category: Manufacturing

category: IoT, Security & Automotive

Integration Of Layered Semimetals With Conventional CMOS Platform
By Technical Paper Link - 27 Sep, 2023 - Comments: 0

A technical paper titled “Layered semimetal electrodes for future heterogeneous electronics” was published by researchers at IIT Madras and Indian Institute of Science Education and Research. Abstract: "Integration of the emerging layered materials with the existing CMOS platform is a promising solution to enhance the performance and functionalities of the future CMOS based integrated cir... » read more

EUVL: Extreme Ultraviolet Lithography Research, Development, And Manufacturing (NIST)
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A special paper titled “Report from the Extreme Ultraviolet (EUV) Lithography Working Group Meeting: Current State, Needs, and Path Forwards” was published by researchers at National Institute of Standards and Technology (NIST). Abstract: "This is the report of a hybrid working group meeting held on April 25, 2023, at the National Institute of Standards and Technology (NIST) in Boulder, C... » read more

Wafer-Scale CMOS-Integrated GFET Arrays With High Yield And Uniformity Designed For Biosensing Applications
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A technical paper titled “Wafer-Scale Graphene Field-Effect Transistor Biosensor Arrays with Monolithic CMOS Readout” was published by researchers at VTT Technical Research Centre of Finland and Graphenea Semiconductor SLU. Abstract: "The reliability of analysis is becoming increasingly important as point-of-care diagnostics are transitioning from single-analyte detection toward multiplex... » read more

An Eco-Friendly Conductive Ink For Thin-Film Electronics
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A technical paper titled “Recyclable Thin-Film Soft Electronics for Smart Packaging and E-Skins” was published by researchers at Carnegie Mellon University and University of Coimbra. Abstract: Despite advances in soft, sticker-like electronics, few efforts have dealt with the challenge of electronic waste. Here, this is addressed by introducing an eco-friendly conductive ink for thin-film... » read more

Investigating The Ru/Ta Bilayer As An Alternative EUV Absorber To Mitigate Mask 3D Effects
By Technical Paper Link - 28 Aug, 2023 - Comments: 0

A technical paper titled “Ru/Ta bilayer approach to EUV mask absorbers: Experimental patterning and simulated imaging perspective” was published by researchers at KU Leuven and imec. Abstract: "The optical properties and geometry of EUV mask absorbers play an essential role in determining the imaging performance of a mask in EUV lithography. Imaging metrics, including Normalized Imag... » read more

Contacting Individual On-Surface Synthesized Graphene Nanoribbons In A Multigate Transistor Geometry 
By Technical Paper Link - 28 Aug, 2023 - Comments: 0

A technical paper titled “Contacting individual graphene nanoribbons using carbon nanotube electrodes” was published by researchers at Swiss Federal Laboratories for Materials Science and Technology, Peking University, University of Warwick, National Center for Nanoscience and Technology (China), Max Planck Institute for Polymer Research, University of Bern, University of Basel, and ETH Zur... » read more

Flexible Hybrid Electronics: Future Standards For Next-Gen 5G/mmWave Wearable and Conformal Applications
By Technical Paper Link - 15 Aug, 2023 - Comments: 0

A technical paper titled “Additively manufactured flexible on-package phased array antennas for 5G/mmWave wearable and conformal digital twin and massive MIMO applications” was published by researchers at Georgia Institute of Technology. Abstract: "This paper thoroughly investigates material characterization, reliability evaluation, fabrication, and assembly processes of additively manufa... » read more

High-Performance P-Type FET Arrays With Single-Crystal 2D Semiconductors And Fermi-Level-Tuned vdW Contact Electrodes
By Technical Paper Link - 15 Aug, 2023 - Comments: 0

A technical paper titled “Fabrication of p-type 2D single-crystalline transistor arrays with Fermi-level-tuned van der Waals semimetal electrodes” was published by researchers at Ulsan National Institute of Science and Technology (UNIST), University of Pennsylvania, Institute for Basic Science (IBS), Sogang University, and Changwon National University. Abstract: "High-performance p-type t... » read more

Industry 4.0 Paradigms For Chip Workforce Development And Domestic Production: Using Automation And AR/VR
By Technical Paper Link - 07 Aug, 2023 - Comments: 0

A technical paper titled “From Talent Shortage to Workforce Excellence in the CHIPS Act Era: Harnessing Industry 4.0 Paradigms for a Sustainable Future in Domestic Chip Production” was published by researchers at University of Florida Gainesville, ZEISS Microscopy, and US Partnership for Assured Electronics (USPAE). Abstract: "The CHIPS Act is driving the U.S. towards a self-sustainable f... » read more

Performance Enhancement Of An Si Photodetector By Incorporating Photon-Trapping Surface Structures
By Technical Paper Link - 02 Aug, 2023 - Comments: 0

A technical paper titled “Achieving higher photoabsorption than group III-V semiconductors in ultrafast thin silicon photodetectors with integrated photon-trapping surface structures” was published by researchers at University of California Davis, W&WSens Devices Inc., and University of California Santa Cruz. Abstract: "The photosensitivity of silicon is inherently very low in the vis... » read more

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