large language models (LLMs), stormed into the world just two years ago, and since then has worked its way into almost every aspect of our lives. Some people love it, others hate it, and some even give dire warnings about machi... » read more

How AI Is Transforming System Design


Experts At The Table: ChatGPT and other LLMs have attracted most of the attention in recent years, but other forms of AI have long been incorporated into design workflows. The technology has become so common that many designers may not even realize it’s a part of the tools they use every day. But its adoption is spreading deeper into tools and methodologies. Semiconductor Engineering sat down... » read more

Outlook 2025: Embracing Chiplets


The semiconductor industry is rapidly evolving, and as we look towards 2025, chiplets are at the forefront of this transformation. The shift from traditional monolithic system-on-chip (SoC) designs to chiplet-based architectures is gaining momentum, driven by the need to meet ever-increasing computing demands. This evolution is not just a trend; it represents a fundamental change in how we appr... » read more

The Xpedition Flow


Comprehensive approach to designing electronics The complexities of modern PCB design necessitate a comprehensive approach that integrates various aspects of the entire design through manufacturing flow. The ideal design flow requires seamless cooperation and synergy across various domains, including electrical, mechanical, software, systems, test, and manufacturing. Xpedition provides a gr... » read more

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