Gearing Up For Level 4 Vehicles

By John Koon - 05 Oct, 2023 - Comments: 0

More autonomous features are being added into high-end vehicles, but getting to full autonomy will likely take years more effort, a slew of new technologies — some of which are not in use today, and some of which involve infrastructure outside the vehicle — along with sufficient volume to bring the cost of these combined capabilities down to an affordable price point. In the meantime, ma... » read more

Quantum Plus AI Widens Cyberattack Threat Concerns

By John Koon - 18 Sep, 2023 - Comments: 1

Quantum computing promises revolutionary changes to the computing paradigm that the semiconductor industry has operated under for decades, but it also raises the prospect of widespread cybersecurity threats. Quantum computing cyberattacks will occur millions of times faster than any assault conventional computing can muster. And while quantum computing is in an early stage of development, ex... » read more

The Threat Of Supply Chain Insecurity

By Ann Mutschler - 07 Sep, 2023 - Comments: 3

Concerns about counterfeit chips are growing as more chips are deployed in safety- and mission-critical applications, prompting better traceability and new and inexpensive solutions that can determine if chips are new or used. But some counterfeit chips still slip through, and the problem gets worse wherever there are shortages. Estimates vary widely for how much counterfeiting costs in term... » read more

Designing Vehicles Virtually

By John Koon - 07 Sep, 2023 - Comments: 0

The shift toward software-defined vehicles (SDVs), electric vehicles (EVs), and ultimately autonomous vehicles (AVs) is proving the value and exposing the weaknesses in simulating individual components and complete vehicles. The ability to model this intensely complex maze of real-world interactions and possible scenarios is improving, and it's happening faster than comparable road-testing o... » read more

Setting Standards For The Chip Industry

By Karen Heyman - 07 Sep, 2023 - Comments: 2

For all the advances in semiconductor design, and the astonishing scales on which the industry now works, when it comes to standards committee meetings, not much has changed. Advice from a 91-year-old retired engineer can sound surprisingly like advice from those active today. Standards were then, and continue to be, a mix of technical compromises and corporate politics, as well as passionate a... » read more

Automotive Complexity, Supply Chain Strength Demands Tech Collaboration

By Ann Mutschler - 30 Aug, 2023 - Comments: 1

The automotive supply chain is becoming more complex and collaborative, changing longstanding relationships between automakers and their suppliers in ways that would have seemed unimaginable even a couple of years ago. Rather than just developing parts for a tightly defined specification, suppliers are taking an increasingly active role in determining how various technologies are combined, w... » read more

AI Transformer Models Enable Machine Vision Object Detection

By John Koon - 03 Aug, 2023 - Comments: 1

The object detection required for machine vision applications such as autonomous driving, smart manufacturing, and surveillance applications depends on AI modeling. The goal now is to improve the models and simplify their development. Over the years, many AI models have been introduced, including YOLO, Faster R-CNN, Mask R-CNN, RetinaNet, and others, to detect images or video signals, interp... » read more

Creating IP In The Shadow Of ISO 26262

By Karen Heyman - 03 Aug, 2023 - Comments: 0

On many levels, designing IP for the automotive sector is similar to targeting aerospace or medical devices — human lives are at risk if something goes wrong, and the list of regulations is significant. In practice, it can turn an interesting chip design project into a complex and often frustrating checklist exercise. In the case of ISO 26262, that includes a 12-part standard for automotiv... » read more

Multiple Hurdles In The Race To 6G

By John Koon - 03 Aug, 2023 - Comments: 0

The rollout of 6G will open the door to significant changes and possibilities, but whether this technology lives up to the hype will require massive collaborative efforts, huge investments in infrastructure, and solving some problems for which there are no precedents. Multiple companies are already working on 6G technology, aiming for a maximum download speed of one terabit per second (Tb/s)... » read more

Wi-Fi 7 Moves Forward, Adding Yet Another Protocol

By Karen Heyman - 17 Jul, 2023 - Comments: 1

The latest generation Wi-Fi protocol brings better speeds and data handling, but it does little to bridge various communications technologies. That, in turn, makes it more difficult and more expensive to design chips because they must integrate and support multiple wireless technologies, including different versions of the same technology. Wireless communications technologies are often victi... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

category: Top Stories

category: IoT, Security & Automotive