category: Top Stories

category: IoT, Security & Automotive

IC Power Optimization Required, But More Difficult To Achieve
By Adam Kovac - 18 Jul, 2024 - Comments: 0

Power optimization is playing an increasingly vital role in chip and chip and system designs, but it's also becoming much harder to achieve as transistor density and system complexity continue to grow. This is especially evident with advanced packages, chiplets, and high-performance chips, all of which are becoming more common in complex designs. Inside data centers, racks of servers are str... » read more

Data Center Thermal Management Improves
By Karen Heyman - 18 Jul, 2024 - Comments: 0

Thermal issues are plaguing semiconductor design at every level, from chips developed with single-digit nanometer processes to 100,000-square-foot data centers. The underlying cause is too many devices or services that require increasing amounts of power, and too few opportunities for the resulting heat to dissipate. “Everybody wants to try to do more in a small volume of space,” said St... » read more

Managing kW Power Budgets
By Ed Sperling - 17 Jul, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss increasing power demands and how to address it with Hans Yeager, senior principal engineer, architecture, at Tenstorrent; Joe Davis, senior director for Calibre interfaces and EM/IR product management at Siemens EDA; Mo Faisal, CEO of Movellus; Trey Roessig, CTO and senior vice president of engineering at Empower Semiconductor.... » read more

Intel Vs. Samsung Vs. TSMC
By Ed Sperling - 15 Jul, 2024 - Comments: 3

The three leading-edge foundries — Intel, Samsung, and TSMC — have started filling in some key pieces in their roadmaps, adding aggressive delivery dates for future generations of chip technology and setting the stage for significant improvements in performance with faster delivery time for custom designs. Unlike in the past, when a single industry roadmap dictated how to get to the next... » read more

Easing EV Range Anxiety Through Faster Charging
By Ann Mutschler - 11 Jul, 2024 - Comments: 0

The automotive industry is developing new ways to boost the range of electric vehicles and the speed at which they are charged, overcoming buyer hesitation that has limited the total percentage of EVs to 18% of vehicles being sold.[1] Work is underway to improve how batteries are engineered and manufactured, and how they are managed while they are in use or being charged. This extends well b... » read more

Startup Funding: Q2 2024
By Jesse Allen - 10 Jul, 2024 - Comments: 0

AI drew more investors to the chip industry in Q2. Four AI-focused chip startups receiving rounds of more than $100 million, targeting data center ASICs for transformers, highly flexible platforms for the embedded edge, dataflow processors, and mixed-signal neuromorphic chips. In-memory computing also helped boost AI, with three companies either incorporating it into their chips or providing sp... » read more

Delivering On Power During HPC Test
By Anne Meixner - 09 Jul, 2024 - Comments: 0

The industry’s insatiable need for power in high-performance computing (HPC) is creating problems for test cells, which need to deliver very high currents at very consistent voltage levels through the power delivery network (PDN). In response, ATE, wafer probe, and contactor vendors are introducing some innovative approaches and test procedures that can ensure robust power delivery to ATE pro... » read more

Digital Twins Find Their Footing In IC Manufacturing
By Laura Peters - 09 Jul, 2024 - Comments: 0

Momentum is building for digital twins in semiconductor manufacturing, tying together the various processes and steps to improve efficiency and quality, and to enable more flexibility in the fab and assembly house. The movement toward digital twins opens up a slew of opportunities, from building and equipping new fabs faster to speeding yield ramps by reducing the number of silicon-based tes... » read more

X-ray Inspection Becoming Essential In Advanced Packaging
By Gregory Haley - 09 Jul, 2024 - Comments: 0

X-ray technology is moving into the mainstream of chip manufacturing as complex assemblies and advanced packaging make it increasingly difficult to ensure these devices will work as expected throughout their lifecycles. A single defect in a chiplet or interconnect can transform a complex advanced package into expensive scrap, and the risk only increases as the chip industry shifts from homog... » read more

Security Focus Widens To HW, SW, Ecosystems
By Ann Mutschler - 02 Jul, 2024 - Comments: 0

Hardware security strategies are pushing much further left in the chip design flow as the number of vulnerabilities in complex designs and connected devices continues to grow, taking into account potential vulnerabilities in both hardware and software, as well as the integrity of an extended global supply chain. These approaches leverage the speed of fixing problems in software, and the effe... » read more

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