category: Top Stories

category: Auto, Security & Edge AI

200mm Equipment Shortfall
By Mark LaPedus - 21 Jul, 2016 - Comments: 0

A surge in demand for consumer electronics, communications ICs, sensors and other products has created a shortage in 200mm fab capacity that shows no signs of abating. None of these chips need to be manufactured using the most advanced processes, and there have been enough tweaks to processes at established nodes to eke even more out of existing processes. But that has left chipmakers strugg... » read more

To 7nm And Beyond
By Ed Sperling - 21 Jul, 2016 - Comments: 4

Gary Patton, chief technology officer at [getentity id="22819" comment="GlobalFoundries"], and Thomas Caulfield, senior vice president and general manager of Fab 8, sat down with Semiconductor Engineering to discuss future directions in technology, including the next rev of FD-SOI, the future of Moore’s Law, and how some very public challenges will likely unfold. SE: What do you see as the... » read more

Building Faster Chips
By Ed Sperling - 21 Jul, 2016 - Comments: 5

By Ed Sperling and Jeff Dorsch An explosion in IoT sensor data, the onset of deep learning and AI, and the commercial rollout of augmented and virtual reality are driving a renewed interest in performance as the key metric for semiconductor design. Throughout the past decade in which mobility/smartphone dominated chip design, power replaced performance as the top driver. Processors ha... » read more

Stacking Logic On Logic
By Katherine Derbyshire - 21 Jul, 2016 - Comments: 0

Advanced packaging can be an alphabet soup of possible approaches, from heterogenous integration of multiple die types into a single package, to three-dimensional stacking of multiple dies on top of each other. Three-dimensional chip stacking is most commonly seen in memory devices. Applied to logic, though, there are at least two different ways for integration to proceed. Completely process... » read more

Executive Insight: Aart de Geus
By Ed Sperling - 20 Jul, 2016 - Comments: 0

Aart de Geus, chairman and co-CEO of Synopsys, sat down with Semiconductor Engineering to discuss Moore's Law, the IoT, inflection points and how chip design will evolve in coming years. SE: We are in the middle of possibly one of the biggest transition points we’ve ever seen in this industry. How do you envision things shaking out? De Geus: There is no question that there is an enormou... » read more

Can Verification Meet In The Middle?
By Brian Bailey - 20 Jul, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss these issues with; Stan Sokorac, senior principal design engineer for [getentity id="22186" comment="ARM"]; Frank Schirrmeister, senior group director for product marketing for the system development suite of [getentity id="22032" e_name="Cadence"]; Harry Foster, chief verification scientist at [getentity id="22017" e_name="Mentor Graphics"], Bernie... » read more

How Cache Coherency Impacts Power, Performance
By Ann Mutschler - 18 Jul, 2016 - Comments: 2

Managing how the processors in an SoC talk to one another is no small feat, because these chips often contain multiple processing units and caches. Bringing order to these communications is critical for improving performance and [getkc id="106" kc_name="reducing power"]. But it also requires a detailed understanding of how data moves, the interaction between hardware and software, and what c... » read more

SoC Power Grid Challenges
By Brian Bailey - 14 Jul, 2016 - Comments: 7

The consumption of power and dissipation of heat within large SoCs has received a lot of attention recently, but that is only part of the issue. Power also has to be reliably delivered onto and around the system. This is becoming increasingly difficult, and new nodes are adding to the list of challenges. "If we were building chips where there was only a single Vdd and Vss then it is not that... » read more

Implementation Limits Power Optimization
By Ann Mutschler - 14 Jul, 2016 - Comments: 3

Implementation is still the step that makes or breaks power budgets in chip design, despite improvements in power estimation, power simulations, and an increase in the number of power-related architectural decisions. The reason: All of those decisions must be carried throughout the design flow. “If implementation decides to give up, then it doesn't really matter at the end of the day,” s... » read more

No More Easy IP Money
By Brian Bailey - 14 Jul, 2016 - Comments: 2

The semiconductor intellectual property ([getkc id="43" kc_name="IP"]) industry is two decades old, but questions are still being asked about what's wrong with it and what needs to be fixed. Normally these kinds of issues are reserved for fast-moving, young industries, not one that is the backbone of semiconductors. Design reuse has become an indispensable part of the design of nearly all el... » read more

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