category: Test, Measurement & Analytics

category: IoT, Security & Automotive

Active Learning to Reduce Data Requirements For Defect Identification in Semiconductor Manufacturing
By Technical Paper Link - 24 Oct, 2022 - Comments: 0

A new technical paper titled "Exploring Active Learning for Semiconductor Defect Segmentation" was published by researchers at Agency for Science, Technology and Research (A*STAR) in Singapore. "We identify two unique challenges when applying AL on semiconductor XRM scans: large domain shift and severe class-imbalance. To address these challenges, we propose to perform contrastive pretrainin... » read more

Visual Fault Inspection Using A Hybrid System Of Stacked DNNs
By Technical Paper Link - 29 Sep, 2022 - Comments: 0

A technical paper titled "Improving automated visual fault inspection for semiconductor manufacturing using a hybrid multistage system of deep neural networks" was published by researchers at Chemnitz University of Technology (Germany). According to the paper, "this contribution introduces a novel hybrid multistage system of stacked deep neural networks (SH-DNN) which allows the localization... » read more

Robust Latch Hardened Against QNUs for Safety-Critical Applications in 22nm CMOS Technology
By Technical Paper Link - 07 Sep, 2022 - Comments: 0

A technical paper titled "Cost-Optimized and Robust Latch Hardened against Quadruple Node Upsets for Nanoscale CMOS" was just published by researchers at Anhui University, Hefei University of Technology, Anhui Polytechnic University, Kyushu Institute of Technology, and the University of Montpellier/CNRS. Abstract: "With the aggressive reduction of CMOS transistor feature sizes, the soft ... » read more

Identifying PCB Defects with a Deep Learning Single-Step Detection Model
By Technical Paper Link - 22 Jul, 2022 - Comments: 0

This new technical paper titled "End-to-end deep learning framework for printed circuit board manufacturing defect classification" is from researchers at École de technologie supérieure (ÉTS) in Montreal, Quebec. Abstract "We report a complete deep-learning framework using a single-step object detection model in order to quickly and accurately detect and classify the types of manufacturi... » read more

Publicly Available Dataset for PCB X-Ray Inspection (FICS- University of Florida)
By Technical Paper Link - 19 Jul, 2022 - Comments: 0

Researchers from the Florida Institute for Cybersecurity (FICS) at the University of Florida published this technical paper titled "FICS PCB X-ray: A dataset for automated printed circuit board inter-layers inspection." Abstract "Advancements in computer vision and machine learning breakthroughs over the years have paved the way for automated X-ray inspection (AXI) of printed circuit bo... » read more

Coverage-Directed Test Selection Method for Automatic Test Biasing During Simulation-Based Verification
By Technical Paper Link - 22 Jun, 2022 - Comments: 0

New research paper titled "Supervised Learning for Coverage-Directed Test Selection in Simulation-Based Verification" from researchers at University of Bristol and Infineon Technologies. Abstract: "Constrained random test generation is one the most widely adopted methods for generating stimuli for simulation-based verification. Randomness leads to test diversity, but tests tend to repeate... » read more

Designing Hardware Accelerators Using A Data-Driven Approach
By Technical Paper Link - 21 Jun, 2022 - Comments: 0

Research paper titled "Data-Driven Offline Optimization For Architecting Hardware Accelerators" by researchers at Google Research and UC Berkeley. Abstract "Industry has gradually moved towards application-specific hardware accelerators in order to attain higher efficiency. While such a paradigm shift is already starting to show promising results, designers need to spend considerable man... » read more

Finding Wafer Defects Using Quantum DL
By Technical Paper Link - 13 Jun, 2022 - Comments: 0

New research paper titled "Semiconductor Defect Detection by Hybrid Classical-Quantum Deep Learning" by researchers at National Tsing Hua University. Abstract "With the rapid development of artificial intelligence and autonomous driving technology, the demand for semiconductors is projected to rise substantially. However, the massive expansion of semiconductor manufacturing and the develo... » read more

High-throughput LHSI Reflectometry Technique For ICU and IWU Measurements of Semiconductor Devices
By Technical Paper Link - 03 Jun, 2022 - Comments: 0

New technical paper titled "Toward realization of high-throughput hyperspectral imaging technique for semiconductor device metrology," from researchers at Samsung Electronics Co. Abstract "Background: High-throughput three-dimensional metrology techniques for monitoring in-wafer uniformity (IWU) and in-cell uniformity (ICU) are critical for enhancing the yield of modern semiconductor manu... » read more

Artificial intelligence deep learning for 3D IC reliability prediction
By Technical Paper Link - 25 Apr, 2022 - Comments: 0

New research from National Yang Ming Chiao Tung University, National Center for High-Performance Computing (Taiwan), Tunghai University, MA-Tek Inc, and UCLA. Abstract "Three-dimensional integrated circuit (3D IC) technologies have been receiving much attention recently due to the near-ending of Moore’s law of minimization in 2D IC. However, the reliability of 3D IC, which is greatly infl... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy