category: Top Stories

category: IoT, Security & Automotive

Inside The 5G Smartphone
By Mark LaPedus - 20 Aug, 2015 - Comments: 3

Amid a slowdown in the cell phone business, the market is heating up for perhaps the next big thing in wireless—5th generation mobile networks or 5G. In fact, major carriers, chipmakers and telecom equipment vendors are all rushing to get a piece of the action in 5G, which is the follow-on to the current wireless standard known as 4G or long-term evolution (LTE). Intel, Samsung and Qualcom... » read more

Challenges At Advanced Nodes
By Ed Sperling - 19 Aug, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss finFETs, 22nm FD-SOI and how the how the market will segment over the next few years with Marie Semeria, CEO of [getentity id="22192" e_name="Leti"]; Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Paul Boudre, CEO of Soitec; and Subramani Kengeri, vice president of global ... » read more

IIoT Comes To Chip Manufacturing
By Ed Sperling - 18 Aug, 2015 - Comments: 0

Nicholas Ward, director of marketing for the services group at Applied Materials, sat down with Semiconductor Engineering to talk about how data needs to be shared in semiconductor manufacturing and why it's so slow to happen in this industry. What follows are excerpts of that conversation. SE: Where are we with the [getkc id="76" kc_name="IoT"] and the [getkc id="78" kc_name="IIoT"]? War... » read more

Fundamental Shifts In Chip Business
By Ed Sperling - 17 Aug, 2015 - Comments: 3

Shifting business models, acquisitions, minority investments and increasing uncertainty are creating fundamental shifts in the semiconductor industry that could redefine who is successful in which markets for years to come. The announcement today that [getentity id="22671" e_name="Rambus"] is developing memory controller chips, expanding its business beyond just creating IP for the memory an... » read more

How Much Security Is Enough?
By Ed Sperling - 17 Aug, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss the current state of [getkc id="223" kc_name="security"] and what must be done in the future, with Denis Noël, head of cyber security solutions at [getentity id="22499" e_name="NXP"]; Serge Leef, vice president of new ventures at [getentity id="22017" e_name="Mentor Graphics"]; Andreas Kuehlman, senior vice president and general manager of the soft... » read more

Thermal Issues Getting Worse
By Ann Mutschler - 14 Aug, 2015 - Comments: 2

Making sure that smartphone you’re holding doesn’t burn your face when you make a call requires a tremendous amount of engineering effort at all levels of the design - the case, the chips, the packaging. The developers of the IP subsystems in that smartphone must adhere to very strict power and energy thresholds so the OEM putting it all together can stick to some semblance of a product des... » read more

DVFS On The Sidelines
By Brian Bailey - 13 Aug, 2015 - Comments: 2

Power reduction is one of the most important aspects of chip design these days, but not all power reduction techniques are used equally. Some that were once important are fading and dynamic voltage, and frequency scaling (DVFS) is one of them. What's changed, and will we see a resurgence in the future? What is it? DVFS has physics powerfully in its favor. As Vinod Viswanath, director of res... » read more

2.5D Creeps Into SoC Designs
By Ed Sperling - 13 Aug, 2015 - Comments: 0

A decade ago top chipmakers predicted that the next frontier for SoC architectures would be the z axis, adding a third dimension to improve throughput and performance, reduce congestion around memories, and reduce the amount of energy needed to drive signals. The obvious market for this was applications processors for mobile devices, and the first companies to jump on the stacked die bandwag... » read more

How Long Will FinFETs Last?
By Ann Mutschler - 13 Aug, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss how long FinFETs will last and where we will we go next with Vassilios Gerousis, Distinguished Engineer at [getentity id="22032" e_name="Cadence"]; Juan Rey, Sr. Director of Engineering for Calibre R&D at [getentity id="22017" e_name="Mentor Graphics"]; Kelvin Low, Senior Director Foundry Marketing at [getentity id="22865" e_name="Samsung"]; and Vic... » read more

Poised For Aspect-Oriented Design?
By Brian Bailey - 13 Aug, 2015 - Comments: 8

In 1992, [getperson id=" 11046 " comment="Yoav Hollander"] had the idea to take a software programming discipline called aspect-oriented programming (AOP) and apply it to the verification of hardware. Those concepts were incorporated into the [gettech id="31021" t_name="e"] language and [getentity id="22068" e_name="Verisity"] was formed to commercialize it. Hollander had seen that using obj... » read more

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