category: Manufacturing

category: IoT, Security & Automotive

Technique For Printing Electronic Circuits Onto Curved & Corrugated Surfaces Using Metal Nanowires (NC State)
By Technical Paper Link - 10 Jan, 2023 - Comments: 0

A technical paper titled "Curvilinear soft electronics by micromolding of metal nanowires in capillaries" was published by researchers at North Carolina State University. “We’ve developed a technique that doesn’t require binding agents and that allows us to print on a variety of curvilinear surfaces,” says Yuxuan Liu, first author of the paper and a Ph.D. student at NC State in this ... » read more

New Technique For Making Thin Films of Perovskite Oxide Semiconductors
By Technical Paper Link - 06 Jan, 2023 - Comments: 0

A technical paper titled "Freestanding epitaxial SrTiO3  nanomembranes via remote epitaxy using hybrid molecular beam epitaxy" was published by researchers at University of Minnesota Twin Cities, Pacific Northwest National Laboratory, and University of Wisconsin–Madison. The researchers developed a new technique for making thin films of perovskite oxide semiconductors.  The development c... » read more

Graphene-Based Electronics (Georgia Tech)
By Technical Paper Link - 02 Jan, 2023 - Comments: 0

A technical paper titled "An epitaxial graphene platform for zero-energy edge state nanoelectronics" was published by researchers at Georgia Tech, Tianjin University, CNRS, Synchrotron SOLEIL, National High Magnetic Field Laboratory and others. “Graphene’s power lies in its flat, two-dimensional structure that is held together by the strongest chemical bonds known,” said Walter de Heer... » read more

Scalable Technique Producing Thin Lightweight Solar Cells That Turn Any Surface Into A Power Source (MIT)
By Technical Paper Link - 20 Dec, 2022 - Comments: 0

A new technical paper titled "Printed Organic Photovoltaic Modules on Transferable Ultra-thin Substrates as Additive Power Sources" was published by researchers at MIT. "These durable, flexible solar cells, which are much thinner than a human hair, are glued to a strong, lightweight fabric, making them easy to install on a fixed surface. They can provide energy on the go as a wearable power ... » read more

Graphene Devices: Suppressing Vibrations By Adding Vibrations (FLEET)
By Technical Paper Link - 15 Dec, 2022 - Comments: 0

A technical paper titled "Passivating Graphene and Suppressing Interfacial Phonon Scattering with Mechanically Transferred Large-Area Ga2O3" was published by researchers at ARC Centre of Excellence in Future Low-Energy Electronics Technologies (FLEET), Monash University and University of Melbourne. According to FLEET's news article, the research found: -Ultra-thin, liquid-metal-printed oxid... » read more

New Method to Measure, At The Wafer Scale, Direct Bonding Energies (CEA-LETI)
By Technical Paper Link - 12 Dec, 2022 - Comments: 0

A new technical paper titled "Double cantilever beam bonding energy measurement using confocal IR microscopy" was published by researchers at Univ. Grenoble Alpes, CEA-LETI and SOITEC, Parc Technologique des Fontaines. "A new technique is assessed in order to measure, at the wafer scale, direct bonding energies. It is derived from the standard Double Cantilever Beam (DCB) method and uses int... » read more

Rubbery Schottky Diodes Based on Soft, Stretchy Electronic Materials (Penn State)
By Technical Paper Link - 06 Dec, 2022 - Comments: 0

A new technical paper titled "Fully rubbery Schottky diode and integrated devices" was published by researchers at Penn State University. The Office of Naval Research and the National Science Foundation funded this research. "Here, we report a fully rubbery Schottky diode constructed all based on stretchable electronic materials, including a liquid metal cathode, a rubbery semiconductor, and... » read more

An Arrangement of Chiplets That Outperforms A Grid Arrangement (ETH Zurich / U. of Bologna)
By Technical Paper Link - 01 Dec, 2022 - Comments: 0

A research paper titled "HexaMesh: Scaling to Hundreds of Chiplets with an Optimized Chiplet Arrangement" was published by researchers at ETH Zurich and University of Bologna. Abstract: "2.5D integration is an important technique to tackle the growing cost of manufacturing chips in advanced technology nodes. This poses the challenge of providing high-performance inter-chiplet interconnects ... » read more

MAC Operation on 28nm High-k Metal Gate FeFET-based Memory Array with ADC (Fraunhofer IPMS/GF)
By Technical Paper Link - 01 Dec, 2022 - Comments: 0

A technical paper titled "Demonstration of Multiply-Accumulate Operation With 28 nm FeFET Crossbar Array" was published by researchers at Fraunhofer IPMS and GlobalFoundries. Abstract "This letter reports a linear multiply-accumulate (MAC) operation conducted on a crossbar memory array based on 28nm high-k metal gate (HKMG) Complementary Metal Oxide Semiconductor (CMOS) and ferroelectric fi... » read more

3D Structuring Inside GaAs by Ultrafast Laser Inscription
By Technical Paper Link - 28 Nov, 2022 - Comments: 0

A new technical paper titled "Burst mode enabled ultrafast laser inscription inside gallium arsenide" was published by researchers at LP3 Laboratory in France, a joint research unit of Aix-Marseille University (AMU) and CNRS. "We investigate the possibility of using THzrepetition-rate burst mode for ULI inside GaAs, a material that cannot be internally processed with single femtosecond pulse... » read more

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