category: Top Stories

category: Auto, Security & Edge AI

Mixed-Signal/Low-Power Design
By Jeff Dorsch - 14 Jul, 2016 - Comments: 1

Semiconductor Engineering sat down to discuss mixed-signal/low-power IC design with Phil Matthews, director of engineering at Silicon Labs; Yanning Lu, director of analog IC design at Ambiq Micro; Krishna Balachandran, director of low power solutions marketing at [getentity id="22032" comment="Cadence"]; Geoffrey Ying, director of product marketing, AMS Group, [getentity id="22035" e_name="Syno... » read more

The Future Of Memory (Part 2)
By Ed Sperling - 13 Jul, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss future memory with Frank Ferro, senior director of product management for memory and interface IP at [getentity id="22671" e_name="Rambus"]; Marc Greenberg, director of product marketing at [getentity id="22035" e_name="Synopsys"]; and Lisa Minwell, [getentity id="22242" e_name="eSilicon"]'s senior director of IP marketing. What follows are excerpt... » read more

FD-SOI Strains For The Future
By Katherine Derbyshire - 11 Jul, 2016 - Comments: 0

One of the challenges facing supporters of FD-SOI is the need to provide a pathway to improved performance. While FD-SOI wafers offer some significant advantages over bulk silicon wafers, performance enhancements like strain and alternative channel materials are more difficult to implement in the thin SOI environment. On the other hand, once a fab is willing to incorporate layer transfer techni... » read more

E-beam Vs. Optical Inspection
By Mark LaPedus - 11 Jul, 2016 - Comments: 0

The wafer inspection business is heating up as chipmakers encounter new and tiny killer defects in advanced devices. Last month ASML Holding entered into an agreement to acquire Hermes Microvision (HMI), the world’s largest e-beam inspection vendor, for $3.1 billion. The proposed move propelled ASML into the e-beam wafer inspection market. In addition, [getentity id="22817" e_name="Appl... » read more

Rethinking The Sensor
By Ed Sperling - 07 Jul, 2016 - Comments: 0

Sensor technology is beginning to change on a fundamental level as companies begin looking beyond a human’s five senses, on which early sensors were modeled, to what can be done with those sensors for specific applications. In some cases, [getkc id="187" kc_name="sensors"] don’t have to be as accurate as the sight, smell, touch, taste and hearing of a person. In others, they can be a... » read more

Grappling With Auto Security
By Ann Mutschler - 07 Jul, 2016 - Comments: 1

It’s a changed world under the hood of automobiles today, as vehicles become increasingly connected to infrastructure and each other. But that connectedness also is creating new security risks. Growing complexity is one piece of the problem. There are upwards of 80 electronic control units (ECUs) and more than 100 million lines of code in an average vehicle. On top of that, there are m... » read more

Cars, Security, And HW-SW Co-Design
By Jeff Dorsch - 07 Jul, 2016 - Comments: 1

Semiconductor Engineering sat down to discuss parallel hardware/software design with Johannes Stahl, director of product marketing, prototyping and FPGA, [getentity id="22035" e_name="Synopsys"]; [getperson id="11411" comment="Bill Neifert"], director of models technology, [getentity id="22186" comment="ARM"]; Hemant Kumar, director of ASIC design, Nvidia; and Scott Constable, senior member of ... » read more

Securing Chips During Manufacturing
By Ed Sperling - 07 Jul, 2016 - Comments: 0

David Lam, chairman of Multibeam, sat down with Semiconductor Engineering to talk about how next-gen lithography tools can be used to prevent cyber attacks and counterfeiting of hardware. SE: How did you get into the anti-counterfeiting business? Lam: About three years ago we were working with some customers that were troubled by the counterfeiting problem. We became aware of that sense o... » read more

Verification Engine Disconnects
By Ed Sperling - 06 Jul, 2016 - Comments: 0

Moving verification data seamlessly between emulation, simulation, FPGA prototyping and formal verification engines may be possible on paper, but it is proving more difficult to implement in the real world. [getkc id="10" kc_name="Verification"] still consumes the most time and money in the design process. And while the amount of time spent on verification in complex designs has held relativ... » read more

Executive Insight: Raik Brinkmann
By Ed Sperling - 06 Jul, 2016 - Comments: 0

[getperson id="11306" comment="Raik Brinkmann"], president and CEO of [getentity id="22395" e_name="OneSpin Solutions"], sat down with Semiconductor Engineering to discuss where and why formal verification is gaining traction, and how it fits alongside other verification approaches. What follows are excerpts of that conversation. SE: [getkc id="33" kc_name="Formal"] has been around for a whi... » read more

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