category: Top Stories

category: Auto, Security & Edge AI

Glass Substrates Gain Momentum
By Laura Peters - 18 Sep, 2025 - Comments: 1

As a package substrate, the benefits of glass are substantial. It's extremely flat with lower thermal expansion than organic substrates, which simplifies lithography. And that's just for starters. Warpage, a growing problem for multichip packages, is greatly reduced. Chips can be hybrid bonded to redistribution layer pads on glass. And relative to organic-core substrates, glass provides very... » read more

New Demands For IP Reuse
By Brian Bailey - 17 Sep, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the state of functional verification with Mohan Dhene, director for architecture and design at Alphawave Semi; Andy Nightingale, vice president for product management and marketing at Arteris; Dinesha Rao, senior group director for software engineering at Cadence; Chris Mueth, new opportunities business manager at Keysight;... » read more

New Antennas And Advanced ICs Needed For 6G
By Liz Allan - 15 Sep, 2025 - Comments: 1

6G is expected to bring data speeds that enable highly integrated and responsive technology in smartphones, homes, cities, and autonomous vehicles, but realizing that goal will require a lot more work. There will be many more antennas everywhere, embedded in infrastructure around town, in base stations, edge-devices, and everything in between. They will be sending and receiving many more sig... » read more

Balancing Workloads In AI Processor Designs
By Ann Mutschler - 11 Sep, 2025 - Comments: 0

A growing number of AI processors are being designed around specific workloads rather than standardized benchmarks, optimizing performance and power efficiency, but often with enough flexibility to adapt to future changes. While the fundamentals of matrix multiplication and software optimization still apply, those alone are no longer sufficient. Designs need to address specific data types, w... » read more

Coloring Optical Signals For More Bandwidth In Data Centers
By Bryon Moyer - 11 Sep, 2025 - Comments: 1

Copper cabling has been the workhorse for moving data inside of AI and HPC data centers, but fiber is nipping at its heels. Optics brings three possible bandwidth multipliers — wavelength-division multiplexing (WDM), the use of different modes, and polarization. Each has a role in longer-distance optical links, but the tradeoffs are different in the data center. WDM appears poised to boost... » read more

The Demise Of Static Timing Verification?
By Brian Bailey - 11 Sep, 2025 - Comments: 0

The chip industry traditionally has relied on margins to help them mitigate timing problems, but an increasing array of factors are now influencing timing. Can static timing analysis evolve to address these problems? Static timing verification (STA) was a cornerstone technology for the acceptance of the register transfer level (RTL) abstraction. It showed that functionality would not be impa... » read more

Making The Most of Test Resources
By Laura Peters - 09 Sep, 2025 - Comments: 0

Semiconductor testing is undergoing multiple paradigm changes at once with the common goals of producing more known good die per month with low test cost. Achieving these goals requires a delicate balance between yield, quality, and test times. There are multiple ways to go about making better use of existing resources, many of which involve an increasing use of design for test (DFT) methods... » read more

The Hidden Cost Of Contact Resistance
By Gregory Haley - 09 Sep, 2025 - Comments: 1

Contact resistance, or CRES, is one of those problems that most engineers prefer not to think about until it's staring them in the face. For years, it could be managed quietly with routine probe card cleaning or a scheduled socket swap. That approach worked well enough when pin counts were lower and devices pulled less current, but the ground has shifted since then. Today’s AI processors m... » read more

Infusing Trust Into The Supply Chain
By Anne Meixner - 09 Sep, 2025 - Comments: 0

An expanding supply chain of dies feeding multi-die products is prompting chipmakers to reassess and expand on ways to instill trust from end to end. This reaches deeper than just connecting disparate data. It requires integrating complex systems across vendors and protecting vendor data while instilling confidence in their customers and partners. Yet despite the time and effort that has bee... » read more

6G Line-Of-Sight Repeaters, Dots, And Reflections
By Liz Allan - 04 Sep, 2025 - Comments: 0

6G will open the door to ultra-reliable, low-latency communications, extended broadband, and machine communications, but its rapid signal attenuation places some sharp limits on where and how it can be used, and requires some expensive options to overcome those limitations. Applications include lifelike virtual reality for home and work use, highly interactive smart homes and cities, and aut... » read more

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