Integration Hurdles For Analog And RF In Next-Gen Packages

By Gregory Haley - 23 May, 2024 - Comments: 0

A rapid increase in wireless connectivity and more sensors, coupled with a shift away from monolithic SoCs toward heterogeneous integration, is driving up the amount of analog/RF content in systems and changing the dynamics within a package. Since the early 2000s, the majority of chips used at the most advanced nodes were systems-on-chip (SoCs). All features had to fit into a single planar S... » read more

Reducing Risk In The Semiconductor Supply Chain

By Laura Peters - 23 May, 2024 - Comments: 0

Companies that were hit with chip shortages during the pandemic are changing their strategies to prevent future problems, deploying a combination of supply chain mapping, second sourcing, and digital transformation. Those shortages caused a $200 billion loss for automotive manufacturers, and the disruptions were far more widespread, in many cases lasting for years. Companies of all sorts wer... » read more

Sidestepping Lithography In Chip Manufacturing

By Katherine Derbyshire - 23 May, 2024 - Comments: 0

Rising lithography costs, shrinking feature sizes, and the need for an alternative to copper are collectively spurring new interest in area-selective deposition. An extension of atomic layer deposition, ASD seeks to build circuit features from the bottom up, without relying on lithography. Lithography will remain a critical tool for the foreseeable future. But it has long been the most expen... » read more

Veterans Could Close The Semi Industry’s Workforce Gap

By Liz Allan - 22 May, 2024 - Comments: 0

Veterans are beginning to form a valuable talent pool for advanced manufacturing and chip-sector positions, helping to fill the current and projected future gap in qualified workers as new fabs come online, and adding discipline and skills that are difficult to find otherwise. The job opportunities are many, and so are the possible job paths. In some cases, veterans are looking to make a qui... » read more

Chip Aging Becoming Key Factor In Data Center Economics

By Ann Mutschler - 20 May, 2024 - Comments: 1

Chip aging is becoming a much bigger concern inside of data centers, where it can impact server uptime, utilization rates, and the amount of energy needed to drive signals and cool entire server racks. Aging in chips is the result of both higher logic utilization and increasing transistor density. This is problematic for data centers, in general, but especially for AI chips where digital log... » read more

Will Domain-Specific ICs Become Ubiquitous?

By Brian Bailey - 16 May, 2024 - Comments: 0

Questions are surfacing for all types of design, ranging from small microcontrollers to leading-edge chips, over whether domain-specific design will become ubiquitous, or whether it will fall into the historic pattern of customization first, followed by lower-cost, general-purpose components. Custom hardware always has been a double-edged sword. It can provide a competitive edge for chipmake... » read more

Running More Efficient AI/ML Code With Neuromorphic Engines

By Karen Heyman - 16 May, 2024 - Comments: 0

Neuromorphic engineering is finally getting closer to market reality, propelled by the AI/ML-driven need for low-power, high-performance solutions. Whether current initiatives result in true neuromorphic devices, or whether devices will be inspired by neuromorphic concepts, remains to be seen. But academic and industry researchers continue to experiment in the hopes of achieving significant ... » read more

Power/Performance Costs In Chip Security

By Adam Kovac - 16 May, 2024 - Comments: 0

Hackers ranging from hobbyists to corporate spies and nation states are continually poking and prodding for weaknesses in data centers, cars, personal computers, and every other electronic device, resulting in a growing effort to build security into chips and electronic systems. The current estimate is that 60% of chips and systems have some type of security built in, and that percentage is ... » read more

Securing The World’s Data: A Looming Challenge

By Adam Kovac - 15 May, 2024 - Comments: 0

A combination of increasingly complex designs, more connected devices, and a mix of different generations of security technology are creating a whole new set of concerns about the safety of data nearly everywhere. While security experts have been warning of a growing threat in electronics for decades, there have been several recent fundamental changes that elevate the risk. Among them: ... » read more

Using Predictive Maintenance To Boost IC Manufacturing Efficiency

By Laura Peters - 14 May, 2024 - Comments: 0

Predicting exactly how and when a process tool is going to fail is a complex task, but it's getting a tad easier with the rollout of smart sensors, standard interfaces, and advanced data analytics. The potential benefits of predictive maintenance are enormous. Higher tool uptime correlates with greater fab efficiency and lower operating costs, so engineers are pursuing multiple routes to boo... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

category: Top Stories

category: IoT, Security & Automotive