category: Top Stories

category: IoT, Security & Automotive

Many More Hurdles In Heterogeneous Integration
By Laura Peters - 18 Jan, 2024 - Comments: 0

Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where many new and familiar problems need to be addressed. The industry’s first foray into fine-pitch multi-die packaging utilized silicon interposers with through-silicon vias (TSVs) to deliver s... » read more

Navigating Heat In Advanced Packaging
By Gregory Haley - 18 Jan, 2024 - Comments: 0

The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law and enhancing performance, power efficiency, and functionality, but it also is raising significant issues over how to manage the thermal load. Advanced packaging provides a way to pack more features and functions into a device, increasingly by stacking various components vertically rather than ... » read more

3D Integration Supports CIM Versatility And Accuracy
By Katherine Derbyshire - 18 Jan, 2024 - Comments: 0

Compute-in-memory (CIM) is gaining attention due to its efficiency in limiting the movement of massive volumes of data, but it's not perfect. CIM modules can help reduce the cost of computation for AI workloads, and they can learn from the highly efficient approaches taken by biological brains. When it comes to versatility, scalability, and accuracy, however, significant tradeoffs are requir... » read more

Which Data Works Best For Voltage Droop Simulation
By Ann Mutschler - 15 Jan, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the need for the right type of data, why this has to be done early in the design flow, and how 3D-IC will affect all of this, with Bill Mullen, distinguished engineer at Ansys; Rajat Chaudhry, product management group director at Cadence; Heidi Barnes, senior applications engineer at Keysight; Venkatesh Santhanagopalan, prod... » read more

Chip Industry Silos Are Crimping Advances
By Brian Bailey - 11 Jan, 2024 - Comments: 0

Change is never easy, but it is more difficult when it involves organizational restructuring. The pace of such restructuring has been increasing over the past decade, and often it is more difficult to incorporate than technological advancements. This is due to the siloed nature of the semiconductor industry, both within the industry itself, and its relationship to surrounding industries. Inc... » read more

Glitch Power Issues Grow At Advanced Nodes
By Ann Mutschler - 11 Jan, 2024 - Comments: 0

An estimated 20% to 40% of total power is being wasted due to glitch in some of the most advanced and complex chip designs, and at this point there is no single best approach for how and when to address it, and mixed information about how effective those solutions can be. Glitch power is not a new phenomenon. DSP architects and design engineers are well-versed in the power wasted by long, sl... » read more

The Future Of Memory
By Karen Heyman - 11 Jan, 2024 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to talk about the impact of off-chip memory on power and heat, and what can be done to optimize performance, with Frank Ferro, group director, product management at Cadence; Steven Woo, fellow and distinguished inventor at Rambus; Jongsin Yun, memory technologist at Siemens EDA; Randy White, memory solutions program manager at Keysight; a... » read more

Startup Funding: December 2023
By Jesse Allen - 10 Jan, 2024 - Comments: 0

Photonics and optics were strong in December, with investors funding two different companies using photonic technologies to develop AI chips and interconnects. Another key area — metaoptics — combines what traditionally would be separate lenses and optical components into a single, flat nanopatterned device. Metaoptics are being deployed in applications ranging from AI processing and sensor... » read more

Glass Substrates Gain Foothold In Advanced Packages
By Gregory Haley - 09 Jan, 2024 - Comments: 2

Glass substrates are starting to gain traction in advanced packages, fueled by the potential for denser routing and higher signal performance than the organic substrates used today. There are still plenty of problems to solve before this approach becomes mainstream. While glass itself is cheap and shares some important physical similarities to silicon, there are challenges with buildup, stre... » read more

Pressure Builds On Failure Analysis Labs
By Laura Peters - 09 Jan, 2024 - Comments: 0

Failure analysis labs are becoming more fab-like, offering higher accuracy in locating failures and accelerating time-to-market of new devices. These labs historically have been used for deconstructing devices that failed during field use, known as return material authorizations (RMAs), but their role is expanding. They now are becoming instrumental in achieving first silicon and ramping yie... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy