category: Top Stories

category: Auto, Security & Edge AI

Resistance In Advanced Packages Is Now A System-Level Problem
By Gregory Haley - 10 Feb, 2026 - Comments: 0

Key Takeaways Kelvin measurement, which has been in use for decades, is no longer sufficient for addressing resistance in complex chips. The problem is that resistance is no longer concentrated in transistors, and where it does show up isn't always consistent or obvious. Traditional pass/fail approaches need to be replaced by more granular and flexible analytics and methodologies. ... » read more

Chiplets Add More Inspection And Test Steps
By Anne Meixner - 10 Feb, 2026 - Comments: 0

Key Takeaways Ensuring the reliability of multi-die assemblies requires a variety of approaches to detect subsurface defects. Bonds and interconnects are especially problematic and require more inspection insertions. Ensuring reliability requires connecting fragmented data that is often siloed. The shift to multi-die assemblies is forcing changes in how chips are tested and ... » read more

Securing Hardware For The Quantum Era
By Ann Mutschler - 05 Feb, 2026 - Comments: 0

Key Takeaways: Quantum threats to security are already real. Adversaries are already harvesting data that will be decrypted later by quantum computers. Quantum computers capable of breaking RSA and ECC may arrive as early as next year. Asymmetric encryption algorithms like RSA and ECC will become inadequate against quantum threats, while symmetric encryption (such as AES) is less vul... » read more

Consumer And Med Tech Mushroom As Quantum Closes In
By Liz Allan - 05 Feb, 2026 - Comments: 0

Key Takeaways: Universities and companies are making devices inspired by biology and the human senses to help with health monitoring, semiconductor materials development, human-computer interfaces, and more. When this nascent technology becomes a viable product, government regulations will be needed to ensure consumer safety in tracking or treating their body and the environment. Qua... » read more

Flexible ICs, MEMS, Metal Oxides Solve Fresh Problems
By Liz Allan - 05 Feb, 2026 - Comments: 0

Key Takeaways: Flexible ICs are durable and form-fitting, but they add manufacturing challenges to already complex processes, while printed flex sensors lack infrastructure. MEMS are finding new popularity in massively parallel systems, on one device, or in many devices distributed across a network. Metal oxide-based sensors are more scalable than those relying on photonic crystals, ... » read more

Why Move To 2nm?
By Ed Sperling - 04 Feb, 2026 - Comments: 0

Key Takeaways: Scaling digital logic still provides significant benefits, especially lower power. Multi-die assemblies will be the predominant approach, and most of the circuitry will not be 2nm or below. While these systems are inherently more flexible, the number and complexity of tradeoffs required for optimizing PPA/C are increasing. The rollout of 2nm process nodes and ... » read more

Chiplet Fundamentals For Engineers: eBook
By Bryon Moyer - 02 Feb, 2026 - Comments: 1

Multi-die assemblies are the next phase of Moore's Law, scaling up and out  to improve performance and add flexibility into designs. By decomposing SoCs into building blocks, yield improves for the individual dies and overall performance increases because a chip is no longer bound by reticle limits. But this is much harder than it sounds. Chiplets don't just snap together like LEGOs, and so... » read more

Does Your RISC-V Core Meet The Standard?
By Brian Bailey - 29 Jan, 2026 - Comments: 0

Key Takeaways Architectural conformance and implementation verification are necessary but different for RISC-V designs, yet few verification engineers have experience on the conformance side. While RISC-V enables flexibility, there is a potential for ecosystem fragmentation. It is mathematically impossible to test every instruction combination, so engineers are moving beyond just "bl... » read more

Multi-Die Assemblies Require More Detailed Test Plan Earlier
By Ann Mutschler - 29 Jan, 2026 - Comments: 0

Key Takeaways Design for test takes on new urgency in complex multi-die assemblies, where it can be used to minimize downstream errors and the cost of fixing them. DFT needs to be increasingly detailed due to more connections and the inability to access some components. DFT strategies need to be developed earlier and may require multiple testing approaches. Multi-die assembl... » read more

AI’s Impact On Engineering Jobs May Be Different Than Expected
By Liz Allan - 29 Jan, 2026 - Comments: 0

Key Takeaways: AI is expected to eliminate many repetitive, entry-level tasks, but that may allow engineering students trained on the latest tools to start in more senior positions. AI is a force multiplier. It can accelerate the learning curve for junior engineers. While AI is very good at solving multi-dimensional problems, domain expertise, critical thinking, and sanity checks wil... » read more

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