category: Top Stories

category: Auto, Security & Edge AI

GPUs Power Ahead
By Ann Mutschler - 05 Jul, 2016 - Comments: 0

GPUs, long a sideshow for CPUs, are suddenly the rising stars of the processor world. They are a first choice in everything from artificial intelligence systems to automotive ADAS applications and deep learning systems powered by [getkc id="261" kc_name="convolutional neural network"]. And they are still the mainstays of high-performance computing, gaming and scientific computation, to name ... » read more

Uncertainty Rocks Chip Market
By Ed Sperling - 30 Jun, 2016 - Comments: 1

The semiconductor industry is undergoing sweeping changes in every direction, making it far more difficult to figure out which path to take next, when to take it, and how to get there. The next few years will redefine which semiconductor companies emerge as leaders, which ones get pushed down or out or absorbed into other companies, and which markets will be the most lucrative. And that coul... » read more

Electrical-Mechanical Tool Flow Revisited
By Ann Mutschler - 30 Jun, 2016 - Comments: 0

For many years, the design tool industry has entertained the idea of combining both electrical and mechanical design into a single user experience, with a single database as a foundation. Major tool vendors, at least on the electrical side, have taken the matter seriously and confirm that activities towards a single flow have been considered, particularly as the [getkc id="7" kc_name="EDA"] ... » read more

Can Verification Meet In The Middle?
By Brian Bailey - 30 Jun, 2016 - Comments: 0

Since the dawn of time for the EDA industry, the classic V diagram has defined the primary design flow. On the left hand side of the V, the design is progressively refined and partitioned into smaller pieces. At the bottom of the V, verification takes over and as you travel up the right-hand side of the V, verification and integration happens until the entire design has been assembled and valid... » read more

Will Open-Source Work For Chips?
By Brian Bailey - 30 Jun, 2016 - Comments: 2

Open source is getting a second look by the semiconductor industry, driven by the high cost of design at complex nodes along with fragmentation in end markets, which increasingly means that one size or approach no longer fits all. The open source movement, as we know it today, started in the 1980s with the launch of the GNU project, which was about the time the electronic design automation (... » read more

Atomic Layer Etch Heats Up
By Mark LaPedus - 29 Jun, 2016 - Comments: 0

The atomic layer etch (ALE) market is starting to heat up as chipmakers push to 10nm and beyond. ALE is a promising next-generation etch technology that has been in R&D for the last several years, but until now there has been little or no need to use it. Unlike conventional etch tools, which remove materials on a continuous basis, ALE promises to selectively and precisely remove targete... » read more

Executive Insight: Grant Pierce
By Ed Sperling - 29 Jun, 2016 - Comments: 0

Grant Pierce, president and CEO of Sonics, sat down with Semiconductor Engineering to discuss new ways to increase energy efficiency in SoCs. What follows are excerpts of that conversation. SE: Looking out at the semiconductor industry there are a lot of changes underway right now. What are the biggest impacts from your perspective? Pierce: The amount of data that is being captured or sen... » read more

Interconnect Challenges Rising
By Mark LaPedus - 27 Jun, 2016 - Comments: 1

Chipmakers are ramping up their 14nm finFET processes, with 10nm and 7nm slated to ship possibly later this year or next. At 10nm and beyond, IC vendors are determined to scale the two main parts of the [getkc id="185" kc_name="finFET"] structure—the transistor and interconnects. Generally, transistor scaling will remain challenging at advanced nodes. And on top of that, the interconnects ... » read more

TSVs: Copper, Silicon, And CTE Mismatch
By Katherine Derbyshire - 23 Jun, 2016 - Comments: 3

As previous articles in this series have discussed, advanced packages introduce new materials and new reliability concerns. Diffusion into solder bumps can create brittle, high resistance, intermetallic compounds. Heat transfer through an interposer can degrade the lifetime of even cool, low power chips. Still, through-silicon vias are unique in that they cut directly through the integrated cir... » read more

Advanced Packaging Options, Issues
By Ed Sperling - 23 Jun, 2016 - Comments: 0

Systems in package are heading for the mass market in applications that demand better performance and lower power. As they do, new options for cutting costs are being developed to broaden the appeal of this approach as an alternative to shrinking features. Cost has been one of the big deterrents for widespread adoption of [getkc id="82" kc_name="2.5D"]. Initially, the almost universal compla... » read more

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