category: Manufacturing

category: IoT, Security & Automotive

Vertically Stacked ZnO/Te CFETs (POSTECH, Mokpo)
By Technical Paper Link - 09 Jun, 2025 - Comments: 0

A new technical paper titled "Demonstration of Vertically Stacked ZnO/Te Complementary Field-Effect Transistor" was published by researchers at POSTECH and Mokpo National University. Abstract "The complementary field-effect transistor (CFET) structure is a highly area-efficient technology. However, their fabrication entails highly complex integration processes using wafer transfer or recr... » read more

Determinants Of Bond Wave Speed In Wafer Bonding (Yokohama, TEL)
By Technical Paper Link - 05 Jun, 2025 - Comments: 0

A recent technical paper titled "Factors determining bond wave speed in wafer bonding" was published by researcher at Yokohama National University, Tokyo Electron Kyushu Limited and ANVOS Analytics. Abstract "Wafer-level direct bonding has become a critical process for advanced 3D architectures in logic, memory, and CMOS image sensors. The minimization of the wafer distortion caused by wafe... » read more

Quantifying The PFAS Impact In ICs Manufacturing (Harvard University)
By Technical Paper Link - 03 Jun, 2025 - Comments: 0

A new technical paper titled "Modeling PFAS in Semiconductor Manufacturing to Quantify Trade-offs in Energy Efficiency and Environmental Impact of Computing Systems" was published by researchers at Harvard University and Mohamed Bin Zayed University of AI (MBZUAI). "The electronics and semiconductor industry is a prominent consumer of per- and poly-fluoroalkyl substances (PFAS), also known a... » read more

Electrical Properties of ML and BL MoS2 GAA NS FETs With Source/Drain Metal Contacts (NYCU)
By Technical Paper Link - 31 May, 2025 - Comments: 0

A new technical paper titled "Electrical Characteristics of ML and BL MoS2 GAA NS FETs With Source/Drain Metal Contacts" was published by researchers at National Yang Ming Chiao Tung University. Abstract "This paper reports source/drain (S/D) contact issues in monolayer and bilayer (BL) MoS2 devices through density-functional-theory (DFT) calculation and device simulation. We begin by ana... » read more

Role of Josephson Junctions In Propelling Quantum Technologies Forward (LBNL, UC Berkeley, et al.)
By Technical Paper Link - 31 May, 2025 - Comments: 0

A new technical paper titled "Josephson Junctions in the Age of Quantum Discovery" was published by researchers at Lawrence Berkeley National Laboratory, UC Berkeley, Gwangju Institute of Science and Technology, Korea University, Max Planck and Anyon Computing. Abstract "The unique combination of energy conservation and nonlinear behavior exhibited by Josephson junctions has driven transfor... » read more

Optimization Approach For The Dispensing of Thermal Interface Material (KIT, Robert Bosch)
By Technical Paper Link - 21 May, 2025 - Comments: 0

A new technical paper titled "TIMtrace: Coverage Path Planning for Thermal Interface Materials" was published by researchers at Karlsruhe Institute of Technology (KIT) and Robert Bosch GmbH. Abstract "Thermal Interface Materials are used to transfer heat from a semiconductor to a heatsink. They are applied along a dispense path onto the semiconductor and spread over its entire surface once ... » read more

Transformation Of 2D-ICs Into 3D-ICs Using Shuttle Chips From Multi-Project Wafers (Tohoku University)
By Technical Paper Link - 20 May, 2025 - Comments: 0

A new technical paper titled "Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding" was published by researchers at Tohoku University. Abstract "Three-dimensional integrated circuit (3D-IC) technology, often referred to as through-silicon via (TSV) formation technology, has been steadily maturing and is increasingly used in advanced semic... » read more

Overview Of 103 Research Papers On Automatic SEM Image Analysis Algorithms For Semiconductor Defect Inspection (KU Leuven, Imec)
By Technical Paper Link - 20 May, 2025 - Comments: 0

A new technical paper titled "Scanning electron microscopy-based automatic defect inspection for semiconductor manufacturing: a systematic review" was published by researchers at KU Leuven and imec. "We identified, categorized, and discussed automatic defect inspection algorithms that analyze scanning electron microscopy (SEM) images for semiconductor manufacturing (SM). This is a topic of c... » read more

Demonstration Of EUV Scatterometry On A 2D Periodic Interconnect
By Technical Paper Link - 18 May, 2025 - Comments: 0

A new technical paper titled "Coherent EUV scatterometry of 2D periodic structure profiles with mathematically optimal experimental design" was published by researchers at University of Colorado, NIST, Samsung and KMLAbs. Abstract "Extreme ultraviolet (EUV) scatterometry is an increasingly important metrology that can measure critical parameters of periodic nanostructured materials in a fas... » read more

Novel Thin Film Growth Technique Of A WBG Sulfide Semiconductor in BEOL Compatible Conditions (USC, LBNL, TSMC)
By Technical Paper Link - 14 May, 2025 - Comments: 0

A new technical paper titled "Textured growth and electrical characterization of Zinc Sulfide on back-end-of-the-line (BEOL) compatible substrates" was published by researchers at USC, Lawrence Berkeley National Laboratory and TSMC. Abstract "Scaling of transistors has enabled continuous improvements in logic device performance, especially through materials engineering. However, surpassing ... » read more

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