category: Manufacturing

category: IoT, Security & Automotive

X-Ray Device Alteration (XDA) Of Flip-Chip Packaged FinFET Devices
By Technical Paper Link - 23 Nov, 2022 - Comments: 0

A new technical paper titled "X-Ray Device Alteration Using a Scanning X-Ray Microscope" was published by researchers at NVIDIA and Sigray. "Near Infra-Red (NIR) techniques such as Laser Voltage Probing/Imaging (LVP/I), Dynamic Laser Stimulation (DLS), and Photon Emission Microscopy (PEM) are indispensable for Electrical Fault Isolation/Electrical Failure Analysis (EFI/EFA) of silicon Integr... » read more

Lithography Modeling: Data Augmentation Framework
By Technical Paper Link - 17 Nov, 2022 - Comments: 0

A new technical paper titled "An Adversarial Active Sampling-based Data Augmentation Framework for Manufacturable Chip Design" was published by researchers at the University of Texas at Austin, Nvidia, and the California Institute of Technology. Abstract: "Lithography modeling is a crucial problem in chip design to ensure a chip design mask is manufacturable. It requires rigorous simulation... » read more

Semiconductor Manufacturing: Tradeoffs Between Performance, Energy Consumption & Cybersecurity Controls
By Technical Paper Link - 08 Nov, 2022 - Comments: 0

A new research paper titled "Simulating Energy and Security Interactions in Semiconductor Manufacturing: Insights from the Intel Minifab Model" was published by researchers at Idaho National Laboratory, University of Texas at Austin, University of Texas at San Antonio and George Mason University. Abstract: "Semiconductor manufacturing is a highly complex. Fabrication plants must deal with r... » read more

Using More Germanium In Chips for Energy Efficiency & Achievable Clock Frequencies
By Technical Paper Link - 08 Nov, 2022 - Comments: 0

A new technical paper titled "Composition Dependent Electrical Transport in Si1−xGex Nanosheets with Monolithic Single-Elementary Al Contacts" was published by researchers at TU Wien (Vienna University of Technology), Johannes Kepler University, CEA-LETI, and Swiss Federal Laboratories for Materials Science and Technology. Find the technical paper here. Published September 2022. Abstrac... » read more

Novel Multi-Independent Gate-Controlled FinFET Technology
By Technical Paper Link - 08 Nov, 2022 - Comments: 0

A new technical paper titled "Characteristics of a Novel FinFET with Multi-Enhanced Operation Gates (MEOG FinFET)" was published by researchers at Changzhou University. Abstract: "This study illustrates a type of novel device. Integrating fin field-effect transistors (FinFETs) with current silicon-on-insulator (SOI) wafers provides an excellent platform to fabricate advanced specific device... » read more

Red MicroLEDs Three Orders of Magnitude Smaller in Surface Area
By Technical Paper Link - 08 Nov, 2022 - Comments: 0

A technical paper titled "N-polar InGaN/GaN nanowires: overcoming the efficiency cliff of red-emitting micro-LEDs" was published by researchers at University of Michigan. The researchers created "red-microLEDs that are nearly three orders of magnitude smaller in surface area than previously reported devices while exhibiting external quantum efficiency of ~1.2%," according to the University o... » read more

Using BDA To to Predict SAQP Pitch Walk
By Technical Paper Link - 08 Nov, 2022 - Comments: 0

A new technical paper titled "Bayesian dropout approximation in deep learning neural networks: analysis of self-aligned quadruple patterning" was published by researchers at IBM TJ Watson Research Center and Rensselaer Polytechnic Institute. Find the technical paper here. Published November 2022.  Open Access. Scott D. Halle, Derren N. Dunn, Allen H. Gabor, Max O. Bloomfield, and Mark Sh... » read more

Full Wafer Integration of Aggressively Scaled 2D-Based Logic Circuits (Imec)
By Technical Paper Link - 28 Oct, 2022 - Comments: 0

A technical paper titled "Challenges of Wafer-Scale Integration of 2D Semiconductors for High-Performance Transistor Circuits" was published by researchers at Imec. "The introduction of highly scaled 2D-based circuits for high-performance logic applications in production is projected to be implemented after the Si-sheet-based CFET devices. Here, a view on the requirements needed for full waf... » read more

Site-Specific Compositional Info from Periodic Nanostructures Obtained Using Rutherford Backscattering Spectrometry
By Technical Paper Link - 28 Oct, 2022 - Comments: 0

A new technical paper titled "Quantification of area-selective deposition on nanometer-scale patterns using Rutherford backscattering spectrometry" was published by researchers at IMEC and KU Leuven. "We present a site-specific elemental analysis of nano-scale patterns whereby the data acquisition is based on Rutherford backscattering spectrometry (RBS). The analysis builds on probing a larg... » read more

Bottoms Up: Arranging Nanoscale Particles On A Silicon Chip (Or Other Materials) Without Damage
By Technical Paper Link - 26 Oct, 2022 - Comments: 0

A new research paper titled "Nanoparticle contact printing with interfacial engineering for deterministic integration into functional structures" was just published by researchers at MIT. “This approach allows you, through engineering of forces, to place the nanoparticles, despite their very small size, in deterministic arrangements with single-particle resolution and on diverse surfaces, ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy