category: Communication/Data Movement

category: IoT, Security & Automotive

Workload-Specific Data Movements Across AI Workloads in Multi-Chiplet AI Accelerators
By Technical Paper Link - 04 Nov, 2024 - Comments: 0

A new technical paper titled "Communication Characterization of AI Workloads for Large-scale Multi-chiplet Accelerators" was published by researchers at Universitat Politecnica de Catalunya. Abstract "Next-generation artificial intelligence (AI) workloads are posing challenges of scalability and robustness in terms of execution time due to their intrinsic evolving data-intensive characteris... » read more

Method To Determine The Permittivity of Dielectric Materials in 3D Integrated Structures At Broadband RF Frequencies
By Technical Paper Link - 25 Sep, 2024 - Comments: 0

A new technical paper titled "Characterizing the Broadband RF Permittivity of 3D-Integrated Layers in a Glass Wafer Stack from 100 MHz to 30 GHz" was published by researchers at NIST. Abstract "We present a method for accurately determining the permittivity of dielectric materials in 3D integrated structures at broadband RF frequencies. With applications of microwave and millimeter-wave ele... » read more

Flip-Chip Bonding Technique To Excite LN Resonators Via Noncontact Electrodes (Yale)
By Technical Paper Link - 09 Sep, 2024 - Comments: 0

A new technical paper titled "Noncontact excitation of multi-GHz lithium niobate electromechanical resonators" was published by researchers at Yale University. Abstract "The demand for high-performance electromechanical resonators is ever-growing across diverse applications, ranging from sensing and time-keeping to advanced communication devices. Among the electromechanical materials being ... » read more

DL Compiler for Efficiently Utilizing Inter-Core Connected AI Chips (UIUC, Microsoft)
By Technical Paper Link - 28 Aug, 2024 - Comments: 0

A new technical paper titled "Scaling Deep Learning Computation over the Inter-Core Connected Intelligence Processor" was published by researchers at UIUC and Microsoft Research. Abstract "As AI chips incorporate numerous parallelized cores to scale deep learning (DL) computing, inter-core communication is enabled recently by employing high-bandwidth and low-latency interconnect links on th... » read more

Characterizing Three Supercomputers: Multi-GPU Interconnect Performance
By Technical Paper Link - 27 Aug, 2024 - Comments: 0

A new technical paper titled "Exploring GPU-to-GPU Communication: Insights into Supercomputer Interconnects" was published by researchers at Sapienza University of Rome, University of Trento, Vrije Universiteit Amsterdam, ETH Zurich, CINECA, University of Antwerp, IBM Research Europe, HPE Cray, and NVIDIA. Abstract "Multi-GPU nodes are increasingly common in the rapidly evolving landscape... » read more

6G And Beyond: Overall Vision And Survey of Research
By Technical Paper Link - 16 Jul, 2024 - Comments: 0

A new 92 page technical paper titled "6G: The Intelligent Network of Everything -- A Comprehensive Vision, Survey, and Tutorial" was published by IEEE researchers at Finland's University of Oulu. Abstract "The global 6G vision has taken its shape after years of international research and development efforts. This work culminated in ITU-R's Recommendation on "IMT-2030 Framework". While the d... » read more

On-Chip Communication For Programmable Accelerators In Heterogeneous SoCs (Columbia, IBM)
By Technical Paper Link - 10 Jul, 2024 - Comments: 0

A technical paper titled “Towards Generalized On-Chip Communication for Programmable Accelerators in Heterogeneous Architectures” was published by researchers at Columbia University and IBM Thomas J. Watson Research Center. Abstract: "We present several enhancements to the open-source ESP platform to support flexible and efficient on-chip communication for programmable accelerators in het... » read more

CMOS ICs for 77 GHz Automotive Radar
By Technical Paper Link - 28 May, 2024 - Comments: 0

A new technical paper titled "CMOS IC Solutions for the 77 GHz Radar Sensor in Automotive Applications" was published by researchers at STMicroelectronics and University of Catania. Abstract "This paper presents recent results on CMOS integrated circuits for automotive radar sensor applications in the 77 GHz frequency band. It is well demonstrated that nano-scale CMOS technologies are the b... » read more

RF General-Purpose Photonic Processor
By Technical Paper Link - 17 Apr, 2024 - Comments: 0

A new technical paper titled "General-purpose programmable photonic processor for advanced radiofrequency applications" was published by researchers at Universitat Politècnica de València and iPronics. Abstract "A general-purpose photonic processor can be built integrating a silicon photonic programmable core in a technology stack comprising an electronic monitoring and controlling layer ... » read more

3-Channel Package-Scale Galvanic Isolation Interface for SiC and GaN Power Switching Converters
By Technical Paper Link - 09 Apr, 2024 - Comments: 0

A new technical paper titled "A Three-Channel Package-Scale Galvanic Isolation Interface for Wide Bandgap Gate Drivers" was published by STMicroelectronics and DIEEI, Università di Catania. Abstract "This article presents the design of a three-channel package-scale galvanic isolation interface for SiC and GaN power switching converters. The isolation interface consists of two side-by-sid... » read more

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