Blog Review: July 19


Siemens' Keith Felton argues that co-design-driven semiconductor package planning and prototyping is critical for design success and points to how interchange formats enable designers to make trade-off decisions for both the package and the board and communicate those recommendations back to the other design team in formats that are native to their tools. Cadence's Xin Mu explains precoding ... » read more

RTL Restructuring Issues


Modification of modules in RTL is the last place in chip design where changes can be made relatively easily before they reach physical design, but it’s still as complicated as the design itself — and it becomes more difficult in 3D-ICs. Jim Schultz, product marketing manager for digital design implementation at Synopsys, talks about grouping and ungrouping, re-parenting, and breaking connec... » read more

Megatrends At DAC


Spotting key trends over three days of a semiconductor design conference is a challenge, but some important ones come into focus after attending multiple sessions — AI/ML, chiplet integration, and heterogeneous integration in an SoC and package. Frank Schirrmeister, vice president solutions and business development at Arteris IP, talks about a variety of topics that fit under the DAC umbrella... » read more

Week In Review: Design, Low Power


DAC and SEMICON WEST rebounded this year, focusing on everything from security to chiplets and smart manufacturing. Panel at DAC conference: Left to right, ARM’s Brian Fuller (moderator), Joe Costello (Metrics, Kwikbit, Arrikto, Acromove), and Wally Rhines (Cornami). Source: Semiconductor Engineering/Ann Mutschler EDA and IP remain strong, approaching $4 billion in Q1, according to ... » read more

EDA, IP Fundamentals Shift As Market Soars


EDA tools and IP continued their double-digit growth trajectory this year, despite a downturn in consumer electronics and a continued shortage of key components that took a large bite out of the semiconductor market as a whole. A just-released report from the ESD Alliance showed a 12% increase in revenue for Q1, increasing to $3.95 billion compared with $3.53 billion in the same period in 20... » read more

Startup Funding: June 2023


June saw several large funding rounds, with seven of at least $100 million. Over half a billion dollars alone went to a Chinese company manufacturing silicon carbide (SiC) power semiconductors. The wide band gap material has seen steady interest from investors, particularly for its potential use in electric vehicles. Another of the month's mega-rounds went to a company designing RISC-V SoCs ... » read more

Week In Review: Design, Low Power


Worldwide semiconductor industry sales dropped 21% year-over-year in May to $40.7 billion, mostly driven by decreases in the Americas (-22%), Asia Pacific/All Other (-23%), and China (-29%). But there also were hints of a recovery. The three-month moving average showed a 1.7% increase in sales, with the largest increases in China (+3.9%) and Europe (+2%). “Despite continuing market sluggishne... » read more

Week In Review: Design, Low Power


Keysight Technologies said it intends to acquire ESI Group for €913 million (~$998.6 million). ESI Group provides virtual prototyping solutions for the automotive and aerospace end markets that can create real-time digital twins to simulate a product's behavior during testing and real-life use. MLCommons announced the latest results from two MLPerf benchmark suites. One aims to measure the... » read more

Supercomputing Efficiency Lags Performance Gains


In last month’s article, Top 500: Frontier is Still on Top, I wrote about the latest versions of the Top500 and Green500 lists. Power is an incredibly important aspect of designing a world performance leading supercomputer. (Why, I can remember back to when you could run the world’s fastest machine on only a couple MW of power.) The first Green500 list was published back in 2013. Happy 1... » read more

Challenges Grow For Data Management And Sharing In EDA


Semiconductor Engineering sat down to talk about more openness in EDA data, how increased complexity is affecting time to working silicon, and the impact of geopolitics, with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business U... » read more

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