category: Top Stories

category: IoT, Security & Automotive

Startup Funding: December 2023
By Jesse Allen - 10 Jan, 2024 - Comments: 0

Photonics and optics were strong in December, with investors funding two different companies using photonic technologies to develop AI chips and interconnects. Another key area — metaoptics — combines what traditionally would be separate lenses and optical components into a single, flat nanopatterned device. Metaoptics are being deployed in applications ranging from AI processing and sensor... » read more

SRAM’s Role In Emerging Memories
By Karen Heyman - 05 Jan, 2024 - Comments: 1

Experts at the Table — Part 3: Semiconductor Engineering sat down to talk about AI, the latest issues in SRAM, and the potential impact of new types of memory, with Tony Chan Carusone, CTO at Alphawave Semi; Steve Roddy, chief marketing officer at Quadric; and Jongsin Yun, memory technologist at Siemens EDA. What follows are excerpts of that conversation. Part one of this conversation can be ... » read more

Analog Design Complicates Voltage Droop
By Ann Mutschler - 27 Dec, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about voltage droop in analog and mixed-signal designs, and the need for multi-vendor tool interoperability and more precision, with Bill Mullen, distinguished engineer at Ansys; Rajat Chaudhry, product management group director at Cadence; Heidi Barnes, senior applications engineer at Keysight; Venkatesh Santhanagopalan, product ... » read more

Using Real Workloads To Assess Thermal Impacts
By Ann Mutschler - 14 Dec, 2023 - Comments: 0

Thermal analysis is being driven much further left in the design, fueled by demand for increased transistor density and more features on a chip or in a package, as well as the unique ways the various components may be exercised or stressed. However, getting a clear picture of the thermal activity in advanced-node chips and packages is extremely complex, and it can vary significantly by use c... » read more

Data Formats For Inference On The Edge
By Brian Bailey - 14 Dec, 2023 - Comments: 0

AI/ML training traditionally has been performed using floating point data formats, primarily because that is what was available. But this usually isn't a viable option for inference on the edge, where more compact data formats are needed to reduce area and power. Compact data formats use less space, which is important in edge devices, but the bigger concern is the power needed to move around... » read more

Next-Gen Power Integrity Challenges
By Ed Sperling - 14 Dec, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss power integrity challenges and best practices in designs at 7nm and below, and in 2.5D and 3D-IC packages, with Chip Stratakos, partner, physical design at Microsoft; Mohit Jain, principal engineer at Qualcomm; Thomas Quan, director at TSMC; and Murat Becer, vice president at Ansys. What follows are excerpts of that conversatio... » read more

The Uncertain Future Of In-Memory Compute
By Karen Heyman - 13 Dec, 2023 - Comments: 0

Experts at the Table — Part 2: Semiconductor Engineering sat down to talk about AI and the latest issues in SRAM with Tony Chan Carusone, chief technology officer at Alphawave Semi; Steve Roddy, chief marketing officer at Quadric; and Jongsin Yun, memory technologist at Siemens EDA. What follows are excerpts of that conversation. Part one of this conversation can be found here and part 3 is h... » read more

Flipping Processor Design On Its Head
By Ann Mutschler - 09 Nov, 2023 - Comments: 2

AI is changing processor design in fundamental ways, combining customized processing elements for specific AI workloads with more traditional processors for other tasks. But the tradeoffs are increasingly confusing, complex, and challenging to manage. For example, workloads can change faster than the time it takes to churn out customized designs. In addition, the AI-specific processes may ex... » read more

An Entangled Heterarchy
By Brian Bailey - 09 Nov, 2023 - Comments: 1

For decades, a form of structural hierarchy has been the principal means of handling complexity in chip design. It's not always perfect, and there is no ideal way in which to divide and conquer because that would need to focus on the analysis being performed. In fact, most systems can be viewed from a variety of different hierarchies, equally correct, and together forming a heterarchy. The e... » read more

SRAM In AI: The Future Of Memory
By Karen Heyman - 09 Nov, 2023 - Comments: 0

Experts at the Table — Part 1: Semiconductor Engineering sat down to talk about AI and the latest issues in SRAM with Tony Chan Carusone, CTO at Alphawave Semi; Steve Roddy, chief marketing officer at Quadric; and Jongsin Yun, memory technologist at Siemens EDA. What follows are excerpts of that conversation. Part two of this conversation can be found here and part three is here. [L-R]: ... » read more

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